Flat cap [not enclosing an internal cavity]

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CPC
H01L2924/16195

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/16195Flat cap [not enclosing an internal cavity]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Package structure with protective lid
- Patent number 12,119,276
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-component modules (MCMs) including configurable electromagnet...
- Patent number 12,100,669
- Issue date Sep 24, 2024
- QUALCOMM Incorporated
- Jay Scott Salmon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,021,042
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Ming Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera module, and photosensitive component thereof and manufacturi...
- Patent number 12,021,097
- Issue date Jun 25, 2024
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Cover lid with selective and edge metallization and methods of making
- Patent number 12,020,999
- Issue date Jun 25, 2024
- Materion Corporation
- Ramesh Kothandapani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Image-capturing unit and image-capturing apparatus
- Patent number 11,974,056
- Issue date Apr 30, 2024
- Nikon Corporation
- Hirofumi Arima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating component, semiconductor package, and semiconductor appa...
- Patent number 11,901,247
- Issue date Feb 13, 2024
- Kyocera Corporation
- Masami Juta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging unit and imaging apparatus
- Patent number 11,887,839
- Issue date Jan 30, 2024
- Nikon Corporation
- Hirofumi Arima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal transfer structures for semiconductor die assemblies
- Patent number 11,862,611
- Issue date Jan 2, 2024
- Micron Technology, Inc.
- Ed A. Schrock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 11,862,525
- Issue date Jan 2, 2024
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light-emitting device
- Patent number 11,799,266
- Issue date Oct 24, 2023
- Rohm Co., Ltd.
- Yuki Tanuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module and equipment
- Patent number 11,798,855
- Issue date Oct 24, 2023
- Canon Kabushiki Kaisha
- Yu Katase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of chip package with protective lid
- Patent number 11,764,118
- Issue date Sep 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-component modules (MCMs) including configurable electro-magne...
- Patent number 11,721,639
- Issue date Aug 8, 2023
- QUALCOMM Incorporated
- Jay Scott Salmon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structures and methods of manufacturing the same
- Patent number 11,515,220
- Issue date Nov 29, 2022
- Advanced Semiconductor Engineering, Inc.
- Chia Yun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor semiconductor packages and related methods
- Patent number 11,508,776
- Issue date Nov 22, 2022
- Semiconductor Components Industries, LLC
- Larry Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back side metallization
- Patent number 11,488,922
- Issue date Nov 1, 2022
- Advanced Micro Devices, Inc.
- Thomas P. Dolbear
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor package structures and methods of manufacturing the same
- Patent number 11,482,460
- Issue date Oct 25, 2022
- Advanced Semiconductor Engineering, Inc.
- Chia Yun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component housing package, electronic apparatus, and ele...
- Patent number 11,394,362
- Issue date Jul 19, 2022
- Kyocera Corporation
- Takuo Kisaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate, imaging unit and imaging device
- Patent number 11,343,907
- Issue date May 24, 2022
- Nikon Corporation
- Ryoichi Suganuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating component, semiconductor package, and semiconductor appa...
- Patent number 11,335,613
- Issue date May 17, 2022
- Kyocera Corporation
- Masami Juta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coating method, coating apparatus and method for manufacturing comp...
- Patent number 11,305,311
- Issue date Apr 19, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Mitsumi Itou
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Integrated interposer solutions for 2D and 3D IC packaging
- Patent number 11,302,616
- Issue date Apr 12, 2022
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 11,276,616
- Issue date Mar 15, 2022
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method to enhance reliability in connection with arrange...
- Patent number 11,264,301
- Issue date Mar 1, 2022
- Western Digital Technologies, Inc.
- Lee Kong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal transfer structures for semiconductor die assemblies
- Patent number 11,222,868
- Issue date Jan 11, 2022
- Micron Technology, Inc.
- Ed A. Schrock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical semiconductor apparatus and method of manufacturing optical...
- Patent number 11,222,998
- Issue date Jan 11, 2022
- Nikkiso Co., Ltd.
- Hiroyasu Ichinokura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and electronic equipment
- Patent number 11,211,322
- Issue date Dec 28, 2021
- Canon Kabushiki Kaisha
- Kunihiko Minegishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Configurable substrate and systems
- Patent number 11,171,126
- Issue date Nov 9, 2021
- OCTAVO SYSTEMS LLC
- Masood Murtuza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity wall structure for semiconductor packaging
- Patent number 11,139,233
- Issue date Oct 5, 2021
- UTAC HEADQUARTERS PTE. LTD.
- Hua Hong Tan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE WITH A REINFORCING LAYER
- Publication number 20240395731
- Publication date Nov 28, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH PROTECTIVE LID
- Publication number 20240379475
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Yi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240312930
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Ming Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20240228264
- Publication date Jul 11, 2024
- STMicroelectronics International N.V.
- Roseanne DUCA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240178206
- Publication date May 30, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sang Hyeon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20240145319
- Publication date May 2, 2024
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20240132340
- Publication date Apr 25, 2024
- STMicroelectronics (Malta) Ltd.
- Roseanne DUCA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE WITH ELECTRICALLY INSULATING AND THERMALLY CONDUCTIVE LAYER...
- Publication number 20240105544
- Publication date Mar 28, 2024
- INFINEON TECHNOLOGIES AG
- Shih Kien LONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH BALL GRID ARRAY CONNECTION HAVING IMPROV...
- Publication number 20240071974
- Publication date Feb 29, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tunable Fingertip Capacitors with Enhanced Shielding in Ceramic Pac...
- Publication number 20240072025
- Publication date Feb 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Rajen M. Murugan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240047301
- Publication date Feb 8, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sang Hyoun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-COMPONENT MODULES (MCMs) INCLUDING CONFIGURABLE ELECTROMAGNET...
- Publication number 20240021538
- Publication date Jan 18, 2024
- QUALCOMM Incorporated
- Jay Scott Salmon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REINFORCED STRUCTURE WITH CAPPING LAYER AND METHODS OF FORMING THE...
- Publication number 20230395450
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Jing-Ye Juang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH PROTECTIVE LID
- Publication number 20230369149
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Yi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230230935
- Publication date Jul 20, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Ming Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230187290
- Publication date Jun 15, 2023
- Fuji Electric Co., Ltd.
- Naohiko JOZUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Manufacturing The Same
- Publication number 20230154822
- Publication date May 18, 2023
- Nippon Telegraph and Telephone Corporation
- Yusuke Araki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCEY PACKAGE, HIGH-FREQUENCY MODULE, AND RADIO WAVE ABSO...
- Publication number 20230103894
- Publication date Apr 6, 2023
- NEC Corporation
- Yuki YOSHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAMERA MODULE, AND PHOTOSENSITIVE COMPONENT THEREOF AND MANUFACTURI...
- Publication number 20230019091
- Publication date Jan 19, 2023
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20220208623
- Publication date Jun 30, 2022
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-COMPONENT MODULES (MCMs) INCLUDING CONFIGURABLE ELECTRO-MAGNE...
- Publication number 20210407927
- Publication date Dec 30, 2021
- QUALCOMM Incorporated
- Jay Scott Salmon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE-CAPTURING UNIT AND IMAGE-CAPTURING APPARATUS
- Publication number 20210337142
- Publication date Oct 28, 2021
- Nikon Corporation
- Hirofumi ARIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COVER LID WITH SELECTIVE AND EDGE METALLIZATION
- Publication number 20210257270
- Publication date Aug 19, 2021
- MATERION CORPORATION
- Ramesh Kothandapani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMAGE-CAPTURING UNIT AND IMAGE-CAPTURING APPARATUS
- Publication number 20200273902
- Publication date Aug 27, 2020
- Nikon Corporation
- Hirofumi ARIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20200243408
- Publication date Jul 30, 2020
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu LIN
- G01 - MEASURING TESTING
Information Patent Application
System and Method to Enhance Solder Joint Reliability
- Publication number 20200219787
- Publication date Jul 9, 2020
- Western Digital Technologies, Inc.
- Lee Kong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Chip Sharing Power Interconnect Layer
- Publication number 20200219771
- Publication date Jul 9, 2020
- Xcelsis Corporation
- Javier DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING INTERLAYER...
- Publication number 20200211931
- Publication date Jul 2, 2020
- RENESAS ELECTRONICS CORPORATION
- Masahiro MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200140262
- Publication date May 7, 2020
- Advanced Semiconductor Engineering, Inc.
- Ching-Han HUANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SUBSTRATE, IMAGING UNIT AND IMAGING DEVICE
- Publication number 20190350076
- Publication date Nov 14, 2019
- Nikon Corporation
- Ryoichi SUGANUMA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Flat cap [not enclosing an internal cavity]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package structure with protective lid

Multi-component modules (MCMs) including configurable electromagnet...

Semiconductor package and method of manufacturing the same

Camera module, and photosensitive component thereof and manufacturi...

Cover lid with selective and edge metallization and methods of making

Image-capturing unit and image-capturing apparatus

Insulating component, semiconductor package, and semiconductor appa...

Imaging unit and imaging apparatus

Thermal transfer structures for semiconductor die assemblies

Semiconductor device package and a method of manufacturing the same

Semiconductor light-emitting device

Electronic module and equipment

Structure and formation method of chip package with protective lid

Multi-component modules (MCMs) including configurable electro-magne...

Semiconductor package structures and methods of manufacturing the same

Image sensor semiconductor packages and related methods

Back side metallization

Semiconductor package structures and methods of manufacturing the same

Electronic component housing package, electronic apparatus, and ele...

Substrate, imaging unit and imaging device

Insulating component, semiconductor package, and semiconductor appa...

Coating method, coating apparatus and method for manufacturing comp...

Integrated interposer solutions for 2D and 3D IC packaging

Semiconductor device package and a method of manufacturing the same

System and method to enhance reliability in connection with arrange...

Thermal transfer structures for semiconductor die assemblies

Optical semiconductor apparatus and method of manufacturing optical...

Printed circuit board and electronic equipment

Configurable substrate and systems

Cavity wall structure for semiconductor packaging

Patents Applicationslast 30 patents

ELECTRONIC DEVICE WITH A REINFORCING LAYER

PACKAGE STRUCTURE WITH PROTECTIVE LID

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE

PACKAGE WITH ELECTRICALLY INSULATING AND THERMALLY CONDUCTIVE LAYER...

SEMICONDUCTOR PACKAGE WITH BALL GRID ARRAY CONNECTION HAVING IMPROV...

Tunable Fingertip Capacitors with Enhanced Shielding in Ceramic Pac...

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

MULTI-COMPONENT MODULES (MCMs) INCLUDING CONFIGURABLE ELECTROMAGNET...

REINFORCED STRUCTURE WITH CAPPING LAYER AND METHODS OF FORMING THE...

PACKAGE STRUCTURE WITH PROTECTIVE LID

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

Semiconductor Device and Method for Manufacturing The Same

HIGH-FREQUENCEY PACKAGE, HIGH-FREQUENCY MODULE, AND RADIO WAVE ABSO...

CAMERA MODULE, AND PHOTOSENSITIVE COMPONENT THEREOF AND MANUFACTURI...

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

MULTI-COMPONENT MODULES (MCMs) INCLUDING CONFIGURABLE ELECTRO-MAGNE...

IMAGE-CAPTURING UNIT AND IMAGE-CAPTURING APPARATUS

COVER LID WITH SELECTIVE AND EDGE METALLIZATION

IMAGE-CAPTURING UNIT AND IMAGE-CAPTURING APPARATUS

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

System and Method to Enhance Solder Joint Reliability

3D Chip Sharing Power Interconnect Layer

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING INTERLAYER...

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SUBSTRATE, IMAGING UNIT AND IMAGING DEVICE