Flow barrier

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H01L2224/02245

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/02245Flow barrier

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Patents Grantslast 30 patents

Information Patent Grant
Method of soldering a semiconductor chip to a chip carrier
- Patent number 12,132,017
- Issue date Oct 29, 2024
- Infineon Technologies AG
- Michael Stadler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip structure and method for forming the same
- Patent number 11,848,270
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hong-Seng Shue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip with chip pad and associated solder flux outgassing trench
- Patent number 11,830,835
- Issue date Nov 28, 2023
- Infineon Technologies AG
- Michael Stadler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
- Patent number 11,569,123
- Issue date Jan 31, 2023
- Sony Corporation
- Yoshihisa Kagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier structures between external electrical connectors
- Patent number 11,296,012
- Issue date Apr 5, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices and methods of packaging thereof
- Patent number 11,094,622
- Issue date Aug 17, 2021
- Taiwan Semiconductor Manufacturing Company
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
- Patent number 10,985,102
- Issue date Apr 20, 2021
- Sony Corporation
- Yoshihisa Kagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrate and electronic apparatus
- Patent number 10,910,289
- Issue date Feb 2, 2021
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Masataka Maehara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,847,476
- Issue date Nov 24, 2020
- Samsung Electronics Co., Ltd.
- Jun Woo Myung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 10,629,554
- Issue date Apr 21, 2020
- Powertech Technology Inc.
- Nan-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
- Patent number 10,431,621
- Issue date Oct 1, 2019
- Sony Corporation
- Yoshihisa Kagawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Barrier structures between external electrical connectors
- Patent number 10,347,563
- Issue date Jul 9, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,340,208
- Issue date Jul 2, 2019
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
- Patent number 10,038,024
- Issue date Jul 31, 2018
- Sony Corporation
- Yoshihisa Kagawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Optimized solder pads for microelectronic components
- Patent number 10,014,274
- Issue date Jul 3, 2018
- International Business Machines Corporation
- Tymon Barwicz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
- Patent number 9,911,778
- Issue date Mar 6, 2018
- Sony Corporation
- Yoshihisa Kagawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Packaging device having plural microstructures disposed proximate t...
- Patent number 9,837,346
- Issue date Dec 5, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier structures between external electrical connectors
- Patent number 9,698,079
- Issue date Jul 4, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier structures between external electrical connectors
- Patent number 9,659,839
- Issue date May 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging device having plural microstructures disposed proximate t...
- Patent number 9,607,959
- Issue date Mar 28, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
- Patent number 9,443,802
- Issue date Sep 13, 2016
- Sony Corporation
- Yoshihisa Kagawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
- Patent number 9,111,763
- Issue date Aug 18, 2015
- Sony Corporation
- Yoshihisa Kagawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Bond pad and passivation layer having a gap and method for forming
- Patent number 9,111,755
- Issue date Aug 18, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Tu-Anh N. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for producing the same
- Patent number 9,093,393
- Issue date Jul 28, 2015
- J-Devices Corporation
- Toru Suda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP STRUCTURE
- Publication number 20240120277
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hong-Seng SHUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SOLDERING A SEMICONDUCTOR CHIP TO A CHIP CARRIER
- Publication number 20240055376
- Publication date Feb 15, 2024
- INFINEON TECHNOLOGIES AG
- Michael Stadler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Barrier Structures Between External Electrical Connectors
- Publication number 20220230940
- Publication date Jul 21, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip with Chip Pad and Associated Solder Flux Outgassing Trench
- Publication number 20220068851
- Publication date Mar 3, 2022
- Michael Stadler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200168565
- Publication date May 28, 2020
- Samsung Electronics Co., Ltd.
- Jun Woo Myung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Barrier Structures Between External Electrical Connectors
- Publication number 20190333841
- Publication date Oct 31, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20190319000
- Publication date Oct 17, 2019
- Powertech Technology Inc.
- Nan-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SUBSTRATE AND ELECTRONIC APPARATUS
- Publication number 20190259633
- Publication date Aug 22, 2019
- Sony Semiconductor Solutions Corporation
- MASATAKA MAEHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, FABRICATION METHOD FOR A SEMICONDUCTOR DEVICE...
- Publication number 20180277585
- Publication date Sep 27, 2018
- SONY CORPORATION
- Yoshihisa Kagawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
OPTIMIZED SOLDER PADS FOR MICROELECTRONIC COMPONENTS
- Publication number 20170141072
- Publication date May 18, 2017
- International Business Machines Corporation
- Tymon Barwicz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, FABRICATION METHOD FOR A SEMICONDUCTOR DEVICE...
- Publication number 20140362267
- Publication date Dec 11, 2014
- Yoshihisa Kagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME
- Publication number 20140138852
- Publication date May 22, 2014
- J-DEVICES CORPORATION
- Toru SUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, FABRICATION METHOD FOR A SEMICONDUCTOR DEVICE...
- Publication number 20130009321
- Publication date Jan 10, 2013
- SONY CORPORATION
- Yoshihisa Kagawa
- H01 - BASIC ELECTRIC ELEMENTS

Flow barrier

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of soldering a semiconductor chip to a chip carrier

Chip structure and method for forming the same

Chip with chip pad and associated solder flux outgassing trench

Semiconductor device, fabrication method for a semiconductor device...

Barrier structures between external electrical connectors

Packaged semiconductor devices and methods of packaging thereof

Semiconductor device, fabrication method for a semiconductor device...

Electronic substrate and electronic apparatus

Semiconductor package

Package structure and manufacturing method thereof

Semiconductor device, fabrication method for a semiconductor device...

Barrier structures between external electrical connectors

Semiconductor device

Semiconductor device, fabrication method for a semiconductor device...

Optimized solder pads for microelectronic components

Semiconductor device, fabrication method for a semiconductor device...

Packaging device having plural microstructures disposed proximate t...

Barrier structures between external electrical connectors

Barrier structures between external electrical connectors

Packaging device having plural microstructures disposed proximate t...

Semiconductor device, fabrication method for a semiconductor device...

Semiconductor device, fabrication method for a semiconductor device...

Bond pad and passivation layer having a gap and method for forming

Semiconductor device and method for producing the same

Patents Applicationslast 30 patents

CHIP STRUCTURE

METHOD OF SOLDERING A SEMICONDUCTOR CHIP TO A CHIP CARRIER

Barrier Structures Between External Electrical Connectors

Chip with Chip Pad and Associated Solder Flux Outgassing Trench

SEMICONDUCTOR PACKAGE

Barrier Structures Between External Electrical Connectors

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

ELECTRONIC SUBSTRATE AND ELECTRONIC APPARATUS

SEMICONDUCTOR DEVICE, FABRICATION METHOD FOR A SEMICONDUCTOR DEVICE...

OPTIMIZED SOLDER PADS FOR MICROELECTRONIC COMPONENTS

SEMICONDUCTOR DEVICE, FABRICATION METHOD FOR A SEMICONDUCTOR DEVICE...

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME

SEMICONDUCTOR DEVICE, FABRICATION METHOD FOR A SEMICONDUCTOR DEVICE...