Feeding, loading or unloading work specially adapted to lapping

Industry

CPC
B24B37/345

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B24Grinding technology B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS B24B37/00Lapping machines or devices Accessories

Current Industry

B24B37/345Feeding, loading or unloading work specially adapted to lapping

Industries

Patents Grantslast 30 patents

Information Patent Grant
High throughput polishing modules and modular polishing systems
- Patent number 12,308,272
- Issue date May 20, 2025
- Applied Materials, Inc.
- Jagan Rangarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automatic abrasion compensation system of lower plate and wafer lap...
- Patent number 12,285,841
- Issue date Apr 29, 2025
- SK SILTRON CO., LTD.
- Jae Pyo Lee
- B24 - GRINDING POLISHING
Information Patent Grant
Integrated machine for automatic cutting, polishing, stacking and u...
- Patent number 12,275,083
- Issue date Apr 15, 2025
- SOUTHWEST PETROLEUM UNIVERSITY
- Yang Tang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chemical mechanical planarization equipment, wafer transfer method,...
- Patent number 12,251,785
- Issue date Mar 18, 2025
- HANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC.
- EdwardLiCang Lee
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing and loading/unloading component module
- Patent number 12,194,592
- Issue date Jan 14, 2025
- HANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC.
- Linghan Shen
- B24 - GRINDING POLISHING
Information Patent Grant
Method of transferring semiconductor wafer to polishing apparatus a...
- Patent number 12,179,308
- Issue date Dec 31, 2024
- Sumco Corporation
- Ryoya Terakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Channel cut polishing machine
- Patent number 12,134,164
- Issue date Nov 5, 2024
- UChicago Argonne, LLC
- Elina Kasman
- B24 - GRINDING POLISHING
Information Patent Grant
Automated dry-in dry-out dual side polishing of silicon substrates...
- Patent number 12,094,740
- Issue date Sep 17, 2024
- Applied Materials, Inc.
- Manoj A. Gajendra
- B08 - CLEANING
Information Patent Grant
Processing method of workpiece
- Patent number 12,064,847
- Issue date Aug 20, 2024
- Disco Corporation
- Yoshikazu Suzuki
- B24 - GRINDING POLISHING
Information Patent Grant
Cleaning module, substrate processing apparatus including cleaning...
- Patent number 12,033,847
- Issue date Jul 9, 2024
- Ebara Corporation
- Toshio Mizuno
- B24 - GRINDING POLISHING
Information Patent Grant
CMP wafer cleaning equipment, wafer transfer robot and wafer flippi...
- Patent number 11,908,720
- Issue date Feb 20, 2024
- HANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC.
- Linghan Shen
- B08 - CLEANING
Information Patent Grant
Cover to vacuum debris while grinding
- Patent number 11,872,669
- Issue date Jan 16, 2024
- Disco Corporation
- Toshiyuki Moriya
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing device
- Patent number 11,869,788
- Issue date Jan 9, 2024
- Ebara Corporation
- Koji Maeda
- B08 - CLEANING
Information Patent Grant
Workpiece processing apparatus including a resin coater and a resin...
- Patent number 11,819,975
- Issue date Nov 21, 2023
- Disco Corporation
- Shinya Watanabe
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Method of manufacturing wafer holder
- Patent number 11,759,910
- Issue date Sep 19, 2023
- P.R. Hoffman Machine Products, Inc.
- David Melville Hutton
- B24 - GRINDING POLISHING
Information Patent Grant
Rotor polishing device
- Patent number 11,712,776
- Issue date Aug 1, 2023
- Terry Sullivan
- B24 - GRINDING POLISHING
Information Patent Grant
Grinding apparatus
- Patent number 11,654,525
- Issue date May 23, 2023
- Disco Corporation
- Jiro Genozono
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing-pad laminated structure, polishing-pad positioning instru...
- Patent number 11,642,753
- Issue date May 9, 2023
- Ebara Corporation
- Toshikazu Nomura
- B24 - GRINDING POLISHING
Information Patent Grant
Workpiece processing and resin grinding apparatus
- Patent number 11,574,804
- Issue date Feb 7, 2023
- Disco Corporation
- Shinya Watanabe
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Method and apparatus for polishing a substrate
- Patent number 11,548,113
- Issue date Jan 10, 2023
- Ebara Corporation
- Makoto Fukushima
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus, substrate processing method, substr...
- Patent number 11,426,834
- Issue date Aug 30, 2022
- Ebara Corporation
- Mitsuru Miyazaki
- B24 - GRINDING POLISHING
Information Patent Grant
Device and method for processing brake linings mounted on carriers
- Patent number 11,305,396
- Issue date Apr 19, 2022
- Erlmann GmbH & Co. KG
- Gerd Schorn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High throughput polishing system for workpieces
- Patent number 11,267,095
- Issue date Mar 8, 2022
- UTICA LEASECO, LLC
- Stephen M. Fisher
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus
- Patent number 11,173,523
- Issue date Nov 16, 2021
- Ebara Corporation
- Hidetatsu Isokawa
- B08 - CLEANING
Information Patent Grant
Substrate polishing system and substrate polishing method
- Patent number 11,148,247
- Issue date Oct 19, 2021
- Samsung Display Co., Ltd.
- Hyun Jin Cho
- B24 - GRINDING POLISHING
Information Patent Grant
Load cup and chemical mechanical polishing apparatus and method of...
- Patent number 11,027,394
- Issue date Jun 8, 2021
- Samsung Electronics Co., Ltd.
- Jieun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and method for detecting abnormality...
- Patent number 10,903,101
- Issue date Jan 26, 2021
- Ebara Corporation
- Mitsunori Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for chemical-mechanical polishing
- Patent number 10,857,646
- Issue date Dec 8, 2020
- Tsinghua University
- Zhenjie Xu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate treatment device providing improved detachment mechanism...
- Patent number 10,840,123
- Issue date Nov 17, 2020
- Samsung Display Co., Ltd.
- Heungyeol Na
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer centering device for measurement apparatus
- Patent number 10,818,533
- Issue date Oct 27, 2020
- COMET CO., LTD.
- Gyu-Seong Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE TREATING APPARATUS
- Publication number 20250149358
- Publication date May 8, 2025
- SCREEN Holdings Co., Ltd.
- Hiroaki ISHII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, AND ABNORMALITY DETERMINATION METHOD
- Publication number 20250073841
- Publication date Mar 6, 2025
- EBARA CORPORATION
- Yoshimasa OZONE
- B24 - GRINDING POLISHING
Information Patent Application
INTEGRATED MACHINE FOR AUTOMATIC CUTTING, POLISHING, STACKING AND U...
- Publication number 20250073808
- Publication date Mar 6, 2025
- SOUTHWEST PETROLEUM UNIVERSITY
- Yang TANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE FOR MEASURING WAFER POLISHING AMOUNT, AND MEASUREMENT METHOD...
- Publication number 20250041988
- Publication date Feb 6, 2025
- SK SILTRON CO., LTD.
- Sangho LEE
- B24 - GRINDING POLISHING
Information Patent Application
WAFER POLISHING SYSTEM
- Publication number 20240367283
- Publication date Nov 7, 2024
- HANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC.
- Xiaoyu XU
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING METHOD AND POLISHING APPARATUS
- Publication number 20240367282
- Publication date Nov 7, 2024
- EBARA CORPORATION
- Hisashi SARUWATARI
- B24 - GRINDING POLISHING
Information Patent Application
DETERMINING THE ORIENTATION OF A SUBSTRATE IN-SITU
- Publication number 20240359291
- Publication date Oct 31, 2024
- Applied Materials, Inc.
- Wei LU
- B24 - GRINDING POLISHING
Information Patent Application
CLEANING MEMBER ATTACHING PART, CLEANING MEMBER ASSEMBLY AND SUBSTR...
- Publication number 20230356267
- Publication date Nov 9, 2023
- EBARA CORPORATION
- Shuji UOZUMI
- B08 - CLEANING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND PROCESSING METHOD
- Publication number 20230352326
- Publication date Nov 2, 2023
- EBARA CORPORATION
- Kuniaki YAMAGUCHI
- B24 - GRINDING POLISHING
Information Patent Application
AUTOMATIC ABRASION COMPENSATION SYSTEM OF LOWER PLATE AND WAFER LAP...
- Publication number 20230211457
- Publication date Jul 6, 2023
- SK SILTRON CO., LTD.
- Jae Pyo LEE
- B24 - GRINDING POLISHING
Information Patent Application
WAFER CONVEYING DEVICE, CHEMICAL MECHANICAL PLANARIZATION APPARATUS...
- Publication number 20230201995
- Publication date Jun 29, 2023
- HANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC.
- Yuansi YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF TRANSFERRING SEMICONDUCTOR WAFER TO POLISHING APPARATUS A...
- Publication number 20230033545
- Publication date Feb 2, 2023
- SUMCO CORPORATION
- Ryoya TERAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD OF WORKPIECE
- Publication number 20220324082
- Publication date Oct 13, 2022
- Disco Corporation
- Yoshikazu SUZUKI
- B24 - GRINDING POLISHING
Information Patent Application
AUTOMATED DRY-IN DRY-OUT DUAL SIDE POLISHING OF SILICON SUBSTRATES...
- Publication number 20220310424
- Publication date Sep 29, 2022
- Applied Materials, Inc.
- Manoj A. GAJENDRA
- B08 - CLEANING
Information Patent Application
SUBSTRATE POLISHING SYSTEM
- Publication number 20220274228
- Publication date Sep 1, 2022
- KCTECH CO., LTD.
- Hee Sung CHAE
- B24 - GRINDING POLISHING
Information Patent Application
INSTALLATION AND METHOD FOR POLISHING SEMICONDUCTOR WAFERS
- Publication number 20220258303
- Publication date Aug 18, 2022
- Siltronic AG
- Jonny FRANKE
- B24 - GRINDING POLISHING
Information Patent Application
PROCESSING MACHINE
- Publication number 20220143772
- Publication date May 12, 2022
- Disco Corporation
- Toshiyuki MORIYA
- B24 - GRINDING POLISHING
Information Patent Application
HORIZONTAL BUFFING MODULE
- Publication number 20220134505
- Publication date May 5, 2022
- Applied Materials, Inc.
- Edward GOLUBOVSKY
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING SYSTEM
- Publication number 20220111486
- Publication date Apr 14, 2022
- KCTECH CO., LTD.
- Hee Sung CHAE
- B08 - CLEANING
Information Patent Application
SUBSTRATE PROCESSING SYSTEM
- Publication number 20220111485
- Publication date Apr 14, 2022
- KCTECH CO., LTD.
- Hee Sung CHAE
- B24 - GRINDING POLISHING
Information Patent Application
CMP WAFER CLEANING EQUIPMENT, WAFER TRANSFER ROBOT AND WAFER FLIPPI...
- Publication number 20210398834
- Publication date Dec 23, 2021
- HANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC.
- Linghan Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING APPARATUS, PROCESSING METHOD AND COMPUTER- READABLE RECO...
- Publication number 20210362290
- Publication date Nov 25, 2021
- TOKYO ELECTRON LIMITED
- Tomohiro KANEKO
- B24 - GRINDING POLISHING
Information Patent Application
HIGH THROUGHPUT POLISHING MODULES AND MODULAR POLISHING SYSTEMS
- Publication number 20210323118
- Publication date Oct 21, 2021
- Applied Materials, Inc.
- Jagan RANGARAJAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH THROUGHPUT POLISHING MODULES AND MODULAR POLISHING SYSTEMS
- Publication number 20210323117
- Publication date Oct 21, 2021
- Applied Materials, Inc.
- Jagan RANGARAJAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH THROUGHPUT POLISHING MODULES AND MODULAR POLISHING SYSTEMS
- Publication number 20210323119
- Publication date Oct 21, 2021
- Applied Materials, Inc.
- Jagan RANGARAJAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL PLANARIZATION EQUIPMENT, WAFER TRANSFER METHOD,...
- Publication number 20210260716
- Publication date Aug 26, 2021
- HANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC.
- EdwardLiCang LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING AND LOADING/UNLOADING COMPONENT MODULE
- Publication number 20210205952
- Publication date Jul 8, 2021
- HANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC.
- Linghan Shen
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND PROCESSING METHOD
- Publication number 20210013071
- Publication date Jan 14, 2021
- EBARA CORPORATION
- Kuniaki YAMAGUCHI
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE TRANSFER DEVICE, SUBSTRATE PROCESSING SYSTEM, SUBSTRATE P...
- Publication number 20200306925
- Publication date Oct 1, 2020
- TOKYO ELECTRON LIMITED
- Munehisa KODAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLEANING MEMBER ATTACHING PART, CLEANING MEMBER ASSEMBLY AND SUBSTR...
- Publication number 20200276619
- Publication date Sep 3, 2020
- EBARA CORPORATION
- Shuji UOZUMI
- H01 - BASIC ELECTRIC ELEMENTS

Feeding, loading or unloading work specially adapted to lapping

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

High throughput polishing modules and modular polishing systems

Automatic abrasion compensation system of lower plate and wafer lap...

Integrated machine for automatic cutting, polishing, stacking and u...

Chemical mechanical planarization equipment, wafer transfer method,...

Polishing and loading/unloading component module

Method of transferring semiconductor wafer to polishing apparatus a...

Channel cut polishing machine

Automated dry-in dry-out dual side polishing of silicon substrates...

Processing method of workpiece

Cleaning module, substrate processing apparatus including cleaning...

CMP wafer cleaning equipment, wafer transfer robot and wafer flippi...

Cover to vacuum debris while grinding

Substrate processing device

Workpiece processing apparatus including a resin coater and a resin...

Method of manufacturing wafer holder

Rotor polishing device

Grinding apparatus

Polishing-pad laminated structure, polishing-pad positioning instru...

Workpiece processing and resin grinding apparatus

Method and apparatus for polishing a substrate

Substrate processing apparatus, substrate processing method, substr...

Device and method for processing brake linings mounted on carriers

High throughput polishing system for workpieces

Substrate processing apparatus

Substrate polishing system and substrate polishing method

Load cup and chemical mechanical polishing apparatus and method of...

Substrate processing apparatus and method for detecting abnormality...

Apparatus for chemical-mechanical polishing

Substrate treatment device providing improved detachment mechanism...

Wafer centering device for measurement apparatus

Patents Applicationslast 30 patents

SUBSTRATE TREATING APPARATUS

SUBSTRATE PROCESSING APPARATUS, AND ABNORMALITY DETERMINATION METHOD

INTEGRATED MACHINE FOR AUTOMATIC CUTTING, POLISHING, STACKING AND U...

DEVICE FOR MEASURING WAFER POLISHING AMOUNT, AND MEASUREMENT METHOD...

WAFER POLISHING SYSTEM

POLISHING METHOD AND POLISHING APPARATUS

DETERMINING THE ORIENTATION OF A SUBSTRATE IN-SITU

CLEANING MEMBER ATTACHING PART, CLEANING MEMBER ASSEMBLY AND SUBSTR...

SUBSTRATE PROCESSING APPARATUS AND PROCESSING METHOD

AUTOMATIC ABRASION COMPENSATION SYSTEM OF LOWER PLATE AND WAFER LAP...

WAFER CONVEYING DEVICE, CHEMICAL MECHANICAL PLANARIZATION APPARATUS...

METHOD OF TRANSFERRING SEMICONDUCTOR WAFER TO POLISHING APPARATUS A...

PROCESSING METHOD OF WORKPIECE

AUTOMATED DRY-IN DRY-OUT DUAL SIDE POLISHING OF SILICON SUBSTRATES...

SUBSTRATE POLISHING SYSTEM

INSTALLATION AND METHOD FOR POLISHING SEMICONDUCTOR WAFERS

PROCESSING MACHINE

HORIZONTAL BUFFING MODULE

SUBSTRATE PROCESSING SYSTEM

SUBSTRATE PROCESSING SYSTEM

CMP WAFER CLEANING EQUIPMENT, WAFER TRANSFER ROBOT AND WAFER FLIPPI...

PROCESSING APPARATUS, PROCESSING METHOD AND COMPUTER- READABLE RECO...

HIGH THROUGHPUT POLISHING MODULES AND MODULAR POLISHING SYSTEMS

HIGH THROUGHPUT POLISHING MODULES AND MODULAR POLISHING SYSTEMS

HIGH THROUGHPUT POLISHING MODULES AND MODULAR POLISHING SYSTEMS

CHEMICAL MECHANICAL PLANARIZATION EQUIPMENT, WAFER TRANSFER METHOD,...

POLISHING AND LOADING/UNLOADING COMPONENT MODULE

SUBSTRATE PROCESSING APPARATUS AND PROCESSING METHOD

SUBSTRATE TRANSFER DEVICE, SUBSTRATE PROCESSING SYSTEM, SUBSTRATE P...

CLEANING MEMBER ATTACHING PART, CLEANING MEMBER ASSEMBLY AND SUBSTR...