Extrinsic

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CPC
H01L2924/07811

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/07811Extrinsic

Industries

Patents Grantslast 30 patents

Information Patent Grant
Adhesive bonding composition and electronic components prepared fro...
- Patent number 11,901,331
- Issue date Feb 13, 2024
- Immunolight, LLC
- Zakaryae Fathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and measurement device
- Patent number 11,854,952
- Issue date Dec 26, 2023
- Lapis Semiconductor Co., Ltd.
- Toshihisa Sone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connectors for making connections between analyte sensors and other...
- Patent number 11,806,141
- Issue date Nov 7, 2023
- Abbott Diabetes Care Inc.
- Mohammad E. Moein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,792,941
- Issue date Oct 17, 2023
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device with improved flexural resistance and electri...
- Patent number 11,784,290
- Issue date Oct 10, 2023
- Nichia Corporation
- Keiichi Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filler disposition film
- Patent number 11,732,105
- Issue date Aug 22, 2023
- Dexerials Corporation
- Yasushi Akutsu
- B32 - LAYERED PRODUCTS
Information Patent Grant
Anisotropic conductive film and display device using the same
- Patent number 11,683,963
- Issue date Jun 20, 2023
- SAMSUNG DISPLAY CO., LTD.
- Chungseok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module package and method of manufacturing the same
- Patent number 11,615,967
- Issue date Mar 28, 2023
- Semiconductor Components Industries, LLC
- Keunhyuk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Decoupling capacitor mounted on an integrated circuit die, and meth...
- Patent number 11,562,978
- Issue date Jan 24, 2023
- Intel Corporation
- Florence R. Pon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connectors for making connections between analyte sensors and other...
- Patent number 11,471,080
- Issue date Oct 18, 2022
- Abbott Diabetes Care Inc.
- Mohammad E. Moein
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Method of making flexible semiconductor device with graphene tape
- Patent number 11,456,188
- Issue date Sep 27, 2022
- NXP USA, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging photon building blocks with top side connections and inte...
- Patent number 11,411,152
- Issue date Aug 9, 2022
- Bridgelux, Inc.
- R. Scott West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connectors for making connections between analyte sensors and other...
- Patent number 11,382,542
- Issue date Jul 12, 2022
- Abbott Diabetes Care Inc.
- Mohammad E. Moein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an oscillator and an associated integra...
- Patent number 11,309,234
- Issue date Apr 19, 2022
- Lapis Semiconductor Co., Ltd.
- Toshihisa Sone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive bonding composition and electronic components prepared fro...
- Patent number 11,270,973
- Issue date Mar 8, 2022
- Immunolight, LLC
- Zakaryae Fathi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Connectors for making connections between analyte sensors and other...
- Patent number 11,234,622
- Issue date Feb 1, 2022
- Abbott Diabetes Care Inc.
- Mohammad E. Moein
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Film-like adhesive and method for producing semiconductor package u...
- Patent number 11,139,261
- Issue date Oct 5, 2021
- Furukawa Electric Co., Ltd.
- Minoru Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,134,572
- Issue date Sep 28, 2021
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module package
- Patent number 11,004,698
- Issue date May 11, 2021
- Semiconductor Components Industries, LLC
- Keunhyuk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connectors for making connections between analyte sensors and other...
- Patent number 10,888,257
- Issue date Jan 12, 2021
- Abbott Diabetes Care Inc.
- Mohammad E. Moein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging photon building blocks with top side connections and inte...
- Patent number 10,840,424
- Issue date Nov 17, 2020
- Bridgelux, Inc.
- R. Scott West
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and apparatus for a semiconductor device having bi-material...
- Patent number 10,784,188
- Issue date Sep 22, 2020
- Texas Instruments Incorporated
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive bonding composition and electronic components prepared fro...
- Patent number 10,748,868
- Issue date Aug 18, 2020
- Immunolight, LLC
- Zakaryae Fathi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Flexible semiconductor device with graphene tape
- Patent number 10,692,802
- Issue date Jun 23, 2020
- NXP USA, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally and electrically conductive adhesive composition
- Patent number 10,633,564
- Issue date Apr 28, 2020
- Tanaka Kikinzoku Kogyo K.K.
- Shintaro Abe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for manufacturing light emitting device
- Patent number 10,626,301
- Issue date Apr 21, 2020
- Dexerials Corporation
- Norio Umetsu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Stacked chip-on-board module with edge connector
- Patent number 10,622,289
- Issue date Apr 14, 2020
- Tessera, Inc.
- Wael Zohni
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and measurement device
- Patent number 10,615,108
- Issue date Apr 7, 2020
- Lapis Semiconductor Co., Ltd.
- Toshihisa Sone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic elements with post-assembly planarization
- Patent number 10,559,494
- Issue date Feb 11, 2020
- Tessera, Inc.
- Vage Oganesian
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Logic die and other components embedded in build-up layers
- Patent number 10,453,799
- Issue date Oct 22, 2019
- Intel Corporation
- Deepak V. Kulkarni
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONNECTORS FOR MAKING CONNECTIONS BETWEEN ANALYTE SENSORS AND OTHER...
- Publication number 20240090801
- Publication date Mar 21, 2024
- Abbott Diabetes Care Inc.
- Mohammad E. Moein
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
CONDUCTIVE ADHESIVE ASSEMBLY FOR SEMICONDUCTOR DIE ATTACHMENT
- Publication number 20240063165
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Ramesh NALLAVELLI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT
- Publication number 20230361076
- Publication date Nov 9, 2023
- INFINEON TECHNOLOGIES AG
- Hermann Bechert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTORS FOR MAKING CONNECTIONS BETWEEN ANALYTE SENSORS AND OTHER...
- Publication number 20230000400
- Publication date Jan 5, 2023
- Abbott Diabetes Care Inc.
- Mohammad E. Moein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE BONDING COMPOSITION AND ELECTRONIC COMPONENTS PREPARED FRO...
- Publication number 20220181292
- Publication date Jun 9, 2022
- Immunolight, LLC
- Zakaryae FATHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTORS FOR MAKING CONNECTIONS BETWEEN ANALYTE SENSORS AND OTHER...
- Publication number 20210345914
- Publication date Nov 11, 2021
- Abbott Diabetes Care Inc.
- Mohammad E. Moein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTORS FOR MAKING CONNECTIONS BETWEEN ANALYTE SENSORS AND OTHER...
- Publication number 20210128027
- Publication date May 6, 2021
- Abbott Diabetes Care Inc.
- Mohammad E. Moein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE BONDING COMPOSITION AND ELECTRONIC COMPONENTS PREPARED FRO...
- Publication number 20210035946
- Publication date Feb 4, 2021
- Immunolight, LLC
- Zakaryae FATHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
FLEXIBLE SEMICONDUCTOR DEVICE WITH GRAPHENE TAPE
- Publication number 20200312751
- Publication date Oct 1, 2020
- NXP USA, Inc.
- YOU GE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE WITH IMPROVED FLEXURAL RESISTANCE AND ELECTRI...
- Publication number 20200251630
- Publication date Aug 6, 2020
- TOSHIBA HOKUTO ELECTRONICS CORPORATION
- Keiichi MAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Attach Methods and Semiconductor Devices Manufactured based on...
- Publication number 20190348347
- Publication date Nov 14, 2019
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus for a Semiconductor Device Having Bi-Material...
- Publication number 20190304881
- Publication date Oct 3, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM-LIKE ADHESIVE AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE U...
- Publication number 20190181113
- Publication date Jun 13, 2019
- FURUKAWA ELECTRIC CO., LTD.
- Minoru MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE USING THE SAME
- Publication number 20190148478
- Publication date May 16, 2019
- SAMSUNG DISPLAY CO., LTD.
- Chungseok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE BONDING COMPOSITION AND ELECTRONIC COMPONENTS PREPARED FRO...
- Publication number 20180358327
- Publication date Dec 13, 2018
- Immunolight, LLC
- Zakaryae FATHI
- B32 - LAYERED PRODUCTS
Information Patent Application
ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING DIE BONDING FILM
- Publication number 20180294242
- Publication date Oct 11, 2018
- FURUKAWA ELECTRIC CO., LTD.
- Naoaki MIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ELEMENTS WITH POST-ASSEMBLY PLANARIZATION
- Publication number 20180254213
- Publication date Sep 6, 2018
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM, METHOD FOR PRODUCING ANISOTROPIC CONDU...
- Publication number 20180218994
- Publication date Aug 2, 2018
- DEXERIALS CORPORATION
- Kouichi SATO
- B32 - LAYERED PRODUCTS
Information Patent Application
STAGED VIA FORMATION FROM BOTH SIDES OF CHIP
- Publication number 20180114743
- Publication date Apr 26, 2018
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ELECTRONIC COMPONENTS AND METHODS OF FORMATION THEREOF
- Publication number 20180082923
- Publication date Mar 22, 2018
- Nuvotronics, INC
- Jean-Marc Rollin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE ADHESIVE FILM STRUCTURES
- Publication number 20180082971
- Publication date Mar 22, 2018
- Apple Inc.
- Wei LIN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
LIGHT-EMITTING DEVICE WITH IMPROVED FLEXURAL RESISTANCE AND ELECTRI...
- Publication number 20180076364
- Publication date Mar 15, 2018
- TOSHIBA HOKUTO ELECTRONICS CORPORATION
- Keiichi MAKI
- B32 - LAYERED PRODUCTS
Information Patent Application
ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING DIE BONDING FILM
- Publication number 20180026003
- Publication date Jan 25, 2018
- FURUKAWA ELECTRIC CO., LTD.
- Naoaki MIHARA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ELECTRONIC PART EMBEDDED SUBSTRATE AND METHOD OF PRODUCING AN ELECT...
- Publication number 20170365559
- Publication date Dec 21, 2017
- Shinko Electric Industries Co., Ltd.
- Takaharu YAMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE USING THE SAME
- Publication number 20170352716
- Publication date Dec 7, 2017
- SAMSUNG DISPLAY CO., LTD.
- Chungseok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CHIP-ON-BOARD MODULE WITH EDGE CONNECTOR
- Publication number 20170263540
- Publication date Sep 14, 2017
- Tessera, Inc.
- Wael Zohni
- G11 - INFORMATION STORAGE
Information Patent Application
MICROELECTRONIC ELEMENTS WITH POST-ASSEMBLY PLANARIZATION
- Publication number 20170256443
- Publication date Sep 7, 2017
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW STRESS VIAS
- Publication number 20170250132
- Publication date Aug 31, 2017
- Tessera, Inc.
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY AND ELECTRICALLY CONDUCTIVE ADHESIVE COMPOSITION
- Publication number 20170210951
- Publication date Jul 27, 2017
- Tanaka Kikinzoku Kogyo K.K.
- Shintaro ABE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DISPLAY DEVICE USING SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD...
- Publication number 20170170152
- Publication date Jun 15, 2017
- LG ELECTRONICS INC.
- Kyoungtae WI
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Adhesive bonding composition and electronic components prepared fro...

Semiconductor device and measurement device

Connectors for making connections between analyte sensors and other...

Circuit board structure and method for manufacturing a circuit boar...

Light-emitting device with improved flexural resistance and electri...

Filler disposition film

Anisotropic conductive film and display device using the same

Power module package and method of manufacturing the same

Decoupling capacitor mounted on an integrated circuit die, and meth...

Connectors for making connections between analyte sensors and other...

Method of making flexible semiconductor device with graphene tape

Packaging photon building blocks with top side connections and inte...

Connectors for making connections between analyte sensors and other...

Semiconductor device having an oscillator and an associated integra...

Adhesive bonding composition and electronic components prepared fro...

Connectors for making connections between analyte sensors and other...

Film-like adhesive and method for producing semiconductor package u...

Circuit board structure and method for manufacturing a circuit boar...

Power module package

Connectors for making connections between analyte sensors and other...

Packaging photon building blocks with top side connections and inte...

Methods and apparatus for a semiconductor device having bi-material...

Adhesive bonding composition and electronic components prepared fro...

Flexible semiconductor device with graphene tape

Thermally and electrically conductive adhesive composition

Method for manufacturing light emitting device

Stacked chip-on-board module with edge connector

Semiconductor device and measurement device

Microelectronic elements with post-assembly planarization

Logic die and other components embedded in build-up layers

Patents Applicationslast 30 patents

CONNECTORS FOR MAKING CONNECTIONS BETWEEN ANALYTE SENSORS AND OTHER...

CONDUCTIVE ADHESIVE ASSEMBLY FOR SEMICONDUCTOR DIE ATTACHMENT

CHIP ARRANGEMENT

CONNECTORS FOR MAKING CONNECTIONS BETWEEN ANALYTE SENSORS AND OTHER...

ADHESIVE BONDING COMPOSITION AND ELECTRONIC COMPONENTS PREPARED FRO...

CONNECTORS FOR MAKING CONNECTIONS BETWEEN ANALYTE SENSORS AND OTHER...

CONNECTORS FOR MAKING CONNECTIONS BETWEEN ANALYTE SENSORS AND OTHER...

ADHESIVE BONDING COMPOSITION AND ELECTRONIC COMPONENTS PREPARED FRO...

FLEXIBLE SEMICONDUCTOR DEVICE WITH GRAPHENE TAPE

LIGHT-EMITTING DEVICE WITH IMPROVED FLEXURAL RESISTANCE AND ELECTRI...

Die Attach Methods and Semiconductor Devices Manufactured based on...

Methods and Apparatus for a Semiconductor Device Having Bi-Material...

FILM-LIKE ADHESIVE AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE U...

ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE USING THE SAME

ADHESIVE BONDING COMPOSITION AND ELECTRONIC COMPONENTS PREPARED FRO...

ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING DIE BONDING FILM

MICROELECTRONIC ELEMENTS WITH POST-ASSEMBLY PLANARIZATION

ANISOTROPIC CONDUCTIVE FILM, METHOD FOR PRODUCING ANISOTROPIC CONDU...

STAGED VIA FORMATION FROM BOTH SIDES OF CHIP

INTEGRATED ELECTRONIC COMPONENTS AND METHODS OF FORMATION THEREOF

CONDUCTIVE ADHESIVE FILM STRUCTURES

LIGHT-EMITTING DEVICE WITH IMPROVED FLEXURAL RESISTANCE AND ELECTRI...

ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING DIE BONDING FILM

ELECTRONIC PART EMBEDDED SUBSTRATE AND METHOD OF PRODUCING AN ELECT...

ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE USING THE SAME

STACKED CHIP-ON-BOARD MODULE WITH EDGE CONNECTOR

MICROELECTRONIC ELEMENTS WITH POST-ASSEMBLY PLANARIZATION

LOW STRESS VIAS

THERMALLY AND ELECTRICALLY CONDUCTIVE ADHESIVE COMPOSITION

DISPLAY DEVICE USING SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD...