Filling of holes, grooves or trenches

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H01L21/76877

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76877Filling of holes, grooves or trenches

Industries

Patents Grantslast 30 patents

Information Patent Grant
Methods of forming microelectronic devices, and related electronic...
- Patent number 12,205,846
- Issue date Jan 21, 2025
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid method for forming semiconductor interconnect structure
- Patent number 12,205,886
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Kang Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a manufacturing method thereof
- Patent number 12,199,014
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Kyeong Bin Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having interconnection lines with different li...
- Patent number 12,199,042
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Wonhyuk Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure, circuit and electronic apparatus includi...
- Patent number 12,199,031
- Issue date Jan 14, 2025
- Institute of Microelectronics, Chinese Academy of Sciences
- Huilong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extended via semiconductor structure and device
- Patent number 12,199,033
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung Hsun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate line plug structures for advanced integrated circuit structure...
- Patent number 12,199,167
- Issue date Jan 14, 2025
- Intel Corporation
- Byron Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plugs for interconnect lines for advanced integrated circuit struct...
- Patent number 12,199,168
- Issue date Jan 14, 2025
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Template, method of manufacturing template, and method of manufactu...
- Patent number 12,198,976
- Issue date Jan 14, 2025
- Kioxia Corporation
- Kazuhiro Takahata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal interconnection structure and manufacturing method thereof
- Patent number 12,198,980
- Issue date Jan 14, 2025
- Shanghai Integrated Circuit Manufacturing Innovation Center Co., Ltd.
- Bao Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch method for opening a source line in flash memory
- Patent number 12,193,227
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yong-Sheng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device and a semiconductor...
- Patent number 12,191,304
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tung Ying Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor device and semiconductor device
- Patent number 12,193,212
- Issue date Jan 7, 2025
- CHANIGXIN MEMORY TECHNOLOGIES, INC.
- Feng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement and method of making
- Patent number 12,191,248
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Wan-Yu Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,191,144
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Yi Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistivity tungsten film and method of manufacture
- Patent number 12,191,198
- Issue date Jan 7, 2025
- Applied Materials, Inc.
- Feihu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor device
- Patent number 12,189,284
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Min Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Variable graduated capacitor structure and methods for forming the...
- Patent number 12,191,247
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jheng-Hong Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 12,191,270
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna with graded dielectirc and method of making the same
- Patent number 12,191,571
- Issue date Jan 7, 2025
- Intel Corporation
- Saravana Maruthamuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional semiconductor device
- Patent number 12,183,677
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Sung-Hun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal hard masks for reducing line bending
- Patent number 12,183,577
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Kai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PVD target design and semiconductor devices formed using the same
- Patent number 12,180,576
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Hsi Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated circuit and method of forming the same
- Patent number 12,183,779
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Che Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid metal line structure
- Patent number 12,183,671
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pokuan Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device with doped semiconductor bridge str...
- Patent number 12,178,040
- Issue date Dec 24, 2024
- SanDisk Technologies LLC
- Ryousuke Itou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor structure
- Patent number 12,176,344
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device including support structures
- Patent number 12,176,300
- Issue date Dec 24, 2024
- Micron Technology, Inc.
- Andrew Zhe Wei Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective passivation and selective deposition
- Patent number 12,170,197
- Issue date Dec 17, 2024
- ASM IP Holding B.V.
- Eva E. Tois
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices and memory devices including conductive lev...
- Patent number 12,170,250
- Issue date Dec 17, 2024
- Micron Technology, Inc.
- Jordan D. Greenlee
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR STRUCTURE
- Publication number 20250031433
- Publication date Jan 23, 2025
- United Semiconductor (Xiamen) Co., Ltd.
- Shouguo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR DEPOSITING A MOLYBDENUM METAL FILM ON A DIELECTRIC SURF...
- Publication number 20250029834
- Publication date Jan 23, 2025
- ASM IP HOLDING B.V.
- Bhushan Zope
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250029882
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- Weizhong ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING AN INTERCONNECT VIA
- Publication number 20250029872
- Publication date Jan 23, 2025
- IMEC vzw
- Anshul Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250022788
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- KYOUNG LIM SUK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC...
- Publication number 20250022902
- Publication date Jan 16, 2025
- Sony Semiconductor Solutions Corporation
- KATSUNORI TOZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR FABRICATION OF SUPERCONDUCTING INTEGRATED C...
- Publication number 20250024758
- Publication date Jan 16, 2025
- 1372934 B.C. Ltd.
- Eric Ladizinsky
- B82 - NANO-TECHNOLOGY
Information Patent Application
CONTACT OVER ACTIVE GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT...
- Publication number 20250022939
- Publication date Jan 16, 2025
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT END OF LINE INTERCONNECT STRUCTURES AND ASSOCIATED SYSTEMS AN...
- Publication number 20250022804
- Publication date Jan 16, 2025
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING CONTACT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20250024683
- Publication date Jan 16, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, QUANTUM COMPUTER, AND METHOD FOR MANUFACTURING E...
- Publication number 20250015169
- Publication date Jan 9, 2025
- Fujitsu Limited
- Masayuki Hosoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20250014988
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- SHU-CHENG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERRACED CONDUCTOR STRUCTURE FOR SEMICONDUCTOR DEVICES
- Publication number 20250014994
- Publication date Jan 9, 2025
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE AND REWORKING PROCESS
- Publication number 20250014910
- Publication date Jan 9, 2025
- NANYA TECHNOLOGY CORPORATION
- WEI-CHEN PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20250006801
- Publication date Jan 2, 2025
- SK HYNIX INC.
- Young Gwang YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250006641
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Yoon Hee KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE CONTACT INTEGRATION IN GALLIUM NITRIDE DEVICES
- Publication number 20250006593
- Publication date Jan 2, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Dong Seup Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pattern Forming Method
- Publication number 20250004378
- Publication date Jan 2, 2025
- Shin-Etsu Chemical Co., Ltd.
- Naoki KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE LINES HAVING CONDUCTIVE METAL LINER FOR ADVANCED INTEGRA...
- Publication number 20250006628
- Publication date Jan 2, 2025
- Intel Corporation
- Leonard P. GULER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM ETCH PROCESS FOR CONTACT PLUG ANCHORING
- Publication number 20250006518
- Publication date Jan 2, 2025
- Applied Materials, Inc.
- Shiyu YUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH RETREATING METAL LAYERS
- Publication number 20250006607
- Publication date Jan 2, 2025
- TEXAS INSTRUMENTS INCORPORATED
- John Carlo C. MOLINA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20250006551
- Publication date Jan 2, 2025
- NANYA TECHNOLOGY CORPORATION
- Chiang-Lin SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Feature Through Heterogeneous Stacked Film and Methods of M...
- Publication number 20240429090
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Jhen Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedding Metal-Insulator-Metal Structure In Silicon Oxide In A Cop...
- Publication number 20240429156
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Yueh Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH RECESSED PADS FOR DIE STACK INTERCONNECT...
- Publication number 20240429172
- Publication date Dec 26, 2024
- Micron Technology, Inc.
- Ruei Ying Sheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD
- Publication number 20240429044
- Publication date Dec 26, 2024
- ASM IP HOLDING B.V.
- Yan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VI...
- Publication number 20240421131
- Publication date Dec 19, 2024
- Lodestar Licensing Group LLC
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
- Publication number 20240421070
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Sunjung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED INTERCONNECTS WITH HYPERBOLOID PROFILE
- Publication number 20240421076
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESS FLOW FOR ENABLING SUBSTRATE TO DIE HYBRID BONDING
- Publication number 20240421043
- Publication date Dec 19, 2024
- Intel Corporation
- Kristof Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS

Filling of holes, grooves or trenches

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods of forming microelectronic devices, and related electronic...

Hybrid method for forming semiconductor interconnect structure

Semiconductor device and a manufacturing method thereof

Semiconductor device having interconnection lines with different li...

Interconnection structure, circuit and electronic apparatus includi...

Extended via semiconductor structure and device

Gate line plug structures for advanced integrated circuit structure...

Plugs for interconnect lines for advanced integrated circuit struct...

Template, method of manufacturing template, and method of manufactu...

Metal interconnection structure and manufacturing method thereof

Etch method for opening a source line in flash memory

Method of manufacturing a semiconductor device and a semiconductor...

Method of forming semiconductor device and semiconductor device

Semiconductor arrangement and method of making

Semiconductor device and manufacturing method thereof

Low resistivity tungsten film and method of manufacture

Method for forming semiconductor device

Variable graduated capacitor structure and methods for forming the...

Integrated circuit package and method of forming same

Antenna with graded dielectirc and method of making the same

Three-dimensional semiconductor device

Metal hard masks for reducing line bending

PVD target design and semiconductor devices formed using the same

Integrated circuit and method of forming the same

Hybrid metal line structure

Three-dimensional memory device with doped semiconductor bridge str...

Methods of forming semiconductor structure

Memory device including support structures

Selective passivation and selective deposition

Microelectronic devices and memory devices including conductive lev...

Patents Applicationslast 30 patents

METHOD FOR FABRICATING A SEMICONDUCTOR STRUCTURE

METHODS FOR DEPOSITING A MOLYBDENUM METAL FILM ON A DIELECTRIC SURF...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

METHOD FOR PRODUCING AN INTERCONNECT VIA

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC...

SYSTEMS AND METHODS FOR FABRICATION OF SUPERCONDUCTING INTEGRATED C...

CONTACT OVER ACTIVE GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT...

FRONT END OF LINE INTERCONNECT STRUCTURES AND ASSOCIATED SYSTEMS AN...

HYBRID BONDING CONTACT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE

ELECTRONIC DEVICE, QUANTUM COMPUTER, AND METHOD FOR MANUFACTURING E...

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

TERRACED CONDUCTOR STRUCTURE FOR SEMICONDUCTOR DEVICES

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE AND REWORKING PROCESS

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SUBSTRATE CONTACT INTEGRATION IN GALLIUM NITRIDE DEVICES

Pattern Forming Method

CONDUCTIVE LINES HAVING CONDUCTIVE METAL LINER FOR ADVANCED INTEGRA...

BOTTOM ETCH PROCESS FOR CONTACT PLUG ANCHORING

SEMICONDUCTOR PACKAGE WITH RETREATING METAL LAYERS

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

Contact Feature Through Heterogeneous Stacked Film and Methods of M...

Embedding Metal-Insulator-Metal Structure In Silicon Oxide In A Cop...

SEMICONDUCTOR DEVICES WITH RECESSED PADS FOR DIE STACK INTERCONNECT...

SUBSTRATE PROCESSING METHOD

PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VI...

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

ADVANCED INTERCONNECTS WITH HYPERBOLOID PROFILE

SUBSTRATE PROCESS FLOW FOR ENABLING SUBSTRATE TO DIE HYBRID BONDING