TECHNICAL FIELD
The present invention relates to an electronic device having a device part and a product.
BACKGROUND ART
As the power consumption of electronic elements and the like increases, heat dissipation in electronic devices has become important. For example, JP 2019-102485 A discloses an electronic device including a printed circuit board having a surface on which a heating element is mounted, and a sealed housing having thermal conductivity and accommodating the printed circuit board. The electronic device includes a through hole provided in the printed circuit board and a protrusion provided on a surface of the housing that faces a back surface of the printed circuit board, and the protrusion is thermally connected to the heating element via the through hole.
SUMMARY OF INVENTION
Problem to be Solved by Invention
The present invention provides an electronic device and the like for implementing a high heat dissipation performance by an approach different from an aspect according to the related art.
Means for Solving Problem
An electronic device according to an aspect of the present invention may comprise:
- a device part; and
- a fiber member for joining the device part to another member other than the device part included in the electronic device.
According to the present invention, heat generated from the device part can be easily transferred to another member, and the heat can be easily dissipated.
BRIEF DESCRIPTION OF DRAWINGS
FIG. 1 is a side cross-sectional view illustrating an aspect in which a highly thermally conductive fiber member joins a device part and a heat transfer member in an electronic device according to an embodiment of the present invention.
FIG. 2 is a side cross-sectional view illustrating an aspect in which the fiber member joins the device part, the heat transfer member, and an outer housing in the electronic device according to an embodiment of the present invention.
FIG. 3 is a side cross-sectional view illustrating an aspect in which the fiber member penetrates through the outer housing in the electronic device according to an embodiment of the present invention.
FIG. 4 is a side cross-sectional view illustrating an aspect in which the fiber member joins the device part and the outer housing in the electronic device according to an embodiment of the present invention.
FIG. 5 is a side cross-sectional view illustrating an aspect in which a certain fiber member joins the device part and the heat transfer member, and another fiber member joins the heat transfer member and the outer housing in the electronic device according to an embodiment of the present invention.
FIG. 6 is a side cross-sectional view illustrating an aspect in which the fiber member joins the device part and the heat transfer member, and another fiber member joins the heat transfer member and the outer housing, in an electronic device according to an embodiment of the present invention, in which the fiber member penetrates through the outer housing.
FIG. 7 is a side cross-sectional view illustrating an aspect in which the fiber member having a rod shape penetrates through the outer housing in the electronic device according to an embodiment of the present invention.
FIG. 8 is a side cross-sectional view illustrating an aspect in which the fiber member having a rod shape is bent on a front surface of the outer housing in the electronic device according to an embodiment of the present invention.
FIG. 9 is a side cross-sectional view illustrating an aspect in which the fiber member having a rod shape is cut at a position exposed from the outer housing in the electronic device according to an embodiment of the present invention.
FIG. 10 is a side cross-sectional view illustrating an aspect in which the fiber member joins the device part and a heat sink in the electronic device according to an embodiment of the present invention.
FIG. 11 is a side cross-sectional view illustrating an aspect in which the fiber member joins the heat transfer member placed on a device resin part and the device part in the electronic device according to an embodiment of the present invention.
FIG. 12A is a view illustrating an example of the electronic device according to an embodiment of the present invention.
FIG. 12B is a view illustrating an example of the electronic device according to an embodiment of the present invention.
FIG. 12C is a view illustrating an example of the electronic device according to an embodiment of the present invention.
FIG. 12D is a view illustrating an example of the electronic device according to an embodiment of the present invention.
FIG. 12E is a view illustrating an example of the electronic device according to an embodiment of the present invention.
FIG. 13A is a view illustrating an example of the electronic device according to an embodiment of the present invention.
FIG. 13B is a view illustrating an example of the electronic device according to an embodiment of the present invention.
FIG. 13C is a view illustrating an example of the electronic device according to an embodiment of the present invention.
FIG. 13D is a view illustrating an example of the electronic device according to an embodiment of the present invention.
FIG. 13E is a view illustrating an example of the electronic device according to an embodiment of the present invention.
FIG. 14A is a view illustrating an example of the electronic device according to an embodiment of the present invention.
FIG. 14B is a view illustrating an example of the electronic device according to an embodiment of the present invention.
FIG. 14C is a view illustrating an example of the electronic device according to an embodiment of the present invention.
FIG. 14D is a view illustrating an example of the electronic device according to an embodiment of the present invention.
FIG. 14E is a view illustrating an example of the electronic device according to an embodiment of the present invention.
FIG. 15A is a view illustrating an example of the electronic device according to an embodiment of the present invention.
FIG. 15B is a view illustrating an example of the electronic device according to an embodiment of the present invention.
FIG. 15C is a view illustrating an example of the electronic device according to an embodiment of the present invention.
FIG. 15D is a view illustrating an example of the electronic device according to an embodiment of the present invention.
FIG. 15E is a view illustrating an example of the electronic device according to an embodiment of the present invention.
FIG. 16A is a view illustrating an example of the electronic device according to an embodiment of the present invention.
FIG. 16B is a view illustrating an example of the electronic device according to an embodiment of the present invention.
FIG. 16C is a view illustrating an example of the electronic device according to an embodiment of the present invention.
FIG. 16D is a view illustrating an example of the electronic device according to an embodiment of the present invention.
FIG. 16E is a view illustrating an example of the electronic device according to an embodiment of the present invention.
FIG. 17A is a view illustrating an example of the electronic device according to an embodiment of the present invention.
FIG. 17B is a view illustrating an example of the electronic device according to an embodiment of the present invention.
FIG. 17C is a view illustrating an example of the electronic device according to an embodiment of the present invention.
FIG. 17D is a view illustrating an example of the electronic device according to an embodiment of the present invention.
FIG. 17E is a view illustrating an example of the electronic device according to an embodiment of the present invention.
FIG. 18A is a view illustrating an example of the electronic device according to an embodiment of the present invention.
FIG. 18B is a view illustrating an example of the electronic device according to an embodiment of the present invention.
FIG. 18C is a view illustrating an example of the electronic device according to an embodiment of the present invention.
FIG. 18D is a view illustrating an example of the electronic device according to an embodiment of the present invention.
FIG. 18E is a view illustrating an example of the electronic device according to an embodiment of the present invention.
FIG. 19A is a view illustrating an example of the electronic device according to an embodiment of the present invention.
FIG. 19B is a view illustrating an example of the electronic device according to an embodiment of the present invention.
FIG. 19C is a view illustrating an example of the electronic device according to an embodiment of the present invention.
FIG. 19D is a view illustrating an example of the electronic device according to an embodiment of the present invention.
FIG. 19E is a view illustrating an example of the electronic device according to an embodiment of the present invention.
FIG. 20A is a view illustrating an example of the electronic device according to an embodiment of the present invention.
FIG. 20B is a view illustrating an example of the electronic device according to an embodiment of the present invention.
FIG. 20C is a view illustrating an example of the electronic device according to an embodiment of the present invention.
FIG. 20D is a view illustrating an example of the electronic device according to an embodiment of the present invention.
FIG. 20E is a view illustrating an example of the electronic device according to an embodiment of the present invention.
FIG. 21A is a view illustrating an example of the electronic device according to an embodiment of the present invention.
FIG. 21B is a view illustrating an example of the electronic device according to an embodiment of the present invention.
FIG. 21C is a view illustrating an example of the electronic device according to an embodiment of the present invention.
FIG. 21D is a view illustrating an example of the electronic device according to an embodiment of the present invention.
FIG. 22A is a view illustrating an example of the electronic device according to an embodiment of the present invention.
FIG. 22B is a view illustrating an example of the electronic device according to an embodiment of the present invention.
FIG. 22C is a view illustrating an example of the electronic device according to an embodiment of the present invention.
FIG. 22D is a view illustrating an example of the electronic device according to an embodiment of the present invention.
DETAILED DESCRIPTION
As illustrated in FIG. 1, an electronic device of the present embodiment may have a device part 10 and an outer housing 50 provided in such a way as to cover the device part 10. A fiber member 30 for joining the device part 10 to another member other than the device part 10 included in the electronic device may be provided. The fiber member 30 may be made of metal or may be a copper fiber member made of copper. However, the present invention is not limited thereto, and any member having high conductivity can be preferably used as the fiber member 30. The outer housing 50 may be, for example, a housing of a smartphone, a housing of a personal computer, or the like, or may be a housing of an in-vehicle device.
As described above, by providing the fiber member 30 for joining the device part 10 to another member present between the outer housing 50 and the device part 10, heat generated from the device part 10 can be easily transmitted to the another member, and the heat can be easily dissipated. In particular, in a case where the fiber member 30 is made of metal, high thermal conduction can be implemented, and an excellent dissipation effect can be exhibited.
In FIG. 1, an upper side is one side, and a lower side is the other side. A vertical direction in FIG. 1 is a first direction, a horizontal direction is a second direction, and a front and back direction of a paper surface is a third direction. In the present embodiment, a plane including the second direction and the third direction is referred to as an in-plane.
The another member joined by the fiber member 30 may be the outer housing 50. In this case, the fiber member 30 joins the device part 10 and the outer housing 50 by sewing (see FIG. 4). The joining by the fiber member 30 may be implemented by a special sewing machine.
As the fiber member 30 joins the device part 10 and the outer housing 50 in this manner, heat can be transmitted to the outer housing 50 via the fiber member 30. Therefore, a greater heat dissipation effect can be exhibited.
The fiber member 30 may be exposed from one side surface (outer surface) of the outer housing 50 (see FIG. 3). In this case, heat can be transferred to the outside of the outer housing 50 via the fiber member 30.
Therefore, a greater heat dissipation effect can be exhibited. The fiber member 30 may be within the outer housing 50 and does not have to be exposed from the one side surface (outer surface) of the outer housing 50 (see FIG. 2).
As illustrated in FIGS. 1 to 3, a heat transfer member 60 such as grease (for example, thermally conductive grease (thermal interface material (TIM)) or a heat dissipation sheet may be provided between the device part 10 and the outer housing 50. In this case, the another member may include the heat transfer member 60, and the fiber member 30 may join the device part 10 and the heat transfer member 60 (see also FIG. 11). Also in this case, the joining by the fiber member 30 may be implemented by a special sewing machine.
Also in an aspect in which the fiber member 30 joins the device part 10 and the heat transfer member 60 as described above, heat can be efficiently transferred to the heat transfer member 60 via the fiber member 30. Therefore, a greater heat dissipation effect can be exhibited.
In a case where the heat transfer member 60 is provided, as illustrated in FIG. 2, the fiber member 30 may penetrate through the heat transfer member 60 to reach the outer housing 50. In this case, the fiber member 30 joins the device part 10 to the outer housing 50 and the heat transfer member 60. Also in this case, the fiber member 30 may be exposed from the one side surface (outer surface) of the outer housing 50 as illustrated in FIG. 3, or the fiber member 30 may not be exposed from the one side surface (outer surface) of the outer housing 50 as illustrated in FIG. 2. Also in this case, as described above, heat can be transferred to the outer housing 50 via the fiber member 30, and a greater heat dissipation effect can be exhibited.
The device part 10 may have an electronic element 11 such as a semiconductor chip, a resistor, or a capacitor, and a device resin part 12 that covers and encloses the electronic element 11. The device resin part 12 may be made of a resin such as a potting resin. In this case, the fiber member 30 may join the device resin part 12 of the device part 10 to another member (the outer housing 50, the heat transfer member 60, or the like) other than the device part 10 included in the electronic device (see FIGS. 1 to 4). The device resin part 12 is advantageous in that sewing by the fiber member 30 is easy. In addition, in a case where the fiber member 30 is made of metal or the like and has electrical conductivity, when the electronic element 11 and the fiber member 30 are joined, there is a possibility of causing a short circuit. However, such a risk can be reduced by sewing the fiber member 30 to the device resin part 12 as in this aspect. The device part 10 may have a device substrate 13 on which the electronic element 11 is placed. A circuit may be formed on the device substrate 13. The device substrate 13 may be placed on a mounting substrate 90 via a conductive adhesive 80 such as a solder.
The device part 10 may have a device housing 15 that covers the electronic element 11. In this case, the fiber member 30 may join the device housing 15 of the device part 10 and another member (the outer housing 50, the heat transfer member 60, or the like) other than the device part 10 included in the electronic device. In addition, in a case where the fiber member 30 is made of metal or the like and has electrical conductivity, when the electronic element 11 and the fiber member 30 are joined, there is a possibility of causing a short circuit. However, such a risk can be reduced by sewing the fiber member 30 to the device housing 15 as in this aspect.
In a case where the device part 10 has the device resin part 12 that covers and encloses the electronic element 11 and the device housing 15 that covers the device resin part 12, the fiber member 30 may join the device resin part 12 and the device housing 15 of the device part 10 to another member (the outer housing 50, the heat transfer member 60, or the like) other than the device part 10 included in the electronic device. A wire 19 (see FIGS. 12A to 21E) or a connector may be connected to the electronic element 11 and connected to a circuit made of copper or the like.
As illustrated in FIG. 5, a certain fiber member (first fiber member) 30a may join the device part 10 and the heat transfer member 60, and another fiber member (second fiber member) 30b may join the heat transfer member 60 and the outer housing 50. In this case, thermal conduction from the device part 10 to the heat transfer member 60 can be implemented by the certain fiber member (first fiber member) 30a, and thermal conduction from the heat transfer member 60 to the outer housing 50 can be implemented by the another fiber member (second fiber member) 30b.
As illustrated in FIG. 6, the another fiber member (second fiber member) 30b may be exposed to the outside from the outer housing 50. Since the another fiber member (second fiber member) 30b is exposed to the outside in this manner, heat can be easily released to the outside.
As illustrated in FIGS. 7 to 9, the fiber member 30 of the present embodiment may be a rod-shaped member. In this aspect, the rod-shaped fiber member 30 pierces and penetrates through another member, whereby the device part 10 is joined to the another member. The device part 10 may be joined to the another member by providing an adhesive or the like between the fiber member 30 and the another member. The rod-shaped fiber member 30 may have a bent shape (see FIGS. 12C to 12E, FIGS. 13C to 13E, FIGS. 14C to 14E, and the like). For example, the rod-shaped fiber member 30 may have a U-shape when viewed in a cross section.
The rod-shaped fiber member 30 does not have to be exposed or may be exposed from a front surface side of the electronic device. In a case where the rod-shaped fiber member 30 is exposed from the front surface side of the electronic device, the fiber member 30 may protrude from one side surface (front surface) (see FIG. 7), the fiber member 30 may be bent on the one side surface (front surface) of the electronic device (see FIG. 8), or a protruding part of the fiber member 30 may be cut (see FIG. 9). In the aspects illustrated in FIGS. 7 to 9, the electronic device 1 has a lid part 110. In the aspect illustrated in FIG. 7, the fiber member 30 penetrates through the lid part 110. In the aspect illustrated in FIG. 8, the fiber member 30 is bent along one side surface of the lid part 110. In the aspect illustrated in FIG. 9, the fiber member 30 is cut at a position exposed from the one side surface of the lid part 110.
As illustrated in FIG. 10, the another member joined by the fiber member 30 may be a heat sink 150 or the like. This case is advantageous in that heat from the device part 10 can be directly transferred to the heat sink 150.
In the present embodiment, various aspects can be used. Examples of an adoptable aspect are disclosed in FIGS. 12A to 22E.
As described above, according to the present embodiment, heat retained in the device part 10 can be efficiently conducted from the inside to the outside through a highly thermally conductive fiber or substance. In addition, as the protrusion and the highly thermally conductive fiber are entangled with the thermally conductive grease or the like, a surface area for transferring heat is increased, more heat is transferred, and the thermal conductivity can be improved.
In a case where the fiber member 30 is made of a highly thermally conductive fiber, the heat dissipation effect is further enhanced. It is possible to pick up heat from the periphery of a heating part such as the device part 10 and transfer the heat to a resin having poor thermal conductivity and the outside of an IC package or a module to transfer the heat to the grease or the housing. As in the present embodiment, it is very advantageous to expose the fiber to the outside of the housing and the like to dissipate heat, in addition to a case of transferring the heat to other components or members and the housing.
Examples of a main electronic device in which the present embodiment is used include a power transistor molded from resin, a central processing unit (CPU) molded from a resin, a graphics processing unit (GPU) molded from a resin, a memory molded from a resin, and a resin package module.
The electronic device of the present embodiment may be incorporated into any mounting apparatus such as an automobile, an airplane, a ship, a helicopter, a personal computer, or a home appliance. In addition, an insulating printed circuit board, a house, or the like using the sealing material as in the present embodiment may be provided.
The description of each embodiment and the disclosure of the figures described above are merely examples for describing the invention described in the claims, and the invention described in the claims is not limited by the description of the embodiments or the disclosure of the figures described above.
REFERENCE SIGNS LIST
10 Device part
11 Electronic element
12 Device resin part
15 Device housing
30 Fiber member (for example, highly thermally conductive fiber)
50 Outer housing
60 Heat transfer member
Patent Application
20240090175
