Flow barrier

Industry

CPC
H01L2224/24992

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/24992Flow barrier

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor die having fine pitch electrical interconnects
- Patent number 8,829,677
- Issue date Sep 9, 2014
- Invensas Corporation
- Keith Lake Barrie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure comprising blind vias intended to be metalized
- Patent number 8,482,130
- Issue date Jul 9, 2013
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Damien Saint-Patrice
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and method of fabricating the same
- Patent number 7,973,417
- Issue date Jul 5, 2011
- Qimonda AG
- Alfred Martin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connecting microsized devices using ablative films
- Patent number 7,696,013
- Issue date Apr 13, 2010
- Eastman Kodak Company
- M. Zaki Ali
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
COPPER INTERCONNECTS WITH SELF-ALIGNED HOURGLASS-SHAPED METAL CAP
- Publication number 20230110587
- Publication date Apr 13, 2023
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BROAD-AREA LIGHTING SYSTEMS
- Publication number 20130111744
- Publication date May 9, 2013
- Michael A. Tischler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BROAD-AREA LIGHTING SYSTEMS
- Publication number 20130112989
- Publication date May 9, 2013
- COOLEDGE LIGHTING, INC.
- Michael Tischler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BROAD-AREA LIGHTING SYSTEMS
- Publication number 20130056749
- Publication date Mar 7, 2013
- Michael Tischler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor die having fine pitch electrical interconnects
- Publication number 20120248607
- Publication date Oct 4, 2012
- Vertical Circuits, Inc.
- Keith Lake Barrie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE COMPRISING BLIND VIAS INTENDED TO BE METALIZED
- Publication number 20110221068
- Publication date Sep 15, 2011
- COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE. ALT.
- Damien SAINT-PATRICE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING MICROSIZED DEVICES USING ABLATIVE FILMS
- Publication number 20100109168
- Publication date May 6, 2010
- Eastman Kodak Company
- M. Zaki Ali
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CONNECTING MICROSIZED DEVICES USING ABLATIVE FILMS
- Publication number 20100112758
- Publication date May 6, 2010
- Eastman Kodak Company
- M. Zaki Ali
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED CIRCUIT AND METHOD OF FABRICATING THE SAME
- Publication number 20090261480
- Publication date Oct 22, 2009
- Alfred Martin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTING MICROSIZED DEVICES USING ABLATIVE FILMS
- Publication number 20080258313
- Publication date Oct 23, 2008
- M. Zaki Ali
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20070210458
- Publication date Sep 13, 2007
- SEIKO EPSON CORPORATION
- Yoshinori HAGIO
- H01 - BASIC ELECTRIC ELEMENTS

Flow barrier

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor die having fine pitch electrical interconnects

Interconnect structure comprising blind vias intended to be metalized

Integrated circuit and method of fabricating the same

Connecting microsized devices using ablative films

Patents Applicationslast 30 patents

COPPER INTERCONNECTS WITH SELF-ALIGNED HOURGLASS-SHAPED METAL CAP

BROAD-AREA LIGHTING SYSTEMS

BROAD-AREA LIGHTING SYSTEMS

BROAD-AREA LIGHTING SYSTEMS

Semiconductor die having fine pitch electrical interconnects

INTERCONNECT STRUCTURE COMPRISING BLIND VIAS INTENDED TO BE METALIZED

CONNECTING MICROSIZED DEVICES USING ABLATIVE FILMS

CONNECTING MICROSIZED DEVICES USING ABLATIVE FILMS

INTEGRATED CIRCUIT AND METHOD OF FABRICATING THE SAME

CONNECTING MICROSIZED DEVICES USING ABLATIVE FILMS

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE