Flexible insulating substrates

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CPC
H01L23/4985

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/4985Flexible insulating substrates

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Systems and methods for saw tooth milling to prevent chip fraud
- Patent number 12,350,748
- Issue date Jul 8, 2025
- CAPITAL ONE SERVICES, LLC
- Daniel Herrington
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3D package configuration
- Patent number 12,354,942
- Issue date Jul 8, 2025
- CCS TECHNOLOGY CORPORATION
- Tung-Po Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel, manufacturing method thereof, and display device
- Patent number 12,349,463
- Issue date Jul 1, 2025
- BOE Technology Group Co., Ltd.
- Muxin Di
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a conductive layer on an IC using non-lithogr...
- Patent number 12,347,800
- Issue date Jul 1, 2025
- PRAGMATIC SEMICONDUCTOR LIMITED
- Ken Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-film package, display panel, and display device
- Patent number 12,340,719
- Issue date Jun 24, 2025
- Samsung Display Co., Ltd.
- Hee-Kwon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ESD structure for a display substrate edge
- Patent number 12,342,453
- Issue date Jun 24, 2025
- Innolux Corporation
- Chiu-Yuan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging structure and related inner lead bonding method
- Patent number 12,334,470
- Issue date Jun 17, 2025
- Sitronix Technology Corp.
- Ying-Chen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate, display panel and display module
- Patent number 12,334,426
- Issue date Jun 17, 2025
- Kunshan Go-Visionox Opto-Electronics Co., Ltd.
- Chuanzhi Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an electronic device structure having an electron...
- Patent number 12,300,638
- Issue date May 13, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Shaun Bowers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna with micro-transfer-printed circuit element
- Patent number RE50432
- Issue date May 13, 2025
- X-CELEPRINT LIMITED
- Ronald S. Cok
Information Patent Grant
Flip chip and chip packaging structure
- Patent number 12,293,962
- Issue date May 6, 2025
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Yong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip packages and a chip package
- Patent number 12,293,986
- Issue date May 6, 2025
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies with systems and methods for managing high...
- Patent number 12,293,992
- Issue date May 6, 2025
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Omnidirectional flexible light emitting device
- Patent number 12,293,965
- Issue date May 6, 2025
- Feit Electric Company, Inc.
- John D. Mitchell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible electronic structure
- Patent number 12,283,561
- Issue date Apr 22, 2025
- PRAGMATIC SEMICONDUCTOR LIMITED
- Brian Cobb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic textile assembly having electronic componentry which is...
- Patent number 12,272,611
- Issue date Apr 8, 2025
- University of Southampton
- Stephen Paul Beeby
- D02 - YARNS MECHANICAL FINISHING OF YARNS OR ROPES WARPING OR BEAMING
Information Patent Grant
Drive circuit carrier and display device
- Patent number 12,266,599
- Issue date Apr 1, 2025
- GUANGZHOU GOVISIONOX TECHNOLOGY CO., LTD.
- Lijian Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel and method for assembling same and spliced display de...
- Patent number 12,262,474
- Issue date Mar 25, 2025
- Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Kanmeng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wirebondable interposer for flip chip packaged integrated circuit die
- Patent number 12,243,840
- Issue date Mar 4, 2025
- Samtec, Inc.
- Edwin Loy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waferscale physiological characteristic sensor package with integra...
- Patent number 12,232,842
- Issue date Feb 25, 2025
- Medtronic MiniMed, Inc.
- Daniel Hahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible electronic structure including a support element
- Patent number 12,237,289
- Issue date Feb 25, 2025
- PRAGMATIC SEMICONDUCTOR LIMITED
- Brian Cobb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip interconnecting method, interconnect device and method for for...
- Patent number 12,224,267
- Issue date Feb 11, 2025
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tiled device and electronic device
- Patent number 12,219,843
- Issue date Feb 4, 2025
- Innolux Corporation
- Ya-Wen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices using microchannels for interconnections
- Patent number 12,205,882
- Issue date Jan 21, 2025
- 3M Innovative Properties Company
- Kayla C. Niccum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Continuous interconnects between heterogeneous materials
- Patent number 12,205,878
- Issue date Jan 21, 2025
- Liquid Wire Inc.
- Mark William Ronay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible interposer
- Patent number 12,199,026
- Issue date Jan 14, 2025
- PRAGMATIC SEMICONDUCTOR LIMITED
- Brian Cobb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-film package having redistribution pattern between semicond...
- Patent number 12,191,246
- Issue date Jan 7, 2025
- Samsung Electronics Co., Ltd.
- Kwanjai Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a curved part in the printed circuit board
- Patent number 12,191,245
- Issue date Jan 7, 2025
- Fuji Electric Co., Ltd.
- Motohito Hori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and tiled display including the same
- Patent number 12,183,768
- Issue date Dec 31, 2024
- Samsung Display Co., Ltd.
- Dae Hwan Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,160,950
- Issue date Dec 3, 2024
- Innolux Corporation
- Roger Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FLEXIBLE CIRCUIT BOARD, COF MODULE, AND ELECTRONIC DEVICE COMPRISIN...
- Publication number 20250226303
- Publication date Jul 10, 2025
- LG Innotek Co., Ltd.
- Ki Tae PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRETCHABLE DEVICE
- Publication number 20250210505
- Publication date Jun 26, 2025
- Murata Manufacturing Co., Ltd.
- Yui NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20250183141
- Publication date Jun 5, 2025
- LG Display Co., Ltd.
- Buhui LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND TILED DISPLAY INCLUDING THE SAME
- Publication number 20250151497
- Publication date May 8, 2025
- SAMSUNG DISPLAY CO., LTD.
- Dae Hwan JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Articles of Manufacture Relating to IC Modules and Smart Cards
- Publication number 20250139400
- Publication date May 1, 2025
- SMARTFLEX TECHNOLOGY PTE LTD
- Eng Seng Ng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250133927
- Publication date Apr 24, 2025
- InnoLux Corporation
- Ya-Wen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMART IC SUBSTRATE, SMART IC MODULE, AND IC CARD COMPRISING SAME
- Publication number 20250132242
- Publication date Apr 24, 2025
- LG Innotek Co., Ltd.
- Seung Joon KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF FABRICATING HIGH ACCURACY EMBEDDED RESISTORS IN FLEX SUBS...
- Publication number 20250113501
- Publication date Apr 3, 2025
- Eagle Technology, LLC
- Matt BAUER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE HAVING HEAT DISSIPATION STRUCTURE AND MANUFACTURING ME...
- Publication number 20250105087
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Chunyan RUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE INTERPOSER
- Publication number 20250105131
- Publication date Mar 27, 2025
- Pragmatic Semiconductor Limited
- Brian COBB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND MOBILE ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20250105126
- Publication date Mar 27, 2025
- SAMSUNG DISPLAY CO., LTD.
- Woo Jung JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Manufacturing Contactless Module Having An Antenna Coil...
- Publication number 20250105491
- Publication date Mar 27, 2025
- SEALSQ FRANCE
- Ghislain Boiron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20250070058
- Publication date Feb 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Wen-Long LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A FILM SUBSTRATE
- Publication number 20250062178
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Kyoungsuk YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250063653
- Publication date Feb 20, 2025
- InnoLux Corporation
- Roger HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR INTEGRATED UNIT AND POWER CONVERTER CIRCUIT STR...
- Publication number 20250038099
- Publication date Jan 30, 2025
- CAMBRIDGE INTEGRATION LTD
- Ameer Hussein Abd JANABI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INNER LEAD STRUCTURE OF FLEXIBLE CIRCUIT BOARD
- Publication number 20250038129
- Publication date Jan 30, 2025
- Chipbond Technology Corporation
- Wen-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CIRCUIT FILM AND DISPLAY APPARATUS HAVING SAME
- Publication number 20250006620
- Publication date Jan 2, 2025
- SAMSUNG DISPLAY CO., LTD.
- BoYeon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240413171
- Publication date Dec 12, 2024
- PanelSemi Corporation
- Sheng-Ping CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND ULTRASOUND SYSTEM HAVING SAME
- Publication number 20240413057
- Publication date Dec 12, 2024
- INFINEON TECHNOLOGIES AG
- Horst THEUSS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND PACKAGE MODULE INCLUDING THE SAME
- Publication number 20240413071
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Narae SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH SERPENTINE CONDUCTOR AND METHOD OF...
- Publication number 20240395689
- Publication date Nov 28, 2024
- Avago Technologies International Sales Pte. Limited
- Michael Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRAY SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE
- Publication number 20240371744
- Publication date Nov 7, 2024
- KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD.
- Wenxing LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYOUT STRUCTURE OF FLEXIBLE CIRCUIT BOARD
- Publication number 20240371741
- Publication date Nov 7, 2024
- Chipbond Technology Corporation
- Hou-Chang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ON FILM, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE
- Publication number 20240363510
- Publication date Oct 31, 2024
- BOE TECHNOLOGY GROUP CO., LTD.
- Liuqing Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE ELECTRONIC DEVICE
- Publication number 20240363649
- Publication date Oct 31, 2024
- InnoLux Corporation
- Ti-Chung CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH RIGID-FLEX SUB-ASSEMBLY AND METHOD THEREFOR
- Publication number 20240363519
- Publication date Oct 31, 2024
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OMNIDIRECTIONAL FLEXIBLE LIGHT EMITTING DEVICE
- Publication number 20240347440
- Publication date Oct 17, 2024
- Feit Electric Company, Inc.
- John D. Mitchell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE
- Publication number 20240349530
- Publication date Oct 17, 2024
- Japan Display Inc.
- Masumi NISHIMURA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP ON FILM PACKAGE AND METHOD OF MANUFACTURING THE CHIP ON FILM P...
- Publication number 20240339376
- Publication date Oct 10, 2024
- Samsung Electronics Co., Ltd.
- Seunghyun CHO
- H01 - BASIC ELECTRIC ELEMENTS

Flexible insulating substrates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Systems and methods for saw tooth milling to prevent chip fraud

3D package configuration

Display panel, manufacturing method thereof, and display device

Method of fabricating a conductive layer on an IC using non-lithogr...

Chip-on-film package, display panel, and display device

ESD structure for a display substrate edge

Chip packaging structure and related inner lead bonding method

Array substrate, display panel and display module

Method of forming an electronic device structure having an electron...

Antenna with micro-transfer-printed circuit element

Flip chip and chip packaging structure

Method for forming chip packages and a chip package

Semiconductor assemblies with systems and methods for managing high...

Omnidirectional flexible light emitting device

Flexible electronic structure

Electronic textile assembly having electronic componentry which is...

Drive circuit carrier and display device

Display panel and method for assembling same and spliced display de...

Wirebondable interposer for flip chip packaged integrated circuit die

Waferscale physiological characteristic sensor package with integra...

Flexible electronic structure including a support element

Chip interconnecting method, interconnect device and method for for...

Tiled device and electronic device

Methods and devices using microchannels for interconnections

Continuous interconnects between heterogeneous materials

Flexible interposer

Chip-on-film package having redistribution pattern between semicond...

Semiconductor device having a curved part in the printed circuit board

Display device and tiled display including the same

Electronic device

Patents Applicationslast 30 patents

FLEXIBLE CIRCUIT BOARD, COF MODULE, AND ELECTRONIC DEVICE COMPRISIN...

STRETCHABLE DEVICE

DISPLAY DEVICE

DISPLAY DEVICE AND TILED DISPLAY INCLUDING THE SAME

Articles of Manufacture Relating to IC Modules and Smart Cards

ELECTRONIC DEVICE

SMART IC SUBSTRATE, SMART IC MODULE, AND IC CARD COMPRISING SAME

METHOD OF FABRICATING HIGH ACCURACY EMBEDDED RESISTORS IN FLEX SUBS...

CHIP PACKAGE HAVING HEAT DISSIPATION STRUCTURE AND MANUFACTURING ME...

FLEXIBLE INTERPOSER

DISPLAY DEVICE AND MOBILE ELECTRONIC DEVICE INCLUDING THE SAME

Method For Manufacturing Contactless Module Having An Antenna Coil...

SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING A FILM SUBSTRATE

ELECTRONIC DEVICE

POWER SEMICONDUCTOR INTEGRATED UNIT AND POWER CONVERTER CIRCUIT STR...

INNER LEAD STRUCTURE OF FLEXIBLE CIRCUIT BOARD

FLEXIBLE CIRCUIT FILM AND DISPLAY APPARATUS HAVING SAME

ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE AND ULTRASOUND SYSTEM HAVING SAME

SEMICONDUCTOR PACKAGE AND PACKAGE MODULE INCLUDING THE SAME

INTEGRATED CIRCUIT PACKAGE WITH SERPENTINE CONDUCTOR AND METHOD OF...

ARRAY SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE

LAYOUT STRUCTURE OF FLEXIBLE CIRCUIT BOARD

CHIP ON FILM, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE

FLEXIBLE ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE WITH RIGID-FLEX SUB-ASSEMBLY AND METHOD THEREFOR

OMNIDIRECTIONAL FLEXIBLE LIGHT EMITTING DEVICE

DISPLAY DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE

CHIP ON FILM PACKAGE AND METHOD OF MANUFACTURING THE CHIP ON FILM P...