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H01L2224/75267
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ELECTRICITY
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/75267
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Patent Grant
Thermo-compression bonding system, subsystems, and methods of use
Patent number
9,911,710
Issue date
Mar 6, 2018
MRSI Systems, LLC
Nicholas Samuel Celia
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR