Filling of holes, grooves or trenches

Industry

CPC
H01L21/76877

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76877Filling of holes, grooves or trenches

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure with via extending across adjacent conducti...
- Patent number 11,967,550
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Wei Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method of the same
- Patent number 11,967,553
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D NAND gate stack reinforcement
- Patent number 11,967,524
- Issue date Apr 23, 2024
- Applied Materials, Inc.
- Praket Prakash Jha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating microelectronic devices with contacts to co...
- Patent number 11,967,556
- Issue date Apr 23, 2024
- Biow Hiem Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming interconnect structures in semiconductor fabrica...
- Patent number 11,967,552
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with sidewall interconnection structure and me...
- Patent number 11,961,787
- Issue date Apr 16, 2024
- Institute of Microelectronics, Chinese Academy of Sciences
- Huilong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuitry, memory circuitry comprising strings of memory...
- Patent number 11,961,801
- Issue date Apr 16, 2024
- Micron Technology, Inc.
- Lifang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for controlling stress variation in a material...
- Patent number 11,961,722
- Issue date Apr 16, 2024
- SPTS Technologies Limited
- Anthony Wilby
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Staircase formation in three-dimensional memory device
- Patent number 11,961,760
- Issue date Apr 16, 2024
- Yangtze Memory Technologies Co., Ltd.
- Yu Ting Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via for semiconductor device connection and methods of forming the...
- Patent number 11,961,800
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to dual-sided radio-frequency package w...
- Patent number 11,961,805
- Issue date Apr 16, 2024
- Skyworks Solutions, Inc.
- Howard E. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate structure and method of manufacturing the same
- Patent number 11,961,799
- Issue date Apr 16, 2024
- Advanced Semiconductor Engineering, Inc.
- Wen Hung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having high breakdown voltage etch-stop layer
- Patent number 11,961,803
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Joung-Wei Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,961,882
- Issue date Apr 16, 2024
- Samsung Electronics Co., Ltd.
- Shaofeng Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual metal gate structure having portions of metal gate layers in c...
- Patent number 11,955,532
- Issue date Apr 9, 2024
- Intel Corporation
- Jeffrey S. Leib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for interlevel dielectric layer with regions o...
- Patent number 11,955,421
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Anhao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a porous dielectric layer, and metho...
- Patent number 11,955,424
- Issue date Apr 9, 2024
- Adeia Semiconductor Solutions LLC
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous metal line compositions for advanced integrated circu...
- Patent number 11,955,534
- Issue date Apr 9, 2024
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch damage and ESL free dual damascene metal interconnect
- Patent number 11,955,376
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sunil Kumar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 11,955,525
- Issue date Apr 9, 2024
- Samsung Electronics Co., Ltd.
- Junghwan Huh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive element for semiconductor devices
- Patent number 11,955,380
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Chiang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,955,428
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsin-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device and manufacturing method thereof
- Patent number 11,955,429
- Issue date Apr 9, 2024
- SK hynix Inc.
- Chan Ho Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with redistribution structure and manufacturi...
- Patent number 11,955,439
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming conductive feature including cleaning step
- Patent number 11,955,329
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Differential hardmasks for modulation of electrobucket sensitivity
- Patent number 11,955,377
- Issue date Apr 9, 2024
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure with anti-adhesion layer
- Patent number 11,948,835
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Che-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench contact structures for advanced integrated circuit structure...
- Patent number 11,948,997
- Issue date Apr 2, 2024
- Intel Corporation
- Subhash M. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having vertical conductive graphene and met...
- Patent number 11,948,837
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Fu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,948,890
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TRANSISTOR DEVICE AND METHOD OF FABRICATING CONTACTS TO A SEMICONDU...
- Publication number 20240136411
- Publication date Apr 25, 2024
- Infineon Technologies Austria AG
- Seung Hwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Barrier-Free Approach for Forming Contact Plugs
- Publication number 20240136227
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION RAIL BETWEEN BACKSIDE POWER RAILS
- Publication number 20240136253
- Publication date Apr 25, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE AND METHOD
- Publication number 20240138152
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Feng-Cheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FILLING A RECESSED FEATURE ON A SUBSTRATE AND RELATED S...
- Publication number 20240136224
- Publication date Apr 25, 2024
- ASM IP HOLDING B.V.
- YoungChol Byun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT END OF LINE INTERCONNECT STRUCTURES AND ASSOCIATED SYSTEMS AN...
- Publication number 20240136295
- Publication date Apr 25, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING AND USING MASK
- Publication number 20240136184
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES, MEMORY DEVICES, AND ELECTRONIC SYSTEMS
- Publication number 20240136285
- Publication date Apr 25, 2024
- Lodestar Licensing Group LLC
- Shuangqiang Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING AN INDIVIDUALIZATION ZONE OF AN INTEGRATED CIR...
- Publication number 20240128119
- Publication date Apr 18, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Stefan LANDIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240128120
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240120272
- Publication date Apr 11, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Wei-Hao LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE OF CUT END WITH SELF-ALIGNED DOUBLE PATTERNING
- Publication number 20240120200
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING AN INDIVIDUALIZATION ZONE OF AN INTEGRATED CIR...
- Publication number 20240113040
- Publication date Apr 4, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Stefan LANDIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES OF THREE-DIMENSIONAL MEMORY DEVICES
- Publication number 20240114687
- Publication date Apr 4, 2024
- Yangtze Memory Technologies Co., Ltd.
- Kun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES
- Publication number 20240112952
- Publication date Apr 4, 2024
- Intel Corporation
- HUI JAE YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL FILL STRUCTURES FOR ISOLATORS TO MEET METAL DENSITY AND HIGH...
- Publication number 20240112953
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey Alan West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALLY WIDENED PROFILE FOR NANOSCALE WIRING STRUCTURE
- Publication number 20240113018
- Publication date Apr 4, 2024
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structures And Methods Of Forming The Same
- Publication number 20240113011
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chiung Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPLIT VIA STRUCTURES COUPLED TO CONDUCTIVE LINES FOR ADVANCED INTEG...
- Publication number 20240113019
- Publication date Apr 4, 2024
- Intel Corporation
- Leonard P. GULER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mask for X-Ray Lithography and Metrology
- Publication number 20240112913
- Publication date Apr 4, 2024
- Anne Sakdinawat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BURIED VIA THROUGH FRONT-SIDE AND BACK-SIDE METALLIZATION LAYERS WI...
- Publication number 20240105584
- Publication date Mar 28, 2024
- Intel Corporation
- Abhishek Anil Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240105507
- Publication date Mar 28, 2024
- SK HYNIX INC.
- Nam Jae LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) DEVICE WITH METAL LAYER INCLUDING STAGGERED...
- Publication number 20240105589
- Publication date Mar 28, 2024
- Intel Corporation
- Shao Ming Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIDDLE OF LINE DIELECTRIC LAYER ENGINEERING FOR VIA VOID PREVENTION
- Publication number 20240105505
- Publication date Mar 28, 2024
- Applied Materials, Inc.
- Nicolas Louis BREIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES WITH CONTACTS USING NITRIDIZED MOLYBDENUM
- Publication number 20240105508
- Publication date Mar 28, 2024
- Intel Corporation
- Jitendra Kumar Jha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240105591
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia Chen LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP LINES AND SHALLOW LINES IN SIGNAL CONDUCTING PATHS
- Publication number 20240105601
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-An LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) DEVICE WITH MULTILAYER METAL LINE
- Publication number 20240105588
- Publication date Mar 28, 2024
- Intel Corporation
- Ilya V. Karpov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFERENTIATED CONDUCTIVE LINES FOR ADVANCED INTEGRATED CIRCUIT STR...
- Publication number 20240105598
- Publication date Mar 28, 2024
- Intel Corporation
- Leonard P. GULER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR DEVICE
- Publication number 20240105604
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- Sung-Hun Lee
- H01 - BASIC ELECTRIC ELEMENTS

Filling of holes, grooves or trenches

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor structure with via extending across adjacent conducti...

Semiconductor package and manufacturing method of the same

3D NAND gate stack reinforcement

Methods for fabricating microelectronic devices with contacts to co...

Methods of forming interconnect structures in semiconductor fabrica...

Semiconductor device with sidewall interconnection structure and me...

Integrated circuitry, memory circuitry comprising strings of memory...

Method and apparatus for controlling stress variation in a material...

Staircase formation in three-dimensional memory device

Via for semiconductor device connection and methods of forming the...

Devices and methods related to dual-sided radio-frequency package w...

Semiconductor substrate structure and method of manufacturing the same

Semiconductor structure having high breakdown voltage etch-stop layer

Semiconductor device

Dual metal gate structure having portions of metal gate layers in c...

Structure and method for interlevel dielectric layer with regions o...

Semiconductor device including a porous dielectric layer, and metho...

Heterogeneous metal line compositions for advanced integrated circu...

Etch damage and ESL free dual damascene metal interconnect

Semiconductor device and method of forming the same

Conductive element for semiconductor devices

Semiconductor structure and manufacturing method thereof

Three-dimensional memory device and manufacturing method thereof

Semiconductor package with redistribution structure and manufacturi...

Method of forming conductive feature including cleaning step

Differential hardmasks for modulation of electrobucket sensitivity

Interconnection structure with anti-adhesion layer

Trench contact structures for advanced integrated circuit structure...

Semiconductor structure having vertical conductive graphene and met...

Semiconductor package and method

Patents Applicationslast 30 patents

TRANSISTOR DEVICE AND METHOD OF FABRICATING CONTACTS TO A SEMICONDU...

Barrier-Free Approach for Forming Contact Plugs

ISOLATION RAIL BETWEEN BACKSIDE POWER RAILS

THREE-DIMENSIONAL MEMORY DEVICE AND METHOD

METHODS FOR FILLING A RECESSED FEATURE ON A SUBSTRATE AND RELATED S...

FRONT END OF LINE INTERCONNECT STRUCTURES AND ASSOCIATED SYSTEMS AN...

METHOD FOR FORMING AND USING MASK

MICROELECTRONIC DEVICES, MEMORY DEVICES, AND ELECTRONIC SYSTEMS

METHOD FOR PRODUCING AN INDIVIDUALIZATION ZONE OF AN INTEGRATED CIR...

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

METHOD AND STRUCTURE OF CUT END WITH SELF-ALIGNED DOUBLE PATTERNING

METHOD FOR PRODUCING AN INDIVIDUALIZATION ZONE OF AN INTEGRATED CIR...

INTERCONNECT STRUCTURES OF THREE-DIMENSIONAL MEMORY DEVICES

INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES

METAL FILL STRUCTURES FOR ISOLATORS TO MEET METAL DENSITY AND HIGH...

LOCALLY WIDENED PROFILE FOR NANOSCALE WIRING STRUCTURE

Semiconductor Structures And Methods Of Forming The Same

SPLIT VIA STRUCTURES COUPLED TO CONDUCTIVE LINES FOR ADVANCED INTEG...

Mask for X-Ray Lithography and Metrology

BURIED VIA THROUGH FRONT-SIDE AND BACK-SIDE METALLIZATION LAYERS WI...

SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT (IC) DEVICE WITH METAL LAYER INCLUDING STAGGERED...

MIDDLE OF LINE DIELECTRIC LAYER ENGINEERING FOR VIA VOID PREVENTION

INTEGRATED CIRCUIT DEVICES WITH CONTACTS USING NITRIDIZED MOLYBDENUM

INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME

DEEP LINES AND SHALLOW LINES IN SIGNAL CONDUCTING PATHS

INTEGRATED CIRCUIT (IC) DEVICE WITH MULTILAYER METAL LINE

DIFFERENTIATED CONDUCTIVE LINES FOR ADVANCED INTEGRATED CIRCUIT STR...

THREE-DIMENSIONAL SEMICONDUCTOR DEVICE