Ferroelectric RAM [FeRAM or FRAM]

Industry

CPC
H01L2924/1441

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/1441Ferroelectric RAM [FeRAM or FRAM]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Memory devices having vertical transistors and methods for forming...
- Patent number 12,127,393
- Issue date Oct 22, 2024
- Yangtze Memory Technologies Co., Ltd.
- Tao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing self-aligned isolation s...
- Patent number 12,127,406
- Issue date Oct 22, 2024
- SanDisk Technologies LLC
- Takaaki Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices and methods of forming the same
- Patent number 12,051,663
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for heuristic-based power gating of non-CMOS l...
- Patent number 12,026,034
- Issue date Jul 2, 2024
- Kepler Computing Inc.
- Amrita Mathuriya
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus for managing power of ferroelectric or paraele...
- Patent number 12,001,266
- Issue date Jun 4, 2024
- Kepler Computing Inc.
- Amrita Mathuriya
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Word line drivers for multiple-die memory devices
- Patent number 11,984,150
- Issue date May 14, 2024
- Micron Technology, Inc.
- Fatma Arzum Simsek-Ege
- G11 - INFORMATION STORAGE
Information Patent Grant
Ferroelectric memory device with a metal layer having a crystal ori...
- Patent number 11,903,217
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Chieh Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a high reliability
- Patent number 11,894,346
- Issue date Feb 6, 2024
- Samsung Electronics Co., Ltd.
- Ji-Hwan Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ferroeolectric memories with ferroelectric composite layer
- Patent number 11,856,789
- Issue date Dec 26, 2023
- Industrial Technology Research Institute
- Yu-De Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 11,824,033
- Issue date Nov 21, 2023
- Samsung Electronics Co., Ltd.
- Gyoyoung Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power distribution for stacked memory
- Patent number 11,804,257
- Issue date Oct 31, 2023
- Micron Technology, Inc.
- Anthony D. Veches
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Finer grain dynamic random access memory
- Patent number 11,791,317
- Issue date Oct 17, 2023
- Micron Technology, Inc.
- Brent Keeth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ferroelectric or paraelectric memory and logic chiplet with thermal...
- Patent number 11,791,233
- Issue date Oct 17, 2023
- Kepler Computing Inc.
- Amrita Mathuriya
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
3D stacked compute and memory with copper-to-copper hybrid bond
- Patent number 11,784,164
- Issue date Oct 10, 2023
- Kepler Computing Inc.
- Rajeev Kumar Dokania
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ferroelectric assemblies and methods of forming ferroelectric assem...
- Patent number 11,769,816
- Issue date Sep 26, 2023
- Micron Technology, Inc.
- Albert Liao
- G11 - INFORMATION STORAGE
Information Patent Grant
3D stack of accelerator die and multi-core processor die
- Patent number 11,694,940
- Issue date Jul 4, 2023
- Kepler Computing Inc.
- Amrita Mathuriya
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package having a high reliability
- Patent number 11,664,352
- Issue date May 30, 2023
- Samsung Electronics Co., Ltd.
- Ji-Hwan Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Channel routing for memory devices
- Patent number 11,658,156
- Issue date May 23, 2023
- Micron Technology, Inc.
- Brent Keeth
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 11,552,038
- Issue date Jan 10, 2023
- Samsung Electronics Co., Ltd.
- Gyoyoung Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Neuromimetic network and related production method
- Patent number 11,551,749
- Issue date Jan 10, 2023
- UNIVERSITÉ PARIS-SACLAY
- Manuel Bibes
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power distribution for stacked memory
- Patent number 11,532,349
- Issue date Dec 20, 2022
- Micron Technology, Inc.
- Anthony D. Veches
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Finer grain dynamic random access memory
- Patent number 11,527,510
- Issue date Dec 13, 2022
- Micron Technology, Inc.
- Brent Keeth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ferroelectric assemblies and methods of forming ferroelectric assem...
- Patent number 11,515,396
- Issue date Nov 29, 2022
- Micron Technology, Inc.
- Albert Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor package including memory array
- Patent number 11,444,069
- Issue date Sep 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bo-Feng Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ferroelectric random access memory (FRAM) cell
- Patent number 11,257,844
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tzu-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integrated ultra high-bandwidth multi-stacked memory
- Patent number 11,152,343
- Issue date Oct 19, 2021
- Kepler Computing, Inc.
- Rajeev Kumar Dokania
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to construct 3D devices and systems
- Patent number 11,107,803
- Issue date Aug 31, 2021
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for shielding magnetically sensitive components
- Patent number 11,088,317
- Issue date Aug 10, 2021
- EVERSPIN TECHNOLOGIES, INC.
- Wenchin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a high reliability
- Patent number 11,018,115
- Issue date May 25, 2021
- Samsung Electronics Co., Ltd.
- Ji-Hwan Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Channel routing for memory devices
- Patent number 10,998,291
- Issue date May 4, 2021
- Micron Technology, Inc.
- Brent Keeth
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
MEMORY DEVICES
- Publication number 20240347489
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240339420
- Publication date Oct 10, 2024
- SAMSUNG ELECTRONICS CO,. LTD.
- JU BIN SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE...
- Publication number 20240321679
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Youngjoon KOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240321823
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Donguk Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING REDISTRIBUTION STRUCTURE AND METHOD...
- Publication number 20240321804
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Dowan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240297150
- Publication date Sep 5, 2024
- Samsung Electronics Co., Ltd.
- Jongpa HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES
- Publication number 20240292629
- Publication date Aug 29, 2024
- Yangtze Memory Technologies Co., Ltd.
- Dongxue Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORD LINE DRIVERS FOR MULTIPLE-DIE MEMORY DEVICES
- Publication number 20240274184
- Publication date Aug 15, 2024
- Micron Technology, Inc.
- Fatma Arzum Simsek-Ege
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240266271
- Publication date Aug 8, 2024
- Samsung Electronics Co., Ltd.
- Eun Ho CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND METHOD OF ASSEMBLING SAME
- Publication number 20240194560
- Publication date Jun 13, 2024
- Western Digital Technologies, Inc.
- Chee Seng Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE
- Publication number 20240186231
- Publication date Jun 6, 2024
- Samsung Electronics Co., Ltd.
- Jihwang KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240170382
- Publication date May 23, 2024
- Samsung Electronics Co., Ltd.
- Juhyeon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED 3D CACHE CONFIGURATION WITH ON-CHIP POWER SUPPORT
- Publication number 20240162192
- Publication date May 16, 2024
- International Business Machines Corporation
- Arvind Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240162184
- Publication date May 16, 2024
- Samsung Electronics Co., Ltd.
- Sang-Sick Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240162181
- Publication date May 16, 2024
- Samsung Electronics Co., Ltd.
- Sun Jae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240153856
- Publication date May 9, 2024
- Samsung Electronics Co., Ltd.
- Joonghyun BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240128155
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Minjun Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240079362
- Publication date Mar 7, 2024
- SK HYNIX INC.
- Jin Won PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORD LINE DRIVERS FOR MULTIPLE-DIE MEMORY DEVICES
- Publication number 20240071466
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Fatma Arzum Simsek-Ege
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240071995
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Raeyoung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH VOLUMETRICALLY-EXPANDED SIDE-CONNECTED IN...
- Publication number 20240071970
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORD LINE DRIVERS FOR MULTIPLE-DIE MEMORY DEVICES
- Publication number 20240071468
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Fatma Arzum Simsek-Ege
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240063131
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- Jaeean Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240055398
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- Choong Bin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240038728
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- Aenee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240032310
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Kyungdon Mun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND METHOD FOR FORMING A MEMORY DEVICE
- Publication number 20240023342
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Chieh Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240021581
- Publication date Jan 18, 2024
- Samsung Electronics Co., Ltd.
- Jung Min KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING AN ADHESIVE STRUCTURE
- Publication number 20240014164
- Publication date Jan 11, 2024
- Samsung Electronics Co., Ltd.
- Jooyoung OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240014144
- Publication date Jan 11, 2024
- Samsung Electronics Co., Ltd.
- Hyun Su KIM
- H01 - BASIC ELECTRIC ELEMENTS

Ferroelectric RAM [FeRAM or FRAM]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Memory devices having vertical transistors and methods for forming...

Three-dimensional memory device containing self-aligned isolation s...

Memory devices and methods of forming the same

Method and apparatus for heuristic-based power gating of non-CMOS l...

Method and apparatus for managing power of ferroelectric or paraele...

Word line drivers for multiple-die memory devices

Ferroelectric memory device with a metal layer having a crystal ori...

Semiconductor package having a high reliability

Ferroeolectric memories with ferroelectric composite layer

Semiconductor package and method of manufacturing the semiconductor...

Power distribution for stacked memory

Finer grain dynamic random access memory

Ferroelectric or paraelectric memory and logic chiplet with thermal...

3D stacked compute and memory with copper-to-copper hybrid bond

Ferroelectric assemblies and methods of forming ferroelectric assem...

3D stack of accelerator die and multi-core processor die

Semiconductor package having a high reliability

Channel routing for memory devices

Semiconductor package and method of manufacturing the semiconductor...

Neuromimetic network and related production method

Power distribution for stacked memory

Finer grain dynamic random access memory

Ferroelectric assemblies and methods of forming ferroelectric assem...

3D semiconductor package including memory array

Ferroelectric random access memory (FRAM) cell

3D integrated ultra high-bandwidth multi-stacked memory

Method to construct 3D devices and systems

Structures and methods for shielding magnetically sensitive components

Semiconductor package having a high reliability

Channel routing for memory devices

Patents Applicationslast 30 patents

MEMORY DEVICES

SEMICONDUCTOR PACKAGE

HEAT DISSIPATION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING REDISTRIBUTION STRUCTURE AND METHOD...

SEMICONDUCTOR PACKAGE

THREE-DIMENSIONAL MEMORY DEVICES

WORD LINE DRIVERS FOR MULTIPLE-DIE MEMORY DEVICES

SEMICONDUCTOR PACKAGE

MEMORY DEVICE AND METHOD OF ASSEMBLING SAME

SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

STACKED 3D CACHE CONFIGURATION WITH ON-CHIP POWER SUPPORT

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

WORD LINE DRIVERS FOR MULTIPLE-DIE MEMORY DEVICES

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE WITH VOLUMETRICALLY-EXPANDED SIDE-CONNECTED IN...

WORD LINE DRIVERS FOR MULTIPLE-DIE MEMORY DEVICES

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

MEMORY DEVICE AND METHOD FOR FORMING A MEMORY DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING AN ADHESIVE STRUCTURE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME