Fibers and reinforcement materials

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CPC
H05K2201/0275

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0275Fibers and reinforcement materials

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board
- Patent number 12,156,329
- Issue date Nov 26, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seong Ho Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 12,101,878
- Issue date Sep 24, 2024
- LG Innotek Co., Ltd
- Dong Hwa Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fluoride-based resin prepreg and circuit substrate using the same
- Patent number 11,903,127
- Issue date Feb 13, 2024
- Nan Ya Plastics Corporation
- Te-Chao Liao
- B32 - LAYERED PRODUCTS
Information Patent Grant
Patterned fiber substrate
- Patent number 11,864,314
- Issue date Jan 2, 2024
- Kuraray Co., Ltd.
- Kohei Hayashi
- D06 - TREATMENT OF TEXTILES OR THE LIKE LAUNDERING FLEXIBLE MATERIALS NOT OTH...
Information Patent Grant
Use of MGO, ZNO, and rare earth oxides for making improved low diel...
- Patent number 11,787,732
- Issue date Oct 17, 2023
- Electric Glass Fiber America, LLC
- Hong Li
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Method and compositions for embedding electronics in fiber-composit...
- Patent number 11,590,719
- Issue date Feb 28, 2023
- Arris Composites Inc.
- Ethan Escowitz
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Three-dimensional circuit assembly with composite bonded encapsulation
- Patent number 11,277,909
- Issue date Mar 15, 2022
- TTM Technologies Inc.
- John Vesce
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally conductive type polyimide substrate
- Patent number 10,953,641
- Issue date Mar 23, 2021
- Microcosm Technology Co., Ltd.
- Tang-Chieh Huang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Printed circuit board
- Patent number 10,912,194
- Issue date Feb 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prepreg, metal foil-clad laminate, and printed wiring board
- Patent number 10,791,626
- Issue date Sep 29, 2020
- Mitsubishi Gas Chemcial Company, Inc.
- Tomoki Hamajima
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Printed wiring board
- Patent number 10,667,391
- Issue date May 26, 2020
- Ibiden Co., Ltd.
- Naohito Ishiguro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 10,506,712
- Issue date Dec 10, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pei-Haw Tsao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Use of MgO, ZnO, and rare earth oxides for making improved low diel...
- Patent number 10,479,721
- Issue date Nov 19, 2019
- Hong Li
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Resin composition, pre-preg, laminate, metal foil-clad laminate, an...
- Patent number 10,030,141
- Issue date Jul 24, 2018
- Mitsubishi Gas Chemical Company, Inc.
- Tomo Chiba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive pattern formation method, conductive pattern-bearing sub...
- Patent number 9,817,499
- Issue date Nov 14, 2017
- Hitachi Chemical Company, Ltd.
- Hiroshi Yamazaki
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method of manufacturing a patterned conductor
- Patent number 9,801,284
- Issue date Oct 24, 2017
- Dow Global Technologies LLC
- Tamara Dikic
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed circuit board package structure and manufacturing method th...
- Patent number 9,743,523
- Issue date Aug 22, 2017
- TRIPOD TECHNOLOGY CORPORATION
- Bo-Shiung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-clad laminate and printed wiring board
- Patent number 9,661,749
- Issue date May 23, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hiroharu Inoue
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive pattern formation method, conductive pattern-bearing sub...
- Patent number 9,639,189
- Issue date May 2, 2017
- Hitachi Chemical Company, Ltd.
- Hiroshi Yamazaki
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Semiconductor package
- Patent number 9,635,762
- Issue date Apr 25, 2017
- J-DEVICES CORPORATION
- Shinji Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite substrate for light emitting diodes
- Patent number 9,502,620
- Issue date Nov 22, 2016
- Xenio Corporation
- Brian Cumpston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Angle-adjustable and/or angled printed circuit board structure havi...
- Patent number 9,474,149
- Issue date Oct 18, 2016
- JUMATECH GMBH
- Markus Wölfel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device comprising a substrate board equipped with a loca...
- Patent number 9,420,685
- Issue date Aug 16, 2016
- STMicroelectronics (Grenoble 2) SAS
- Jean-Michel Riviere
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite substrate for light emitting diodes
- Patent number 9,252,337
- Issue date Feb 2, 2016
- Bridgelux, Inc.
- Brian Cumpston
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Epoxy resin varnishes, laminates and printed circuit boards
- Patent number 9,169,346
- Issue date Oct 27, 2015
- Ventec Electronics (Suzhou) Company
- Chien-Jen Chung
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE AND PRODUCT
- Publication number 20240090175
- Publication date Mar 14, 2024
- Beji SASAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATE, LAMINATE WITH BUILDUP LAYER, LAMINATE WITH METAL FOIL, AN...
- Publication number 20240057252
- Publication date Feb 15, 2024
- SEKISUI KASEI CO., LTD.
- Koichiro OKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Use of MgO, ZnO, And Rare Earth Oxides for Making Improved Low Diel...
- Publication number 20240018034
- Publication date Jan 18, 2024
- Electric Glass Fiber America, LLC
- Hong Li
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
ULTRA-LASER THOUGH HOLE (ULTH) BY MULTI-STACKED CORE CONCEPT
- Publication number 20230397333
- Publication date Dec 7, 2023
- Intel Corporation
- Eng Huat GOH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20230397330
- Publication date Dec 7, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Seong Ho Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20230119237
- Publication date Apr 20, 2023
- LG Innotek Co., Ltd.
- Dong Hwa LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20230066269
- Publication date Mar 2, 2023
- LG Innotek Co., Ltd.
- Min Young HWANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Resin Sheet and Circuit Board Material Using the Same
- Publication number 20230007767
- Publication date Jan 5, 2023
- MCPP Innovation LLC
- Yuuko Hayakawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20220248530
- Publication date Aug 4, 2022
- IBIDEN CO., LTD.
- Yoji MORI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUORIDE-BASED RESIN PREPREG AND CIRCUIT SUBSTRATE USING THE SAME
- Publication number 20220132661
- Publication date Apr 28, 2022
- Nan Ya Plastics Corporation
- TE-CHAO LIAO
- B32 - LAYERED PRODUCTS
Information Patent Application
PATTERNED FIBER SUBSTRATE
- Publication number 20220117083
- Publication date Apr 14, 2022
- KURARAY CO., LTD.
- Kohei HAYASHI
- D06 - TREATMENT OF TEXTILES OR THE LIKE LAUNDERING FLEXIBLE MATERIALS NOT OTH...
Information Patent Application
THREE-DIMENSIONAL CIRCUIT ASSEMBLY WITH COMPOSITE BONDED ENCAPSULATION
- Publication number 20210068250
- Publication date Mar 4, 2021
- John Vesce
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Use of MgO, AnO, and Rare Earth Oxides for Making Improved Low Diel...
- Publication number 20200039870
- Publication date Feb 6, 2020
- PPG INDUSTRIES OHIO, INC.
- Hong Li
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20190394877
- Publication date Dec 26, 2019
- IBIDEN CO., LTD.
- Naohito ISHIGURO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
USE OF MgO, ZnO, AND RARE EARTH OXIDES FOR MAKING IMPROVED LOW DIEL...
- Publication number 20180127305
- Publication date May 10, 2018
- PPG INDUSTRIES OHIO, INC.
- Hong Li
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
SPREAD WEAVE INDUCED SKEW MINIMIZATION
- Publication number 20170339780
- Publication date Nov 23, 2017
- CIENA CORPORATION
- Robert Bisson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF MANUFACTURING A PATTERNED CONDUCTOR
- Publication number 20170142842
- Publication date May 18, 2017
- DOW GLOBAL TECHNOLOGIES LLC
- Tamara Dikic
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PREPREG, PRINTED CIRCUIT BOARD INCLUDING PREPREG, AND METHOD OF FAB...
- Publication number 20170086290
- Publication date Mar 23, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Keun-Yong LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE PATTERN FORMATION METHOD, CONDUCTIVE PATTERN-BEARING SUB...
- Publication number 20160246394
- Publication date Aug 25, 2016
- Hitachi Chemical Company, Ltd.
- Hiroshi Yamazaki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PREPREG, METAL FOIL-CLAD LAMINATE, AND PRINTED CIRCUIT BOARD
- Publication number 20160219700
- Publication date Jul 28, 2016
- Mitsubishi Gas Chemical Company, Inc.
- Tomoki HAMAJIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20160212854
- Publication date Jul 21, 2016
- IBIDEN CO., LTD.
- Nobuhisa KURODA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING SUBSTRATE
- Publication number 20160066417
- Publication date Mar 3, 2016
- Taiyo Yuden Co., Ltd.
- Yuichi SUGIYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20160027715
- Publication date Jan 28, 2016
- J-DEVICES CORPORATION
- Shinji WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH THERMAL CONDUCTIVITY PREPREG, PRINTED WIRING BOARD AND MULTILA...
- Publication number 20160007453
- Publication date Jan 7, 2016
- 3M Innovative Properties Company
- Kohichiro Kawate
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Angle-Adjustable And/Or Angled Printed Circuit Board Structure Havi...
- Publication number 20150327355
- Publication date Nov 12, 2015
- JUMATECH GMBH
- Markus Wölfel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION, PRE-PREG, LAMINATE, METAL FOIL-CLAD LAMINATE, AN...
- Publication number 20150307708
- Publication date Oct 29, 2015
- Mitsubishi Gas Chemical Company, Inc.
- Tomo CHIBA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PREPREG AND USES OF THE SAME
- Publication number 20150189746
- Publication date Jul 2, 2015
- Taiwan Union Technology Corporation
- Chih-Wei Liao
- B32 - LAYERED PRODUCTS
Information Patent Application
PRINTED CIRCUIT BOARD PACKAGE STRUCTURE AND MANUFACTURING METHOD TH...
- Publication number 20150107883
- Publication date Apr 23, 2015
- TRIPOD TECHNOLOGY CORPORATION
- Bo-Shiung Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSULATING RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND PRODUCTS...
- Publication number 20150065608
- Publication date Mar 5, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Geum Hee Yun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE COMPRISING A SUBSTRATE BOARD EQUIPPED WITH A LOCA...
- Publication number 20150036309
- Publication date Feb 5, 2015
- STMicroelectronics (Grenoble 2) SAS
- Jean-Michel Riviere
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Fibers and reinforcement materials

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Printed circuit board

Circuit board

Fluoride-based resin prepreg and circuit substrate using the same

Patterned fiber substrate

Use of MGO, ZNO, and rare earth oxides for making improved low diel...

Method and compositions for embedding electronics in fiber-composit...

Three-dimensional circuit assembly with composite bonded encapsulation

Thermally conductive type polyimide substrate

Printed circuit board

Prepreg, metal foil-clad laminate, and printed wiring board

Printed wiring board

Printed circuit board

Use of MgO, ZnO, and rare earth oxides for making improved low diel...

Resin composition, pre-preg, laminate, metal foil-clad laminate, an...

Conductive pattern formation method, conductive pattern-bearing sub...

Method of manufacturing a patterned conductor

Printed circuit board package structure and manufacturing method th...

Metal-clad laminate and printed wiring board

Conductive pattern formation method, conductive pattern-bearing sub...

Semiconductor package

Composite substrate for light emitting diodes

Angle-adjustable and/or angled printed circuit board structure havi...

Electronic device comprising a substrate board equipped with a loca...

Composite substrate for light emitting diodes

Epoxy resin varnishes, laminates and printed circuit boards

Patents Applicationslast 30 patents

ELECTRONIC DEVICE AND PRODUCT

LAMINATE, LAMINATE WITH BUILDUP LAYER, LAMINATE WITH METAL FOIL, AN...

Use of MgO, ZnO, And Rare Earth Oxides for Making Improved Low Diel...

ULTRA-LASER THOUGH HOLE (ULTH) BY MULTI-STACKED CORE CONCEPT

PRINTED CIRCUIT BOARD

CIRCUIT BOARD

CIRCUIT BOARD

Resin Sheet and Circuit Board Material Using the Same

WIRING SUBSTRATE

FLUORIDE-BASED RESIN PREPREG AND CIRCUIT SUBSTRATE USING THE SAME

PATTERNED FIBER SUBSTRATE

THREE-DIMENSIONAL CIRCUIT ASSEMBLY WITH COMPOSITE BONDED ENCAPSULATION

Use of MgO, AnO, and Rare Earth Oxides for Making Improved Low Diel...

PRINTED WIRING BOARD

USE OF MgO, ZnO, AND RARE EARTH OXIDES FOR MAKING IMPROVED LOW DIEL...

SPREAD WEAVE INDUCED SKEW MINIMIZATION

METHOD OF MANUFACTURING A PATTERNED CONDUCTOR

PREPREG, PRINTED CIRCUIT BOARD INCLUDING PREPREG, AND METHOD OF FAB...

CONDUCTIVE PATTERN FORMATION METHOD, CONDUCTIVE PATTERN-BEARING SUB...

PREPREG, METAL FOIL-CLAD LAMINATE, AND PRINTED CIRCUIT BOARD

PRINTED WIRING BOARD

MULTILAYER WIRING SUBSTRATE

SEMICONDUCTOR PACKAGE

HIGH THERMAL CONDUCTIVITY PREPREG, PRINTED WIRING BOARD AND MULTILA...

Angle-Adjustable And/Or Angled Printed Circuit Board Structure Havi...

RESIN COMPOSITION, PRE-PREG, LAMINATE, METAL FOIL-CLAD LAMINATE, AN...

PREPREG AND USES OF THE SAME

PRINTED CIRCUIT BOARD PACKAGE STRUCTURE AND MANUFACTURING METHOD TH...

INSULATING RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND PRODUCTS...

ELECTRONIC DEVICE COMPRISING A SUBSTRATE BOARD EQUIPPED WITH A LOCA...