Feeding means

Industry

CPC
H01L2224/75611

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/75611Feeding means

Industries

Patents Grantslast 30 patents

Information Patent Grant
Lid attach process and dispenser head
- Patent number 11,972,956
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor package and apparatus for p...
- Patent number 11,646,294
- Issue date May 9, 2023
- Samsung Electronics Co., Ltd.
- Ungkeol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball disposition system, method of disposing a ball on a substrate...
- Patent number 11,488,928
- Issue date Nov 1, 2022
- Samsung Electronics Co., Ltd.
- Sukmin Oh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing an integral join and automatic placement machine
- Patent number 11,081,464
- Issue date Aug 3, 2021
- Infineon Technologies AG
- Nicolas Heuck
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Metering apparatus
- Patent number 10,946,406
- Issue date Mar 16, 2021
- Marco Systemanalyse und Entwicklung GmbH
- Martin Reuter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate processing apparatus and manufacturing method of substrat...
- Patent number 10,833,045
- Issue date Nov 10, 2020
- Tokyo Electron Limited
- Yoshitaka Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for manufacturing plurality of electronic circ...
- Patent number 10,811,383
- Issue date Oct 20, 2020
- Pragmatic Printing Ltd.
- Neil Davies
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mounting conductive ball
- Patent number 10,804,240
- Issue date Oct 13, 2020
- PROTEC CO., LTD.
- Youn Sung Ko
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for improved delamination characteristics in a...
- Patent number 10,763,130
- Issue date Sep 1, 2020
- Microchip Technology Incorporated
- Taweesak Laevohan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lid attach processes for semiconductor packages
- Patent number 10,685,853
- Issue date Jun 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic-component mounting apparatus
- Patent number 10,568,245
- Issue date Feb 18, 2020
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for contactless transfer and soldering of chip...
- Patent number 10,304,709
- Issue date May 28, 2019
- Nederlandse Organisatie voor toegepast-natuurwetenschappelikj onderzoek TNO
- Rob Jacob Hendriks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting device and mounting method
- Patent number 10,199,349
- Issue date Feb 5, 2019
- Toray Engineering Co., Ltd.
- Katsumi Terada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonding tool and system
- Patent number 10,096,568
- Issue date Oct 9, 2018
- ASM Technology Singapore Pte. Ltd.
- Kwok Yuen Cheung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Application method of liquid material, application device and program
- Patent number 10,086,573
- Issue date Oct 2, 2018
- Musashi Engineering, Inc.
- Kazumasa Ikushima
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Electric component mounting method
- Patent number 10,034,389
- Issue date Jul 24, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hideki Eifuku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic-component mounting apparatus
- Patent number 9,968,020
- Issue date May 8, 2018
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting method
- Patent number 9,609,760
- Issue date Mar 28, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tsubasa Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lid attach process and apparatus for fabrication of semiconductor p...
- Patent number 9,502,373
- Issue date Nov 22, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip support substrate, chip support method, three-dimensional inte...
- Patent number 9,449,948
- Issue date Sep 20, 2016
- Tohoku University
- Mitsumasa Koyanagi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die bonder
- Patent number 9,099,524
- Issue date Aug 4, 2015
- FASFORD TECHNOLOGY CO., LTD.
- Yoshiaki Makita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lid attach process and apparatus for fabrication of semiconductor p...
- Patent number 8,916,419
- Issue date Dec 23, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for the production of a soldered joint
- Patent number 7,726,543
- Issue date Jun 1, 2010
- Smart Pac GmbH Technology Services
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for the production of a soldered connection
- Patent number 7,360,679
- Issue date Apr 22, 2008
- Smart Pac GmbH Technology Services
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM AND METHOD FOR DEPOSITING UNDERFILL MATERIAL
- Publication number 20240038716
- Publication date Feb 1, 2024
- Western Digital Technologies, Inc.
- Choo Par Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTELLIGENT DISPENSING ADJUSTMENT SYSTEM AND METHOD THEREOF
- Publication number 20230420406
- Publication date Dec 28, 2023
- KULICKE AND SOFFA HI-TECH CO., LTD.
- Lu-Min Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Underfill Dams
- Publication number 20230260950
- Publication date Aug 17, 2023
- Google LLC
- ChanWei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC CHIP MOUNTING DEVICE AND IC CHIP MOUNTING METHOD
- Publication number 20230011327
- Publication date Jan 12, 2023
- SATO HOLDINGS KABUSHIKI KAISHA
- Yoshimitsu MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING APPARATUS
- Publication number 20220415845
- Publication date Dec 29, 2022
- SHINKAWA LTD.
- Alexander DZHANGIROV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL DISPOSITION SYSTEM, METHOD OF DISPOSING A BALL ON A SUBSTRATE...
- Publication number 20210249378
- Publication date Aug 12, 2021
- Samsung Electronics Co., Ltd.
- SUKMIN OH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LID ATTACH PROCESS AND DISPENSER HEAD
- Publication number 20200286748
- Publication date Sep 10, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Liang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MOUNTING CONDUCTIVE BALL
- Publication number 20200144220
- Publication date May 7, 2020
- PROTEC CO., LTD.
- Youn Sung Ko
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD FOR MANUFACTURING PLURALITY OF ELECTRONIC CIRC...
- Publication number 20190067243
- Publication date Feb 28, 2019
- PRAGMATIC PRINTING LTD
- Neil DAVIES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METERING APPARATUS
- Publication number 20190054491
- Publication date Feb 21, 2019
- MARCO SYSTEMANALYSE UND ENTWICKLUNG GMBH
- Martin Reuter
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
Electronic Device and Method of Making the Same Using Surface Mount...
- Publication number 20190059160
- Publication date Feb 21, 2019
- Thin Film Electronics ASA
- Olle HAGEL
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND MANUFACTURING METHOD OF SUBSTRAT...
- Publication number 20180342479
- Publication date Nov 29, 2018
- TOKYO ELECTRON LIMITED
- Yoshitaka Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING DEVICE AND MOUNTING METHOD
- Publication number 20180019223
- Publication date Jan 18, 2018
- TORAY ENGINEERING CO., LTD.
- Katsumi TERADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC-COMPONENT MOUNTING APPARATUS AND ELECTRONIC-COMPONENT MO...
- Publication number 20170347504
- Publication date Nov 30, 2017
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing an Integral Join and Automatic Placement Machine
- Publication number 20160351533
- Publication date Dec 1, 2016
- INFINEON TECHNOLOGIES AG
- Nicolas Heuck
- B32 - LAYERED PRODUCTS
Information Patent Application
Apparatus and Method for Placing and Mounting Solder Balls on an In...
- Publication number 20150228613
- Publication date Aug 13, 2015
- Zen Voce Corporation
- Tu-Chen Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP SUPPORT SUBSTRATE, CHIP SUPPORT METHOD, THREE-DIMENSIONAL INTE...
- Publication number 20150228622
- Publication date Aug 13, 2015
- TOHOKU UNIVERSITY
- Mitsumasa Koyanagi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LID ATTACH PROCESS AND APPARATUS FOR FABRICATION OF SEMICONDUCTOR P...
- Publication number 20150069089
- Publication date Mar 12, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Liang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING METHOD, ELECTRONIC COMPONENT PLACEMEN...
- Publication number 20140231492
- Publication date Aug 21, 2014
- PANASONIC CORPORATION
- Tsubasa Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING METHOD, ELECTRONIC COMPONENT PLACEMEN...
- Publication number 20140096379
- Publication date Apr 10, 2014
- PANASONIC CORPORATION
- Tsubasa Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPLICATION METHOD OF LIQUID MATERIAL, APPLICATION DEVICE AND PROGRAM
- Publication number 20130313745
- Publication date Nov 28, 2013
- MUSASHI ENGINEERING, INC.
- Kazumasa Ikushima
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
LID ATTACH PROCESS AND APPARATUS FOR FABRICATION OF SEMICONDUCTOR P...
- Publication number 20130260511
- Publication date Oct 3, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Liang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Bonder
- Publication number 20130016205
- Publication date Jan 17, 2013
- Hitachi High-Tech Instruments Co., Ltd.
- Yoshiaki MAKITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Biaxial Drive Mechanism, Die Bonder and Die Bonder Operating Method
- Publication number 20130014881
- Publication date Jan 17, 2013
- Hitachi High-Tech Instruments Co., Ltd.
- Shingo FUKASAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Manufacturing Method
- Publication number 20100255641
- Publication date Oct 7, 2010
- TEXAS INSTRUMENTS INCORPORATED
- Noboru NAKANISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR THE PRODUCTION OF A SOLDERED JOINT
- Publication number 20080142576
- Publication date Jun 19, 2008
- Smart Pac GmbH Technology Services
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for the production of a soldered connection
- Publication number 20040060971
- Publication date Apr 1, 2004
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Feeding means

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Lid attach process and dispenser head

Method of manufacturing a semiconductor package and apparatus for p...

Ball disposition system, method of disposing a ball on a substrate...

Method for producing an integral join and automatic placement machine

Metering apparatus

Substrate processing apparatus and manufacturing method of substrat...

Apparatus and method for manufacturing plurality of electronic circ...

Method of mounting conductive ball

Systems and methods for improved delamination characteristics in a...

Lid attach processes for semiconductor packages

Electronic-component mounting apparatus

Apparatus and method for contactless transfer and soldering of chip...

Mounting device and mounting method

Die bonding tool and system

Application method of liquid material, application device and program

Electric component mounting method

Electronic-component mounting apparatus

Electronic component mounting method

Lid attach process and apparatus for fabrication of semiconductor p...

Chip support substrate, chip support method, three-dimensional inte...

Die bonder

Lid attach process and apparatus for fabrication of semiconductor p...

Method for the production of a soldered joint

Method for the production of a soldered connection

Patents Applicationslast 30 patents

SYSTEM AND METHOD FOR DEPOSITING UNDERFILL MATERIAL

INTELLIGENT DISPENSING ADJUSTMENT SYSTEM AND METHOD THEREOF

Underfill Dams

IC CHIP MOUNTING DEVICE AND IC CHIP MOUNTING METHOD

MOUNTING APPARATUS

BALL DISPOSITION SYSTEM, METHOD OF DISPOSING A BALL ON A SUBSTRATE...

LID ATTACH PROCESS AND DISPENSER HEAD

METHOD OF MOUNTING CONDUCTIVE BALL

APPARATUS AND METHOD FOR MANUFACTURING PLURALITY OF ELECTRONIC CIRC...

METERING APPARATUS

Electronic Device and Method of Making the Same Using Surface Mount...

SUBSTRATE PROCESSING APPARATUS AND MANUFACTURING METHOD OF SUBSTRAT...

MOUNTING DEVICE AND MOUNTING METHOD

ELECTRONIC-COMPONENT MOUNTING APPARATUS AND ELECTRONIC-COMPONENT MO...

Method for Producing an Integral Join and Automatic Placement Machine

Apparatus and Method for Placing and Mounting Solder Balls on an In...

CHIP SUPPORT SUBSTRATE, CHIP SUPPORT METHOD, THREE-DIMENSIONAL INTE...

LID ATTACH PROCESS AND APPARATUS FOR FABRICATION OF SEMICONDUCTOR P...

ELECTRONIC COMPONENT MOUNTING METHOD, ELECTRONIC COMPONENT PLACEMEN...

ELECTRONIC COMPONENT MOUNTING METHOD, ELECTRONIC COMPONENT PLACEMEN...

APPLICATION METHOD OF LIQUID MATERIAL, APPLICATION DEVICE AND PROGRAM

LID ATTACH PROCESS AND APPARATUS FOR FABRICATION OF SEMICONDUCTOR P...

Die Bonder

Biaxial Drive Mechanism, Die Bonder and Die Bonder Operating Method

Semiconductor Manufacturing Method

METHOD FOR THE PRODUCTION OF A SOLDERED JOINT

Method for the production of a soldered connection