Filling of holes, grooves or trenches

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H01L21/76877

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76877Filling of holes, grooves or trenches

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Multi-layer line structure
- Patent number 12,255,145
- Issue date Mar 18, 2025
- Dai Nippon Printing Co., Ltd.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit, system and method of forming same
- Patent number 12,255,238
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,255,095
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Kai Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench contact structures for advanced integrated circuit structure...
- Patent number 12,255,247
- Issue date Mar 18, 2025
- Intel Corporation
- Subhash M. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 12,255,184
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned active regions and passivation layer and methods of ma...
- Patent number 12,255,236
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Hung Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphene liners and caps for semiconductor structures
- Patent number 12,255,144
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for forming semiconductor device
- Patent number 12,256,535
- Issue date Mar 18, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Sheng Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,255,094
- Issue date Mar 18, 2025
- Samsung Electronics Co., Ltd.
- Jun Hyuk Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure of semiconductor device and method of formin...
- Patent number 12,249,574
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tung Ying Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical edge blocking (VEB) technique for increasing patterning pr...
- Patent number 12,249,541
- Issue date Mar 11, 2025
- Intel Corporation
- Leonard P. Guler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with stacked conductive plugs and me...
- Patent number 12,249,576
- Issue date Mar 11, 2025
- NANYA TECHNOLOGY CORPORATION
- Yi-Hsien Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with an interconnect structure in a...
- Patent number 12,249,542
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hao Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection structures for bonded wafers
- Patent number 12,243,772
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ssu-Chiang Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liner and barrier layer in dual damascene cu interconnect for enhan...
- Patent number 12,243,773
- Issue date Mar 4, 2025
- SiEn (QingDao) Integrated Circuits Co., Ltd
- Zhaosheng Meng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 12,243,815
- Issue date Mar 4, 2025
- Samsung Electronics Co., Ltd.
- Eui Bok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-mask alternating line deposition
- Patent number 12,243,819
- Issue date Mar 4, 2025
- International Business Machines Corporation
- Brent Alan Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with fine metal lines for BEOL structure and m...
- Patent number 12,243,820
- Issue date Mar 4, 2025
- Samsung Electronics Co., Ltd.
- Taeyong Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive line structures and method of forming same
- Patent number 12,243,821
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hiranmay Biswas
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for manufacturing semiconductor structure having raised via...
- Patent number 12,243,826
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Chiang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double patterning approach by direct metal etch
- Patent number 12,243,775
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of preparing a high density interconnect printed circuit boa...
- Patent number 12,245,383
- Issue date Mar 4, 2025
- Atotech Deutschland GmbH & Co. KG
- Bert Reents
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Metal-insulator-metal (MIM) capacitor including an insulator cup an...
- Patent number 12,245,439
- Issue date Mar 4, 2025
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating contact structure
- Patent number 12,237,218
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chang-Ting Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,237,342
- Issue date Feb 25, 2025
- Japan Display Inc.
- Akihiro Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Digital pen with enhanced educational and therapeutic feedback
- Patent number 12,233,661
- Issue date Feb 25, 2025
- Lauren Michelle Neubauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with stacked conductive plugs and me...
- Patent number 12,237,260
- Issue date Feb 25, 2025
- NANYA TECHNOLOGY CORPORATION
- Yi-Hsien Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 12,237,213
- Issue date Feb 25, 2025
- Institute of Microelectronics, Chinese Academy of Sciences
- Libin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device
- Patent number 12,237,214
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Nien Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices comprising multilevel bitlines, and related meth...
- Patent number 12,237,259
- Issue date Feb 25, 2025
- Micron Technology, Inc.
- Yoshiaki Fukuzumi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ETCH METHOD FOR OPENING A SOURCE LINE IN FLASH MEMORY
- Publication number 20250098160
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yong-Sheng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER FABRICATION WITH POLYIMIDE TO GRAPHENE CONVERSION
- Publication number 20250096113
- Publication date Mar 20, 2025
- NXP USA, Inc.
- Douglas Michael Reber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIRGAPS IN TOP LAYERS OF SEMICONDUCTOR DEVICES
- Publication number 20250096139
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- John Jianhong ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming a Buried Interconnect Structure
- Publication number 20250096037
- Publication date Mar 20, 2025
- IMEC vzw
- Gaspard Hiblot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR DEVICE
- Publication number 20250096135
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Sung-Hun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20250096140
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Chang WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20250098283
- Publication date Mar 20, 2025
- MEDIATEK INC.
- Po-Chao TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PVD TARGET DESIGN AND SEMICONDUCTOR DEVICES FORMED USING THE SAME
- Publication number 20250092508
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Hsi WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLUGS FOR INTERCONNECT LINES FOR ADVANCED INTEGRATED CIRCUIT STRUCT...
- Publication number 20250098258
- Publication date Mar 20, 2025
- Intel Corporation
- Andrew W. YEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW CONTACT RESISTANCE VIAS IN BACKEND INTERCONNECT STRUCTURES
- Publication number 20250087533
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Hsing Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20250087608
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND METHOD OF FORMING THE SAME
- Publication number 20250089273
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Che Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20250089377
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Techniques For Providing Shielding Between Inductors Using Guard Rings
- Publication number 20250087577
- Publication date Mar 13, 2025
- Altera Corporation
- Krishna Bharath Kolluru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR PACKAGE
- Publication number 20250087581
- Publication date Mar 13, 2025
- Infineon Technologies Austria AG
- Sergey Yuferev
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250087482
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Yi CHOU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METAL HARD MASKS FOR REDUCING LINE BENDING
- Publication number 20250079172
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Kai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURES FOR HIGH STRENGTH DIELECTRIC IN HYBRID BONDING
- Publication number 20250079312
- Publication date Mar 6, 2025
- Applied Materials, Inc.
- Tyler Sherwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR DEVICE
- Publication number 20250079238
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Uihyoung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL TREATMENT ON METAL SILICIDE FOR CMOS DEVICES
- Publication number 20250081569
- Publication date Mar 6, 2025
- Applied Materials, Inc.
- Nicolas Louis BREIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH AN EMBEDDED PASSIVE DEVICE
- Publication number 20250079348
- Publication date Mar 6, 2025
- QUALCOMM Incorporated
- Kuiwon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE
- Publication number 20250079295
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chen LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID METAL LINE STRUCTURE
- Publication number 20250079298
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pokuan Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250069989
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Chih HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING SEMICONDUCTOR DEVICES
- Publication number 20250072096
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Gi Woong SHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REDUCING RESISTANCE OF CONTACT
- Publication number 20250069949
- Publication date Feb 27, 2025
- Shanghai Huali Integrated Circuit Corporation
- Zhaoqin ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES, AND RELATED MEMORY DEVICES AND ELECTRONIC...
- Publication number 20250069950
- Publication date Feb 27, 2025
- Micron Technology, Inc.
- Raja Kumar Varma Manthena
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR DEVICE INCLUDING A THROUGH-VIA STRU...
- Publication number 20250070029
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Junhyoung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...
- Publication number 20250072078
- Publication date Feb 27, 2025
- Intel Corporation
- Andrew W. YEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE PASSIVATION AND SELECTIVE DEPOSITION
- Publication number 20250069885
- Publication date Feb 27, 2025
- ASM IP HOLDING B.V.
- Eva E. Tois
- H01 - BASIC ELECTRIC ELEMENTS

Filling of holes, grooves or trenches

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multi-layer line structure

Integrated circuit, system and method of forming same

Semiconductor structure and manufacturing method thereof

Trench contact structures for advanced integrated circuit structure...

Semiconductor packages and methods of forming the same

Self-aligned active regions and passivation layer and methods of ma...

Graphene liners and caps for semiconductor structures

Semiconductor device and method for forming semiconductor device

Semiconductor device

Interconnect structure of semiconductor device and method of formin...

Vertical edge blocking (VEB) technique for increasing patterning pr...

Semiconductor device structure with stacked conductive plugs and me...

Semiconductor device structure with an interconnect structure in a...

Protection structures for bonded wafers

Liner and barrier layer in dual damascene cu interconnect for enhan...

Semiconductor device and method of fabricating the same

Single-mask alternating line deposition

Semiconductor device with fine metal lines for BEOL structure and m...

Conductive line structures and method of forming same

Method for manufacturing semiconductor structure having raised via...

Double patterning approach by direct metal etch

Method of preparing a high density interconnect printed circuit boa...

Metal-insulator-metal (MIM) capacitor including an insulator cup an...

Method of fabricating contact structure

Semiconductor device and method for manufacturing semiconductor device

Digital pen with enhanced educational and therapeutic feedback

Semiconductor device structure with stacked conductive plugs and me...

Method for manufacturing semiconductor device

Method of forming a semiconductor device

Electronic devices comprising multilevel bitlines, and related meth...

Patents Applicationslast 30 patents

ETCH METHOD FOR OPENING A SOURCE LINE IN FLASH MEMORY

SEMICONDUCTOR WAFER FABRICATION WITH POLYIMIDE TO GRAPHENE CONVERSION

AIRGAPS IN TOP LAYERS OF SEMICONDUCTOR DEVICES

Method for Forming a Buried Interconnect Structure

THREE-DIMENSIONAL SEMICONDUCTOR DEVICE

INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE

PVD TARGET DESIGN AND SEMICONDUCTOR DEVICES FORMED USING THE SAME

PLUGS FOR INTERCONNECT LINES FOR ADVANCED INTEGRATED CIRCUIT STRUCT...

LOW CONTACT RESISTANCE VIAS IN BACKEND INTERCONNECT STRUCTURES

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

INTEGRATED CIRCUIT AND METHOD OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE

Techniques For Providing Shielding Between Inductors Using Guard Rings

METHOD FOR FABRICATING A SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METAL HARD MASKS FOR REDUCING LINE BENDING

METHODS AND STRUCTURES FOR HIGH STRENGTH DIELECTRIC IN HYBRID BONDING

METHOD OF FABRICATING A SEMICONDUCTOR DEVICE

METAL TREATMENT ON METAL SILICIDE FOR CMOS DEVICES

PACKAGE COMPRISING A SUBSTRATE WITH AN EMBEDDED PASSIVE DEVICE

INTERCONNECTION STRUCTURE

HYBRID METAL LINE STRUCTURE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHODS OF FABRICATING SEMICONDUCTOR DEVICES

METHOD FOR REDUCING RESISTANCE OF CONTACT

MICROELECTRONIC DEVICES, AND RELATED MEMORY DEVICES AND ELECTRONIC...

THREE-DIMENSIONAL SEMICONDUCTOR DEVICE INCLUDING A THROUGH-VIA STRU...

HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...

SELECTIVE PASSIVATION AND SELECTIVE DEPOSITION