Fan-in arrangement

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H01L2224/02377

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/02377Fan-in arrangement

Industries

Patents Grantslast 30 patents

Information Patent Grant
Package having an electronic component and an encapsulant encapsula...
- Patent number 12,112,992
- Issue date Oct 8, 2024
- Infineon Technologies AG
- Daniel Porwol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method to minimize stress on stack via
- Patent number 12,080,600
- Issue date Sep 3, 2024
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,057,362
- Issue date Aug 6, 2024
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer metallic structure and method
- Patent number 12,040,293
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih Wei Bih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and method of manufacturing the same
- Patent number 12,027,469
- Issue date Jul 2, 2024
- Advanced Semiconductor Engineering, Inc.
- En Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuits with redistribution lines
- Patent number 11,923,338
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna module
- Patent number 11,909,099
- Issue date Feb 20, 2024
- Samsung Electronics Co., Ltd.
- Won Wook So
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device including cutting a mo...
- Patent number 11,887,907
- Issue date Jan 30, 2024
- Samsung Electronics Co., Ltd.
- Wonyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale package structure and method of forming the same
- Patent number 11,854,784
- Issue date Dec 26, 2023
- Mediatek Inc.
- Yen-Yao Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip semiconductor package
- Patent number 11,848,319
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package module
- Patent number 11,842,950
- Issue date Dec 12, 2023
- Samsung Electronics Co., Ltd.
- Yongjin Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and method for manufacturing the same
- Patent number 11,837,566
- Issue date Dec 5, 2023
- Advanced Semiconductor Engineering, Inc.
- Mei-Ju Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 11,837,537
- Issue date Dec 5, 2023
- Samsung Electronics Co., Ltd.
- Bongju Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,798,860
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device manufacturing method
- Patent number 11,705,415
- Issue date Jul 18, 2023
- Lapis Semiconductor Co., Ltd.
- Taiichi Ogumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making wafer level chip scale pa...
- Patent number 11,676,938
- Issue date Jun 13, 2023
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Ming-Che Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,676,977
- Issue date Jun 13, 2023
- Sony Group Corporation
- Yoshihiro Nabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,652,066
- Issue date May 16, 2023
- Samsung Electronics Co., Ltd.
- Dongjoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside metalization with through-wafer-via processing to allow us...
- Patent number 11,652,079
- Issue date May 16, 2023
- Skyworks Solutions, Inc.
- Bharatjeet Singh Gill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method of semiconductor pac...
- Patent number 11,646,296
- Issue date May 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component with semiconductor die having a low ohmic port...
- Patent number 11,605,572
- Issue date Mar 14, 2023
- Infineon Technologies AG
- Daniel Porwol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,545,451
- Issue date Jan 3, 2023
- Nepes Co., Ltd.
- Hyun Sik Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising semiconductor die and interposer an...
- Patent number 11,527,496
- Issue date Dec 13, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,508,681
- Issue date Nov 22, 2022
- Samsung Electronics Co., Ltd.
- Soojae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer metallic structure and method
- Patent number 11,502,050
- Issue date Nov 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih Wei Bih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip semiconductor package
- Patent number 11,495,590
- Issue date Nov 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,476,211
- Issue date Oct 18, 2022
- Nepes Co., Ltd.
- Jun Kyu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of chip package
- Patent number 11,476,293
- Issue date Oct 18, 2022
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including frame in which semiconductor chip i...
- Patent number 11,462,498
- Issue date Oct 4, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yong Jin Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with through-package interconnect and...
- Patent number 11,456,286
- Issue date Sep 27, 2022
- Micron Technology, Inc.
- Chan Yoo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240355763
- Publication date Oct 24, 2024
- Advanced Semiconductor Engineering, Inc.
- En Hao HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INTEGRATED CIRCUITS WITH REDISTRIBUTION LINES
- Publication number 20240170457
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240113061
- Publication date Apr 4, 2024
- Advanced Semiconductor Engineering, Inc.
- Mei-Ju LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230223365
- Publication date Jul 13, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230115954
- Publication date Apr 13, 2023
- Advanced Semiconductor Engineering, Inc.
- En Hao HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20230073399
- Publication date Mar 9, 2023
- MEDIATEK INC.
- Yen-Yao Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution Layer Metallic Structure and Method
- Publication number 20230072507
- Publication date Mar 9, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Shih Wei BIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND...
- Publication number 20230020689
- Publication date Jan 19, 2023
- Micron Technology, Inc.
- Chan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Chip Semiconductor Package
- Publication number 20220384411
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20220328373
- Publication date Oct 13, 2022
- Samsung Electronics Co., Ltd.
- Wonyoung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE MODULE
- Publication number 20220246506
- Publication date Aug 4, 2022
- Samsung Electronics Co., Ltd.
- Yongjin PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220231061
- Publication date Jul 21, 2022
- SONY GROUP CORPORATION
- Yoshihiro Nabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220084972
- Publication date Mar 17, 2022
- Advanced Semiconductor Engineering, Inc.
- Mei-Ju LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA MODULE
- Publication number 20220059926
- Publication date Feb 24, 2022
- Samsung Electronics Co., Ltd.
- Won Wook So
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210398913
- Publication date Dec 23, 2021
- Samsung Electronics Co., Ltd.
- Dongjoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20210375757
- Publication date Dec 2, 2021
- Samsung Electronics Co., Ltd.
- Bongju Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE METALIZATION WITH THROUGH-WAFER-VIA PROCESSING TO ALLOW US...
- Publication number 20210366868
- Publication date Nov 25, 2021
- Skyworks Solutions, Inc.
- Bharatjeet Singh Gill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210313245
- Publication date Oct 7, 2021
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210305116
- Publication date Sep 30, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- PEI-HAW TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDCUTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDCUTOR PAC...
- Publication number 20210305212
- Publication date Sep 30, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210288005
- Publication date Sep 16, 2021
- NEPES CO., LTD.
- Hyun Sik KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20210280543
- Publication date Sep 9, 2021
- LAPIS SEMICONDUCTOR CO., LTD.
- TAIICHI OGUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20210249323
- Publication date Aug 12, 2021
- Samsung Electronics Co., Ltd.
- Wonyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210193602
- Publication date Jun 24, 2021
- NEPES CO., LTD.
- Jun Kyu LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution Layer Metallic Structure and Method
- Publication number 20210159196
- Publication date May 27, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Shih Wei BIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210134751
- Publication date May 6, 2021
- Advanced Semiconductor Engineering, Inc.
- Mei-Ju LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Chip Semiconductor Package
- Publication number 20210091059
- Publication date Mar 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF CHIP PACKAGE
- Publication number 20210066379
- Publication date Mar 4, 2021
- XINTEC INC.
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20210043592
- Publication date Feb 11, 2021
- Samsung Electronics Co., Ltd.
- Soojae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200411461
- Publication date Dec 31, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Yun Tae LEE
- H01 - BASIC ELECTRIC ELEMENTS

Fan-in arrangement

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package having an electronic component and an encapsulant encapsula...

Semiconductor device and method to minimize stress on stack via

Semiconductor device and method for manufacturing semiconductor device

Redistribution layer metallic structure and method

Electronic device package and method of manufacturing the same

Stacked integrated circuits with redistribution lines

Antenna module

Method of manufacturing semiconductor device including cutting a mo...

Chip scale package structure and method of forming the same

Multi-chip semiconductor package

Package module

Electronic device package and method for manufacturing the same

Fan-out semiconductor package

Semiconductor structure and manufacturing method thereof

Semiconductor device and semiconductor device manufacturing method

Semiconductor device and method of making wafer level chip scale pa...

Semiconductor device

Semiconductor package

Backside metalization with through-wafer-via processing to allow us...

Semiconductor package and manufacturing method of semiconductor pac...

Electronic component with semiconductor die having a low ohmic port...

Semiconductor package

Semiconductor device comprising semiconductor die and interposer an...

Semiconductor package and method of fabricating the same

Redistribution layer metallic structure and method

Multi-chip semiconductor package

Semiconductor package and manufacturing method thereof

Manufacturing method of chip package

Semiconductor package including frame in which semiconductor chip i...

Semiconductor device assembly with through-package interconnect and...

Patents Applicationslast 30 patents

ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

STACKED INTEGRATED CIRCUITS WITH REDISTRIBUTION LINES

ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

CHIP SCALE PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

Redistribution Layer Metallic Structure and Method

SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND...

Multi-Chip Semiconductor Package

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

PACKAGE MODULE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

ANTENNA MODULE

SEMICONDUCTOR PACKAGE

FAN-OUT SEMICONDUCTOR PACKAGE

BACKSIDE METALIZATION WITH THROUGH-WAFER-VIA PROCESSING TO ALLOW US...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDCUTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDCUTOR PAC...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Redistribution Layer Metallic Structure and Method

ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Multi-Chip Semiconductor Package

MANUFACTURING METHOD OF CHIP PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE