Flow barrier

Industry

CPC
H01L2224/02135

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/02135Flow barrier

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for packaging stacking flip chip
- Patent number 12,293,984
- Issue date May 6, 2025
- Hebei Beixin Semiconductor Technology Co., Ltd.
- Honglei Ran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing of flip-chip electronic device with carrier having he...
- Patent number 11,251,160
- Issue date Feb 15, 2022
- International Business Machines Corporation
- Stefano Oggioni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices and methods of packaging thereof
- Patent number 11,094,622
- Issue date Aug 17, 2021
- Taiwan Semiconductor Manufacturing Company
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip electronic device with carrier having heat dissipation el...
- Patent number 10,886,254
- Issue date Jan 5, 2021
- International Business Machines Corporation
- Stefano Oggioni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Collars for under-bump metal structures and associated systems and...
- Patent number 10,886,244
- Issue date Jan 5, 2021
- Micron Technology, Inc.
- Giorgio Mariottini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,340,208
- Issue date Jul 2, 2019
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for disposing a component
- Patent number 8,187,667
- Issue date May 29, 2012
- Panasonic Corporation
- Hidekazu Arase
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND...
- Publication number 20210151400
- Publication date May 20, 2021
- Micron Technology, Inc.
- Giorgio Mariottini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DISPOSING A COMPONENT
- Publication number 20110229642
- Publication date Sep 22, 2011
- PANASONIC CORPORATION
- Hidekazu ARASE
- H01 - BASIC ELECTRIC ELEMENTS

Flow barrier

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for packaging stacking flip chip

Manufacturing of flip-chip electronic device with carrier having he...

Packaged semiconductor devices and methods of packaging thereof

Flip-chip electronic device with carrier having heat dissipation el...

Collars for under-bump metal structures and associated systems and...

Semiconductor device

Method for disposing a component

Patents Applicationslast 30 patents

COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND...

METHOD FOR DISPOSING A COMPONENT