Filling of holes, grooves or trenches

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H01L21/76877

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76877Filling of holes, grooves or trenches

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Microelectronic devices with through-substrate interconnects and as...
- Patent number 12,368,096
- Issue date Jul 22, 2025
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-substrate composite semiconductor device
- Patent number 12,368,052
- Issue date Jul 22, 2025
- Infineon Technologies Austria AG
- Christian Fachmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor device
- Patent number 12,368,098
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pei-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure of cut end with self-aligned double patterning
- Patent number 12,368,046
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and methods of forming the same
- Patent number 12,368,076
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-An Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device
- Patent number 12,369,292
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Hsin Nien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-side power rail design and method of making same
- Patent number 12,368,078
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chao Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diagonal vias in semiconductor structures
- Patent number 12,368,106
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for fabrication of superconducting integrated c...
- Patent number 12,369,501
- Issue date Jul 22, 2025
- 1372934 B.C. LTD
- Eric Ladizinsky
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method for manufacturing semiconductor structure, and semiconductor...
- Patent number 12,362,192
- Issue date Jul 15, 2025
- CHANGXI MEMORY TECHNOLOGIES, INC.
- Yexiao Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test structure of wafer and method of manufacturing test structure...
- Patent number 12,362,242
- Issue date Jul 15, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Hongcheng Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including through die via
- Patent number 12,362,262
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for improving profile of interconnect structure
- Patent number 12,362,227
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Neng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structure for semiconductor device
- Patent number 12,362,234
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsu-Kai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices
- Patent number 12,362,177
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preventing line bending during metal fill process
- Patent number 12,362,188
- Issue date Jul 15, 2025
- Lam Research Corporation
- Adam Jandl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing an integrated circuit chip including a back-sid...
- Patent number 12,362,236
- Issue date Jul 15, 2025
- Imec VZW
- Anabela Veloso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Guard ring structure
- Patent number 12,354,975
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit including standard cells and at least one capaci...
- Patent number 12,356,725
- Issue date Jul 8, 2025
- STMicroelectronics (Rousset) SAS
- Abderrezak Marzaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits (ICs) employing multi-pattern metallization to...
- Patent number 12,354,952
- Issue date Jul 8, 2025
- QUALCOMM Incorporated
- Bed Raj Kandel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt based interconnects and methods of fabrication thereof
- Patent number 12,354,956
- Issue date Jul 8, 2025
- Tahoe Research, LTD.
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for multiple step directional patterning
- Patent number 12,354,873
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Kai Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Replacement buried power rail in backside power delivery
- Patent number 12,354,991
- Issue date Jul 8, 2025
- Tokyo Electron Limited
- Hoyoung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing
- Patent number 12,349,344
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Josh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with a protection cap at an end port...
- Patent number 12,347,722
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,347,723
- Issue date Jul 1, 2025
- Kioxia Corporation
- Yumiko Miyano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip with graphene based interconnect
- Patent number 12,347,776
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Treatment of spin on organic material to improve wet resistance
- Patent number 12,347,727
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tzu-Yang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 12,347,766
- Issue date Jul 1, 2025
- Winbond Electronics Corp.
- Hao-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resistor within a via
- Patent number 12,347,769
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Han Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING METAL STRUCTURE HAVING FUNNEL-SHAPED INTERC...
- Publication number 20250239519
- Publication date Jul 24, 2025
- NANYA TECHNOLOGY CORPORATION
- MIN-CHUNG CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY ARRAYS AND METHODS USED IN FORMING A MEMORY ARRAY
- Publication number 20250239520
- Publication date Jul 24, 2025
- Lodestar Licensing Group LLC
- Harsh Narendrakumar Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED CONTACTS
- Publication number 20250239486
- Publication date Jul 24, 2025
- Intel Corporation
- Mark T. BOHR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING INTERCONNECT STRUCTURES
- Publication number 20250233015
- Publication date Jul 17, 2025
- Applied Materials, Inc.
- Bhaskar Jyoti Bhuyan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250233016
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- JHENG-HONG JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND PREPARING METHOD THEREOF
- Publication number 20250233033
- Publication date Jul 17, 2025
- TRIPLE WIN TECHNOLOGY (SHENZHEN) CO.LTD.
- HUNG-TA LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF FABRICATING SAME
- Publication number 20250233014
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jheng-Hong Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH ULTRA THICK METAL AND MANUFACTURING ME...
- Publication number 20250233069
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jyun-Min Syu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250233084
- Publication date Jul 17, 2025
- KIOXIA Corporation
- Kyosuke NANAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE INCLUDING DISCHARGE STRUCTURES AND METHOD F...
- Publication number 20250226231
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- YAO-JEN TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR FORMING INTEGRATED HIGH DENSITY MIM CAPACITOR
- Publication number 20250227942
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE COMPRISING A PLURALITY OF INTEGRATED CIRCUITS AND METHOD OF...
- Publication number 20250226304
- Publication date Jul 10, 2025
- STMicroelectronics International N.V.
- Romain COFFY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRAM CELL STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250226316
- Publication date Jul 10, 2025
- ETRON TECHNOLOGY, INC.
- Ming-Hong KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages And Methods Of Forming The Same
- Publication number 20250219024
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC WINDOWS FOR GROUPS OF VIAS THROUGH SEMICONDUCTOR SUBSTRATES
- Publication number 20250218933
- Publication date Jul 3, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORTHOGONAL METAL LINES AT THE SAME METAL LEVEL
- Publication number 20250218863
- Publication date Jul 3, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRIVERS INCLUDING TWO-DIMENSIONAL MATERIALS, AND RELATED NON-VOLATI...
- Publication number 20250212402
- Publication date Jun 26, 2025
- Lodestar Licensing Group LLC
- Kamal M. Karda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CIRCUIT WITH SELECTIVE BACKSIDE POWER AND GROUND DIST...
- Publication number 20250210464
- Publication date Jun 26, 2025
- NXP B.V.
- Douglas Michael Reber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER LINE STRUCTURE
- Publication number 20250210524
- Publication date Jun 26, 2025
- DAI NIPPON PRINTING CO., LTD.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES COMPRISING MULTILEVEL BITLINES, AND RELATED METH...
- Publication number 20250210511
- Publication date Jun 26, 2025
- Micron Technology, Inc.
- Yoshiaki Fukuzumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20250210516
- Publication date Jun 26, 2025
- SK keyfoundry Inc.
- Jeong Geun BAK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20250201576
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ru-Gun LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS OF FORMING STRUCTURES
- Publication number 20250201578
- Publication date Jun 19, 2025
- ASM IP HOLDING B.V.
- Debanjan Jana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES
- Publication number 20250201629
- Publication date Jun 19, 2025
- Intel Corporation
- HUI JAE YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC DEVICE WITH CHIP TO PACKAGE INTERCONNECTS FROM A COPPER METAL IN...
- Publication number 20250201751
- Publication date Jun 19, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Manoj Kumar Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE WITH CO-METALIZED ELECTRICAL CONTACT
- Publication number 20250204000
- Publication date Jun 19, 2025
- Intel Corporation
- Kan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENLARGING CONTACT AREA AND PROCESS WINDOW FOR A CONTACT VIA
- Publication number 20250201626
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Zhen YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FEATURE OF A SEMICONDUCTOR DEVICE
- Publication number 20250201627
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- U-Ting Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPLACEMENT FULLY ALIGNED VIA AND METAL LINE
- Publication number 20250201699
- Publication date Jun 19, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE...
- Publication number 20250194201
- Publication date Jun 12, 2025
- Intel Corporation
- Subhash M. JOSHI
- H01 - BASIC ELECTRIC ELEMENTS

Filling of holes, grooves or trenches

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Microelectronic devices with through-substrate interconnects and as...

Chip-substrate composite semiconductor device

Methods of forming semiconductor device

Method and structure of cut end with self-aligned double patterning

Interconnect structure and methods of forming the same

Memory device

Dual-side power rail design and method of making same

Diagonal vias in semiconductor structures

Systems and methods for fabrication of superconducting integrated c...

Method for manufacturing semiconductor structure, and semiconductor...

Test structure of wafer and method of manufacturing test structure...

Semiconductor device including through die via

Method for improving profile of interconnect structure

Contact structure for semiconductor device

Method of manufacturing semiconductor devices

Method for preventing line bending during metal fill process

Method of producing an integrated circuit chip including a back-sid...

Guard ring structure

Integrated circuit including standard cells and at least one capaci...

Integrated circuits (ICs) employing multi-pattern metallization to...

Cobalt based interconnects and methods of fabrication thereof

System and method for multiple step directional patterning

Replacement buried power rail in backside power delivery

Semiconductor device and method of manufacturing

Semiconductor device structure with a protection cap at an end port...

Semiconductor device

Integrated chip with graphene based interconnect

Treatment of spin on organic material to improve wet resistance

Semiconductor structure and method for forming the same

Resistor within a via

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING METAL STRUCTURE HAVING FUNNEL-SHAPED INTERC...

MEMORY ARRAYS AND METHODS USED IN FORMING A MEMORY ARRAY

SELF-ALIGNED CONTACTS

METHODS OF MANUFACTURING INTERCONNECT STRUCTURES

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

PACKAGING STRUCTURE AND PREPARING METHOD THEREOF

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF FABRICATING SAME

SEMICONDUCTOR STRUCTURE WITH ULTRA THICK METAL AND MANUFACTURING ME...

SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR STRUCTURE INCLUDING DISCHARGE STRUCTURES AND METHOD F...

STRUCTURE AND METHOD FOR FORMING INTEGRATED HIGH DENSITY MIM CAPACITOR

DEVICE COMPRISING A PLURALITY OF INTEGRATED CIRCUITS AND METHOD OF...

DRAM CELL STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor Packages And Methods Of Forming The Same

DIELECTRIC WINDOWS FOR GROUPS OF VIAS THROUGH SEMICONDUCTOR SUBSTRATES

ORTHOGONAL METAL LINES AT THE SAME METAL LEVEL

DRIVERS INCLUDING TWO-DIMENSIONAL MATERIALS, AND RELATED NON-VOLATI...

SEMICONDUCTOR CIRCUIT WITH SELECTIVE BACKSIDE POWER AND GROUND DIST...

MULTI-LAYER LINE STRUCTURE

ELECTRONIC DEVICES COMPRISING MULTILEVEL BITLINES, AND RELATED METH...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES

STRUCTURES AND METHODS OF FORMING STRUCTURES

INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES

IC DEVICE WITH CHIP TO PACKAGE INTERCONNECTS FROM A COPPER METAL IN...

INTEGRATED CIRCUIT DEVICE WITH CO-METALIZED ELECTRICAL CONTACT

ENLARGING CONTACT AREA AND PROCESS WINDOW FOR A CONTACT VIA

CONDUCTIVE FEATURE OF A SEMICONDUCTOR DEVICE

REPLACEMENT FULLY ALIGNED VIA AND METAL LINE

TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE...