Flexible insulating substrates

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H01L23/4985

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/4985Flexible insulating substrates

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Methods and devices using microchannels for interconnections
- Patent number 12,205,882
- Issue date Jan 21, 2025
- 3M Innovative Properties Company
- Kayla C. Niccum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Continuous interconnects between heterogeneous materials
- Patent number 12,205,878
- Issue date Jan 21, 2025
- Liquid Wire Inc.
- Mark William Ronay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible interposer
- Patent number 12,199,026
- Issue date Jan 14, 2025
- PRAGMATIC SEMICONDUCTOR LIMITED
- Brian Cobb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-film package having redistribution pattern between semicond...
- Patent number 12,191,246
- Issue date Jan 7, 2025
- Samsung Electronics Co., Ltd.
- Kwanjai Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a curved part in the printed circuit board
- Patent number 12,191,245
- Issue date Jan 7, 2025
- Fuji Electric Co., Ltd.
- Motohito Hori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and tiled display including the same
- Patent number 12,183,768
- Issue date Dec 31, 2024
- Samsung Display Co., Ltd.
- Dae Hwan Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,160,950
- Issue date Dec 3, 2024
- Innolux Corporation
- Roger Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D package configuration
- Patent number 12,159,824
- Issue date Dec 3, 2024
- CCS TECHNOLOGY CORPORATION
- Tung-Po Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connections to embedded electronic components
- Patent number 12,156,343
- Issue date Nov 26, 2024
- 3M Innovative Properties Company
- Ankit Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sidewall connections and button interconnects for molded SiPs
- Patent number 12,148,741
- Issue date Nov 19, 2024
- Apple Inc.
- Bilal Mohamed Ibrahim Kani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 12,142,584
- Issue date Nov 12, 2024
- Advanced Semiconductor Engineering, Inc.
- Wen-Long Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Biometric sensor module for a smart card and method for manufacturi...
- Patent number 12,131,987
- Issue date Oct 29, 2024
- Linxens Holding
- Christophe Mathieu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Antenna module, antenna module manufacturing method, and electronic...
- Patent number 12,132,249
- Issue date Oct 29, 2024
- Huawei Technologies Co., Ltd.
- Rui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures with deformable conductors
- Patent number 12,125,778
- Issue date Oct 22, 2024
- Liquid Wire Inc.
- Mark William Ronay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit film having a power wiring set and display apparat...
- Patent number 12,113,007
- Issue date Oct 8, 2024
- Samsung Display Co., Ltd.
- BoYeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid nanosilver/liquid metal ink composition and uses thereof
- Patent number 12,096,554
- Issue date Sep 17, 2024
- Xerox Corporation
- Naveen Chopra
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Chip protected against back-face attacks
- Patent number 12,087,708
- Issue date Sep 10, 2024
- STMicroelectronics (Crolles 2) SAS
- Sebastien Petitdidier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip packages and a chip package having a chipse...
- Patent number 12,087,734
- Issue date Sep 10, 2024
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible package architecture concept in fanout
- Patent number 12,074,077
- Issue date Aug 27, 2024
- Apple Inc.
- Karthik Shanmugam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with serpentine conductor and method of...
- Patent number 12,068,232
- Issue date Aug 20, 2024
- Avago Technologies International Sales Pte. Limited
- Michael Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible electronic device
- Patent number 12,068,331
- Issue date Aug 20, 2024
- Innolux Corporation
- Ti-Chung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting module comprising plurality of light emitting diodes...
- Patent number 12,062,649
- Issue date Aug 13, 2024
- Shanghai Tianma Microelectronics Co., Ltd.
- Lu Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 12,057,384
- Issue date Aug 6, 2024
- Shinko Electric Industries Co., Ltd.
- Hiroshi Taneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip on film assembly, display panel, and display module
- Patent number 12,057,382
- Issue date Aug 6, 2024
- TCL China Star Optoelectronics Technology Co., Ltd.
- Jinfeng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing display device
- Patent number 12,048,189
- Issue date Jul 23, 2024
- Japan Display Inc.
- Masumi Nishimura
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flex board and flexible module
- Patent number 12,040,262
- Issue date Jul 16, 2024
- Apple Inc.
- Dennis R. Pyper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and an inspection method of a display device
- Patent number 12,016,116
- Issue date Jun 18, 2024
- Samsung Display Co., Ltd.
- Yong Jin Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including semiconductor layer with width variatio...
- Patent number 12,009,291
- Issue date Jun 11, 2024
- Innolux Corporation
- Chiu-Yuan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device, method of manufacturing window, and method of manuf...
- Patent number 12,001,243
- Issue date Jun 4, 2024
- Samsung Display Co., Ltd.
- In-Bae Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Film package and display device including film package
- Patent number 12,002,744
- Issue date Jun 4, 2024
- Samsung Display Co., Ltd.
- Myong-Soo Oh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER SEMICONDUCTOR INTEGRATED UNIT AND POWER CONVERTER CIRCUIT STR...
- Publication number 20250038099
- Publication date Jan 30, 2025
- CAMBRIDGE INTEGRATION LTD
- Ameer Hussein Abd JANABI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INNER LEAD STRUCTURE OF FLEXIBLE CIRCUIT BOARD
- Publication number 20250038129
- Publication date Jan 30, 2025
- Chipbond Technology Corporation
- Wen-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CIRCUIT FILM AND DISPLAY APPARATUS HAVING SAME
- Publication number 20250006620
- Publication date Jan 2, 2025
- SAMSUNG DISPLAY CO., LTD.
- BoYeon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240413171
- Publication date Dec 12, 2024
- PanelSemi Corporation
- Sheng-Ping CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND ULTRASOUND SYSTEM HAVING SAME
- Publication number 20240413057
- Publication date Dec 12, 2024
- INFINEON TECHNOLOGIES AG
- Horst THEUSS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND PACKAGE MODULE INCLUDING THE SAME
- Publication number 20240413071
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Narae SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH SERPENTINE CONDUCTOR AND METHOD OF...
- Publication number 20240395689
- Publication date Nov 28, 2024
- Avago Technologies International Sales Pte. Limited
- Michael Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRAY SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE
- Publication number 20240371744
- Publication date Nov 7, 2024
- KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD.
- Wenxing LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYOUT STRUCTURE OF FLEXIBLE CIRCUIT BOARD
- Publication number 20240371741
- Publication date Nov 7, 2024
- Chipbond Technology Corporation
- Hou-Chang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ON FILM, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE
- Publication number 20240363510
- Publication date Oct 31, 2024
- BOE TECHNOLOGY GROUP CO., LTD.
- Liuqing Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE ELECTRONIC DEVICE
- Publication number 20240363649
- Publication date Oct 31, 2024
- InnoLux Corporation
- Ti-Chung CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH RIGID-FLEX SUB-ASSEMBLY AND METHOD THEREFOR
- Publication number 20240363519
- Publication date Oct 31, 2024
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OMNIDIRECTIONAL FLEXIBLE LIGHT EMITTING DEVICE
- Publication number 20240347440
- Publication date Oct 17, 2024
- Feit Electric Company, Inc.
- John D. Mitchell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE
- Publication number 20240349530
- Publication date Oct 17, 2024
- Japan Display Inc.
- Masumi NISHIMURA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP ON FILM PACKAGE AND METHOD OF MANUFACTURING THE CHIP ON FILM P...
- Publication number 20240339376
- Publication date Oct 10, 2024
- Samsung Electronics Co., Ltd.
- Seunghyun CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL MODULE AND FLEXIBLE SUBSTRATE
- Publication number 20240332273
- Publication date Oct 3, 2024
- Sumitomo Electric Industries, Ltd.
- Hiroshi UEMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Devices with Displays and Conductive Traces
- Publication number 20240332319
- Publication date Oct 3, 2024
- Apple Inc.
- Gihoon Choo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRETCHABLE DEVICE
- Publication number 20240321721
- Publication date Sep 26, 2024
- Murata Manufacturing Co., Ltd.
- Keisuke NISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP MODULE AND METHOD OF FORMING SAME
- Publication number 20240312897
- Publication date Sep 19, 2024
- ACT IDENTITY TECHNOLOGY LIMITED
- Gang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE, METHOD OF MANUFACTURING WINDOW, AND METHOD OF MANUF...
- Publication number 20240295904
- Publication date Sep 5, 2024
- SAMSUNG DISPLAY CO., LTD.
- IN-BAE KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240290711
- Publication date Aug 29, 2024
- InnoLux Corporation
- Chiu-Yuan Huang
- G02 - OPTICS
Information Patent Application
CHIP ON FILM PACKAGE
- Publication number 20240282717
- Publication date Aug 22, 2024
- SAMSUNG DISPLAY CO., LTD.
- WONTAE KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL, DISPLAY PANEL SUBASSEMBLY AND DISPLAY APPARATUS
- Publication number 20240282903
- Publication date Aug 22, 2024
- BOE MLED TECHNOLOGY CO., LTD.
- Shaofei GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structures With Deformable Conductors
- Publication number 20240266275
- Publication date Aug 8, 2024
- Liquid Wire Inc.
- Mark William Ronay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-FILM AND DISPLAY DEVICE
- Publication number 20240258226
- Publication date Aug 1, 2024
- Wuhan China Star Optoelectronics Technology Co., Ltd.
- Fu LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20240258247
- Publication date Aug 1, 2024
- LX Semicon Co., Ltd.
- Seung Hoon JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TILED DEVICE AND ELECTRONIC DEVICE
- Publication number 20240224681
- Publication date Jul 4, 2024
- InnoLux Corporation
- Ya-Wen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND DISPLAY DEVICE
- Publication number 20240213181
- Publication date Jun 27, 2024
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Hao SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded Die Package
- Publication number 20240178124
- Publication date May 30, 2024
- Compass Technology Company Limited
- Kelvin Po Leung Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240170437
- Publication date May 23, 2024
- Advanced Semiconductor Engineering, Inc.
- Chun Fu KUO
- H01 - BASIC ELECTRIC ELEMENTS

Flexible insulating substrates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods and devices using microchannels for interconnections

Continuous interconnects between heterogeneous materials

Flexible interposer

Chip-on-film package having redistribution pattern between semicond...

Semiconductor device having a curved part in the printed circuit board

Display device and tiled display including the same

Electronic device

3D package configuration

Electrical connections to embedded electronic components

Sidewall connections and button interconnects for molded SiPs

Semiconductor device package

Biometric sensor module for a smart card and method for manufacturi...

Antenna module, antenna module manufacturing method, and electronic...

Structures with deformable conductors

Flexible circuit film having a power wiring set and display apparat...

Hybrid nanosilver/liquid metal ink composition and uses thereof

Chip protected against back-face attacks

Method for forming chip packages and a chip package having a chipse...

Flexible package architecture concept in fanout

Integrated circuit package with serpentine conductor and method of...

Flexible electronic device

Light-emitting module comprising plurality of light emitting diodes...

Wiring substrate and semiconductor device

Chip on film assembly, display panel, and display module

Display device and method of manufacturing display device

Flex board and flexible module

Display device and an inspection method of a display device

Electronic device including semiconductor layer with width variatio...

Display device, method of manufacturing window, and method of manuf...

Film package and display device including film package

Patents Applicationslast 30 patents

POWER SEMICONDUCTOR INTEGRATED UNIT AND POWER CONVERTER CIRCUIT STR...

INNER LEAD STRUCTURE OF FLEXIBLE CIRCUIT BOARD

FLEXIBLE CIRCUIT FILM AND DISPLAY APPARATUS HAVING SAME

ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE AND ULTRASOUND SYSTEM HAVING SAME

SEMICONDUCTOR PACKAGE AND PACKAGE MODULE INCLUDING THE SAME

INTEGRATED CIRCUIT PACKAGE WITH SERPENTINE CONDUCTOR AND METHOD OF...

ARRAY SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE

LAYOUT STRUCTURE OF FLEXIBLE CIRCUIT BOARD

CHIP ON FILM, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE

FLEXIBLE ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE WITH RIGID-FLEX SUB-ASSEMBLY AND METHOD THEREFOR

OMNIDIRECTIONAL FLEXIBLE LIGHT EMITTING DEVICE

DISPLAY DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE

CHIP ON FILM PACKAGE AND METHOD OF MANUFACTURING THE CHIP ON FILM P...

OPTICAL MODULE AND FLEXIBLE SUBSTRATE

Electronic Devices with Displays and Conductive Traces

STRETCHABLE DEVICE

CHIP MODULE AND METHOD OF FORMING SAME

DISPLAY DEVICE, METHOD OF MANUFACTURING WINDOW, AND METHOD OF MANUF...

ELECTRONIC DEVICE

CHIP ON FILM PACKAGE

DISPLAY PANEL, DISPLAY PANEL SUBASSEMBLY AND DISPLAY APPARATUS

Structures With Deformable Conductors

CHIP-ON-FILM AND DISPLAY DEVICE

CHIP-ON-FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME

TILED DEVICE AND ELECTRONIC DEVICE

DISPLAY PANEL AND DISPLAY DEVICE

Embedded Die Package

PACKAGE STRUCTURE