Flow barriers

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H01L2224/26145

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/26145Flow barriers

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating semiconductor structure including a barrier s...
- Patent number 12,278,208
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 12,218,096
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,159,863
- Issue date Dec 3, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Hyun Goo Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating electronic package structure
- Patent number 12,125,760
- Issue date Oct 22, 2024
- Richwave Technology Corp.
- Yu-Lung Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a structure
- Patent number 12,107,069
- Issue date Oct 1, 2024
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Nohora-Lizeth Caicedo Panqueva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 12,080,673
- Issue date Sep 3, 2024
- Mitsubishi Electric Corporation
- Tatsuya Kitagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a multi-layered encapsulant and associate...
- Patent number 11,955,346
- Issue date Apr 9, 2024
- Micron Technology, Inc.
- Shijian Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die with capillary flow structures for direct chip at...
- Patent number 11,923,332
- Issue date Mar 5, 2024
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,916,035
- Issue date Feb 27, 2024
- Powertech Technology Inc.
- Shang-Yu Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack of electrical components and method of producing the same
- Patent number 11,855,035
- Issue date Dec 26, 2023
- TDK Corporation
- Yohei Hirota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure including a semiconductor wafer and a surfa...
- Patent number 11,848,300
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 11,830,860
- Issue date Nov 28, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Hyun Goo Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,769,746
- Issue date Sep 26, 2023
- Samsung Electronics Co., Ltd.
- Ae-nee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display module and method of manufacturing the same
- Patent number 11,715,729
- Issue date Aug 1, 2023
- Samsung Electronics Co., Ltd.
- Yoonsuk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state image pickup element, electronic equipment, and semicon...
- Patent number 11,647,890
- Issue date May 16, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Junichiro Fujimagari
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Electronic package structure and fabrication method thereof
- Patent number 11,615,997
- Issue date Mar 28, 2023
- Richwave Technology Corp.
- Yu-Lung Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 11,508,694
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stretchable display device
- Patent number 11,430,773
- Issue date Aug 30, 2022
- LG Display Co., Ltd.
- Hyunju Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure including a first surface mount component a...
- Patent number 11,424,213
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die with capillary flow structures for direct chip at...
- Patent number 11,264,349
- Issue date Mar 1, 2022
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit backplane of display panel, method for manufacturing the ci...
- Patent number 11,257,852
- Issue date Feb 22, 2022
- BOE Technology Group Co., Ltd.
- Haixu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a device fixed on a substrate with an a...
- Patent number 11,233,029
- Issue date Jan 25, 2022
- Mitsubishi Electric Corporation
- Kazuo Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method for manufacturing the same, and power...
- Patent number 11,183,479
- Issue date Nov 23, 2021
- Mitsubishi Electric Corporation
- Shohei Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and method of processing a semiconductor chip
- Patent number 11,164,830
- Issue date Nov 2, 2021
- Infineon Technologies AG
- Dietrich Bonart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 11,145,638
- Issue date Oct 12, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Hyun Goo Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state image pickup element with dam to control resin outflow
- Patent number 11,121,112
- Issue date Sep 14, 2021
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Junichiro Fujimagari
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Packaged semiconductor devices and methods of packaging thereof
- Patent number 11,094,622
- Issue date Aug 17, 2021
- Taiwan Semiconductor Manufacturing Company
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack of electrical components and method of producing the same
- Patent number 11,088,106
- Issue date Aug 10, 2021
- TDK Corporation
- Yohei Hirota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Negative fillet for mounting an integrated device die to a carrier
- Patent number 11,056,455
- Issue date Jul 6, 2021
- Analog Devices, Inc.
- Vikram Venkatadri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill control structures and method
- Patent number 11,018,069
- Issue date May 25, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE
- Publication number 20250239496
- Publication date Jul 24, 2025
- STMicroelectronics International N.V.
- Younes BOUTALEB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20250219010
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210570
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Hakmin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH SIDEWALL RECESSES
- Publication number 20250192090
- Publication date Jun 12, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Rennier RODRIGUEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20250174612
- Publication date May 29, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Hyun Goo Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-CONDUCTIVE FILM FILLET CONTROL IN SEMICONDUCTOR DEVICE ASSEMBLY
- Publication number 20250132279
- Publication date Apr 24, 2025
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20250087549
- Publication date Mar 13, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Yu Jin JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED SEMICONDUCTOR PACKAGING DEVICE
- Publication number 20250070073
- Publication date Feb 27, 2025
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Che-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE COMPRISING DAM AND MULTI-LAYERED UNDER-FILL L...
- Publication number 20250070072
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Seongyo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH NON-CONDUCTIVE FILM RETENTION ARRANGEMEN...
- Publication number 20250062269
- Publication date Feb 20, 2025
- Micron Technology, Inc.
- Kai Chieh Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250054900
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Yen Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BARRIER STRUCTURE FOR POWER MODULES
- Publication number 20240413118
- Publication date Dec 12, 2024
- INFINEON TECHNOLOGIES AG
- Peter Scherl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF
- Publication number 20240363577
- Publication date Oct 31, 2024
- Siliconware Precision Industries Co., Ltd.
- Pin-Jing SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER DISPENSING COMBINED WITH NON-CONDUCTIVE PASTE TO ENABLE PAC...
- Publication number 20240321807
- Publication date Sep 26, 2024
- Intel Corporation
- Jonas CROISSANT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die and Method for Attaching a Semiconductor Die to a...
- Publication number 20240312944
- Publication date Sep 19, 2024
- TE Connectivity Solutions GMBH
- Kaspar Jenni
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATE...
- Publication number 20240222145
- Publication date Jul 4, 2024
- Micron Technology, Inc.
- Shijian Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermally Conductive IC Spacer with Integrated Electrical Isolation
- Publication number 20240128210
- Publication date Apr 18, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Amit Ashara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR PACKAGE...
- Publication number 20240096840
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Eunsu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240096841
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Ohguk KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240088108
- Publication date Mar 14, 2024
- Samsung Electronics Co., Ltd.
- Joonghyun BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240088114
- Publication date Mar 14, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Hyun Goo Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE
- Publication number 20240071981
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages with Liquid Metal as Heat-Dissipation Media and Method For...
- Publication number 20240038627
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE
- Publication number 20240038713
- Publication date Feb 1, 2024
- Kabushiki Kaisha Toshiba
- Shotaro Baba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CO-PACKAGE FOR QUBITS AND PARAMETRIC JOSEPHSON DEVICES
- Publication number 20240038723
- Publication date Feb 1, 2024
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240038725
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- Keumhee MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240021581
- Publication date Jan 18, 2024
- Samsung Electronics Co., Ltd.
- Jung Min KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH PHOTONIC DIE AND METHOD
- Publication number 20240014103
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE DEVICE PREVENTING SOLDER OVERFLOW
- Publication number 20230395553
- Publication date Dec 7, 2023
- PANJIT INTERNATIONAL INC.
- CHUNG-HSIUNG HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF PRODUCING THE SAME, AND ELECTRONIC...
- Publication number 20230343803
- Publication date Oct 26, 2023
- Sony Semiconductor Solutions Corporation
- Toshiaki IWAFUCHI
- H01 - BASIC ELECTRIC ELEMENTS

Flow barriers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of fabricating semiconductor structure including a barrier s...

Semiconductor package and method of forming the same

Semiconductor devices and methods of manufacturing semiconductor de...

Method for fabricating electronic package structure

Method for manufacturing a structure

Semiconductor device and manufacturing method therefor

Semiconductor device with a multi-layered encapsulant and associate...

Semiconductor die with capillary flow structures for direct chip at...

Package structure and manufacturing method thereof

Stack of electrical components and method of producing the same

Semiconductor structure including a semiconductor wafer and a surfa...

Semiconductor devices and methods of manufacturing semiconductor de...

Semiconductor package

Display module and method of manufacturing the same

Solid-state image pickup element, electronic equipment, and semicon...

Electronic package structure and fabrication method thereof

Chip assembly

Stretchable display device

Semiconductor structure including a first surface mount component a...

Semiconductor die with capillary flow structures for direct chip at...

Circuit backplane of display panel, method for manufacturing the ci...

Semiconductor device having a device fixed on a substrate with an a...

Semiconductor device, method for manufacturing the same, and power...

Semiconductor chip and method of processing a semiconductor chip

Semiconductor devices and methods of manufacturing semiconductor de...

Solid-state image pickup element with dam to control resin outflow

Packaged semiconductor devices and methods of packaging thereof

Stack of electrical components and method of producing the same

Negative fillet for mounting an integrated device die to a carrier

Underfill control structures and method

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGE

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICES WITH SIDEWALL RECESSES

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

NON-CONDUCTIVE FILM FILLET CONTROL IN SEMICONDUCTOR DEVICE ASSEMBLY

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

EMBEDDED SEMICONDUCTOR PACKAGING DEVICE

SEMICONDUCTOR PACKAGE COMPRISING DAM AND MULTI-LAYERED UNDER-FILL L...

SEMICONDUCTOR DEVICES WITH NON-CONDUCTIVE FILM RETENTION ARRANGEMEN...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SOLDER BARRIER STRUCTURE FOR POWER MODULES

ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF

BARRIER DISPENSING COMBINED WITH NON-CONDUCTIVE PASTE TO ENABLE PAC...

Semiconductor Die and Method for Attaching a Semiconductor Die to a...

SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATE...

Thermally Conductive IC Spacer with Integrated Electrical Isolation

SEMICONDUCTOR CHIP, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR PACKAGE...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE

Packages with Liquid Metal as Heat-Dissipation Media and Method For...

SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE

CO-PACKAGE FOR QUBITS AND PARAMETRIC JOSEPHSON DEVICES

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE WITH PHOTONIC DIE AND METHOD

PACKAGE DEVICE PREVENTING SOLDER OVERFLOW

SEMICONDUCTOR DEVICE, METHOD OF PRODUCING THE SAME, AND ELECTRONIC...