Filling of holes, grooves or trenches

Industry

CPC
H01L21/76877

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76877Filling of holes, grooves or trenches

Industries

Patents Grantslast 30 patents

Information Patent Grant
Planar slab vias for integrated circuit interconnects
- Patent number 12,341,092
- Issue date Jun 24, 2025
- Intel Corporation
- Elijah Karpov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming and using mask
- Patent number 12,341,011
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ching-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing through vias using amorphization to adjust...
- Patent number 12,341,060
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ching Kang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition tool and method for filling deep trenches
- Patent number 12,341,065
- Issue date Jun 24, 2025
- Intel Corporation
- Elijah V. Karpov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 12,341,097
- Issue date Jun 24, 2025
- Samsung Electronics Co., Ltd.
- Sangshin Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for barrier-less plug
- Patent number 12,341,013
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 12,341,025
- Issue date Jun 24, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses including band offset materials, and related memory dev...
- Patent number 12,342,544
- Issue date Jun 24, 2025
- Albert Fayrushin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 12,334,395
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiang-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Unit specific variable or adaptive metal fill and system and method...
- Patent number 12,334,396
- Issue date Jun 17, 2025
- Deca Technologies USA, Inc.
- David Ryan Bartling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Front end of line interconnect structures and associated systems an...
- Patent number 12,334,448
- Issue date Jun 17, 2025
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-gate semiconductor device and method for forming the same
- Patent number 12,336,213
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- I-Sheng Chen
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method for patterning a substrate using photolithography
- Patent number 12,334,391
- Issue date Jun 17, 2025
- Tokyo Electron Limited
- Katie Lutker-Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for fabricating staircase regions of a three...
- Patent number 12,334,399
- Issue date Jun 17, 2025
- Yangtze Memory Technologies Co., Ltd.
- Xiongyu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Middle-of-line interconnect structure and manufacturing method
- Patent number 12,334,435
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 12,334,389
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through vias with test structure
- Patent number 12,334,415
- Issue date Jun 17, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Tzung-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 12,327,787
- Issue date Jun 10, 2025
- Kioxia Corporation
- Takashi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,328,882
- Issue date Jun 10, 2025
- Samsung Electronics Co., Ltd.
- Shaofeng Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact with a silicide region
- Patent number 12,328,890
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Wen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate to source drain interconnects
- Patent number 12,327,788
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shuen-Shin Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,327,759
- Issue date Jun 10, 2025
- Samsung Electronics Co., Ltd.
- Sang Cheol Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Void-free contact trench fill in gate-all-around FET architecture
- Patent number 12,327,761
- Issue date Jun 10, 2025
- Applied Materials, Inc.
- Nicolas Louis Breil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interlayer dielectric layer
- Patent number 12,322,648
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Joung-Wei Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory structure and method for forming the same
- Patent number 12,322,698
- Issue date Jun 3, 2025
- Winbond Electronics Corp.
- Hung-Jung Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming high density, high shorting margin, and low capac...
- Patent number 12,322,699
- Issue date Jun 3, 2025
- Tahoe Research, LTD.
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching to reduce line wiggling
- Patent number 12,322,651
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned interconnect structure
- Patent number 12,322,723
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Chieh Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices including a stair step structure adjacent a substantially p...
- Patent number 12,317,489
- Issue date May 27, 2025
- Micron Technology, Inc.
- Troy R. Sorensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphene barrier layer for reduced contact resistance
- Patent number 12,315,811
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR CIRCUIT WITH SELECTIVE BACKSIDE POWER AND GROUND DIST...
- Publication number 20250210464
- Publication date Jun 26, 2025
- NXP B.V.
- Douglas Michael Reber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRIVERS INCLUDING TWO-DIMENSIONAL MATERIALS, AND RELATED NON-VOLATI...
- Publication number 20250212402
- Publication date Jun 26, 2025
- Lodestar Licensing Group LLC
- Kamal M. Karda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER LINE STRUCTURE
- Publication number 20250210524
- Publication date Jun 26, 2025
- DAI NIPPON PRINTING CO., LTD.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES COMPRISING MULTILEVEL BITLINES, AND RELATED METH...
- Publication number 20250210511
- Publication date Jun 26, 2025
- Micron Technology, Inc.
- Yoshiaki Fukuzumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20250210516
- Publication date Jun 26, 2025
- SK keyfoundry Inc.
- Jeong Geun BAK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20250201576
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ru-Gun LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS OF FORMING STRUCTURES
- Publication number 20250201578
- Publication date Jun 19, 2025
- ASM IP HOLDING B.V.
- Debanjan Jana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES
- Publication number 20250201629
- Publication date Jun 19, 2025
- Intel Corporation
- HUI JAE YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC DEVICE WITH CHIP TO PACKAGE INTERCONNECTS FROM A COPPER METAL IN...
- Publication number 20250201751
- Publication date Jun 19, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Manoj Kumar Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE WITH CO-METALIZED ELECTRICAL CONTACT
- Publication number 20250204000
- Publication date Jun 19, 2025
- Intel Corporation
- Kan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENLARGING CONTACT AREA AND PROCESS WINDOW FOR A CONTACT VIA
- Publication number 20250201626
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Zhen YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FEATURE OF A SEMICONDUCTOR DEVICE
- Publication number 20250201627
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- U-Ting Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPLACEMENT FULLY ALIGNED VIA AND METAL LINE
- Publication number 20250201699
- Publication date Jun 19, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE PATTERNING APPROACH BY DIRECT METAL ETCH
- Publication number 20250191973
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Wen TIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE...
- Publication number 20250194201
- Publication date Jun 12, 2025
- Intel Corporation
- Subhash M. JOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE
- Publication number 20250194227
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250194113
- Publication date Jun 12, 2025
- SK HYNIX INC.
- Seung Hwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL DEVICE CAPACITANCE ENHANCEMENT
- Publication number 20250194120
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lu-Sheng Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250192038
- Publication date Jun 12, 2025
- NANYA TECHNOLOGY CORPORATION
- YING-CHENG CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250192044
- Publication date Jun 12, 2025
- NANYA TECHNOLOGY CORPORATION
- YING-CHENG CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHENE LINERS AND CAPS FOR SEMICONDUCTOR STRUCTURES
- Publication number 20250192052
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGE STRUCTURE AND FAN-OUT PACKAGE METHOD
- Publication number 20250192091
- Publication date Jun 12, 2025
- Institute of Semiconductors, Guangdong Academy of Sciences
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED ACTIVE REGIONS AND PASSIVATION LAYER AND METHODS OF MA...
- Publication number 20250194150
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Hung Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY SELF-ALIGNED VIAS USING A HARDMASK AND ANTISPACERS
- Publication number 20250191970
- Publication date Jun 12, 2025
- TOKYO ELECTRON LIMITED
- David Power
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250192025
- Publication date Jun 12, 2025
- RENESAS ELECTRONICS CORPORATION
- Yuki SUGIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250192043
- Publication date Jun 12, 2025
- NANYA TECHNOLOGY CORPORATION
- YING-CHENG CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal-Insulator-Metal Structure
- Publication number 20250192026
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED VIA STRUCTURE, SEMICONDUCTOR DEVICE INCLUDING STACKED VIA S...
- Publication number 20250183156
- Publication date Jun 5, 2025
- DB HiTek Co., Ltd.
- In Gon BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES WITH A POLYSILICON STRUCTURE ABOVE A STAIRC...
- Publication number 20250183196
- Publication date Jun 5, 2025
- Lodestar Licensing Group LLC
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method Of Forming Backside Power Rails
- Publication number 20250185330
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS

Filling of holes, grooves or trenches

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Planar slab vias for integrated circuit interconnects

Method for forming and using mask

Method for manufacturing through vias using amorphization to adjust...

Deposition tool and method for filling deep trenches

Semiconductor devices

Method and structure for barrier-less plug

Microelectronic assemblies

Apparatuses including band offset materials, and related memory dev...

Semiconductor structure and method for forming the same

Unit specific variable or adaptive metal fill and system and method...

Front end of line interconnect structures and associated systems an...

Multi-gate semiconductor device and method for forming the same

Method for patterning a substrate using photolithography

Structures and methods for fabricating staircase regions of a three...

Middle-of-line interconnect structure and manufacturing method

Manufacturing method of semiconductor device

Through vias with test structure

Semiconductor memory device

Semiconductor device

Contact with a silicide region

Gate to source drain interconnects

Semiconductor device and method for fabricating the same

Void-free contact trench fill in gate-all-around FET architecture

Interlayer dielectric layer

Semiconductor memory structure and method for forming the same

Method of forming high density, high shorting margin, and low capac...

Etching to reduce line wiggling

Self-aligned interconnect structure

Devices including a stair step structure adjacent a substantially p...

Graphene barrier layer for reduced contact resistance

Patents Applicationslast 30 patents

SEMICONDUCTOR CIRCUIT WITH SELECTIVE BACKSIDE POWER AND GROUND DIST...

DRIVERS INCLUDING TWO-DIMENSIONAL MATERIALS, AND RELATED NON-VOLATI...

MULTI-LAYER LINE STRUCTURE

ELECTRONIC DEVICES COMPRISING MULTILEVEL BITLINES, AND RELATED METH...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES

STRUCTURES AND METHODS OF FORMING STRUCTURES

INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES

IC DEVICE WITH CHIP TO PACKAGE INTERCONNECTS FROM A COPPER METAL IN...

INTEGRATED CIRCUIT DEVICE WITH CO-METALIZED ELECTRICAL CONTACT

ENLARGING CONTACT AREA AND PROCESS WINDOW FOR A CONTACT VIA

CONDUCTIVE FEATURE OF A SEMICONDUCTOR DEVICE

REPLACEMENT FULLY ALIGNED VIA AND METAL LINE

DOUBLE PATTERNING APPROACH BY DIRECT METAL ETCH

TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE...

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

METAL-INSULATOR-METAL DEVICE CAPACITANCE ENHANCEMENT

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

GRAPHENE LINERS AND CAPS FOR SEMICONDUCTOR STRUCTURES

FAN-OUT PACKAGE STRUCTURE AND FAN-OUT PACKAGE METHOD

SELF-ALIGNED ACTIVE REGIONS AND PASSIVATION LAYER AND METHODS OF MA...

FULLY SELF-ALIGNED VIAS USING A HARDMASK AND ANTISPACERS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Metal-Insulator-Metal Structure

STACKED VIA STRUCTURE, SEMICONDUCTOR DEVICE INCLUDING STACKED VIA S...

MICROELECTRONIC DEVICES WITH A POLYSILICON STRUCTURE ABOVE A STAIRC...

Method Of Forming Backside Power Rails