Flow barriers

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H01L2224/10175

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/10175Flow barriers

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Methods of manufacturing semiconductor device with bump interconnec...
- Patent number 12,002,783
- Issue date Jun 4, 2024
- SK hynix Inc.
- Jun Yong Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing substrate structure with filling material f...
- Patent number 11,973,014
- Issue date Apr 30, 2024
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and electronic component package
- Patent number 11,688,674
- Issue date Jun 27, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Sang Min Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-bump sidewall protection
- Patent number 11,476,219
- Issue date Oct 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device with a reflow wall
- Patent number 11,437,333
- Issue date Sep 6, 2022
- Texas Instruments Incorporated
- Vikas Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,315,866
- Issue date Apr 26, 2022
- Rohm Co., Ltd.
- Isamu Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing of flip-chip electronic device with carrier having he...
- Patent number 11,251,160
- Issue date Feb 15, 2022
- International Business Machines Corporation
- Stefano Oggioni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices and methods of packaging thereof
- Patent number 11,094,622
- Issue date Aug 17, 2021
- Taiwan Semiconductor Manufacturing Company
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit substrate
- Patent number 11,049,831
- Issue date Jun 29, 2021
- Murata Manufacturing Co., Ltd.
- Minoru Hatase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip electronic device with carrier having heat dissipation el...
- Patent number 10,886,254
- Issue date Jan 5, 2021
- International Business Machines Corporation
- Stefano Oggioni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-bump sidewall protection
- Patent number 10,784,222
- Issue date Sep 22, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip method
- Patent number 10,770,425
- Issue date Sep 8, 2020
- TONGFU MICROELECTRONCS CO., LTD.
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure and module
- Patent number 10,763,200
- Issue date Sep 1, 2020
- Fujikura Ltd.
- Kohei Matsumaru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump-on-trace packaging structure and method for forming the same
- Patent number 10,600,709
- Issue date Mar 24, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate and semiconductor package including the same
- Patent number 10,573,588
- Issue date Feb 25, 2020
- Samsung Electronics Co., Ltd.
- Hohyeuk Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fiducial mark for chip bonding
- Patent number 10,438,897
- Issue date Oct 8, 2019
- 3M Innovative Properties Company
- Siang Sin Foo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip mounted on a packaging substrate
- Patent number 10,418,340
- Issue date Sep 17, 2019
- Sony Corporation
- Makoto Murai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trace design for bump-on-trace (BOT) assembly
- Patent number 10,269,759
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Liang Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bump-on-trace packaging structure and method for forming the same
- Patent number 10,192,804
- Issue date Jan 29, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip electronic device with carrier having heat dissipation el...
- Patent number 10,153,250
- Issue date Dec 11, 2018
- International Business Machines Corporation
- Stefano Oggioni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and semiconductor device
- Patent number 10,109,580
- Issue date Oct 23, 2018
- Shinko Electric Industries Co., Ltd.
- Shunichiro Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate and semiconductor package structure having...
- Patent number 9,978,705
- Issue date May 22, 2018
- Advanced Semiconductor Engineering, Inc.
- Guo-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate and LED flip chip package structure
- Patent number 9,966,518
- Issue date May 8, 2018
- KAISTAR Lighting (Xiamen) Co., Ltd
- Yi Ching Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper pillar sidewall protection
- Patent number 9,875,980
- Issue date Jan 23, 2018
- Amkor Technology, Inc.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of self-confinement of conductive b...
- Patent number 9,865,556
- Issue date Jan 9, 2018
- STATS ChipPAC Pte. Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging device having plural microstructures disposed proximate t...
- Patent number 9,837,346
- Issue date Dec 5, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,818,678
- Issue date Nov 14, 2017
- Renesas Electronics Corporation
- Jumpei Konno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 9,691,676
- Issue date Jun 27, 2017
- SOCIONEXT INC.
- Takeshi Kodama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of confining conductive bump materi...
- Patent number 9,679,811
- Issue date Jun 13, 2017
- STATS ChipPAC Pte. Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming conductive layer over su...
- Patent number 9,679,846
- Issue date Jun 13, 2017
- STATS ChipPAC Pte. Ltd.
- JaeHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20240297134
- Publication date Sep 5, 2024
- Skyworks Solutions, Inc.
- Suresh Babu Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE, PACKAGING SUBSTRATE AND FABRICATING METHOD THEREOF
- Publication number 20240282689
- Publication date Aug 22, 2024
- Siliconware Precision Industries Co., Ltd.
- Chan-Yu YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240145417
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Hyeongwoo JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240055385
- Publication date Feb 15, 2024
- WISTRON NEWEB CORPORATION
- KUO-HUA HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY INCLUDING MULTIPLE SOLDER MASKS
- Publication number 20240038703
- Publication date Feb 1, 2024
- ATI Technologies ULC
- JIANGUO LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230411268
- Publication date Dec 21, 2023
- LG Innotek Co., Ltd.
- Hodol YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT FOR IC PACKAGE
- Publication number 20230170285
- Publication date Jun 1, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Ruby Ann Merto Camenforte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal-Bump Sidewall Protection
- Publication number 20220367397
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICES WITH UNIFORM SOLDER JOINTS
- Publication number 20210066239
- Publication date Mar 4, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Steffany Ann Lacierda Moreno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal-Bump Sidewall Protection
- Publication number 20210005564
- Publication date Jan 7, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200411425
- Publication date Dec 31, 2020
- Rohm Co., Ltd.
- Isamu NISHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH IMPROVED DIE PAD AND SOLDER MASK...
- Publication number 20200251436
- Publication date Aug 6, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SUBSTRATE STRUCTURE WITH FILLING MATERIAL F...
- Publication number 20200091059
- Publication date Mar 19, 2020
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING STRUCTURE AND MODULE
- Publication number 20200091057
- Publication date Mar 19, 2020
- FUJIKURA LTD.
- Kohei MATSUMARU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP METHOD
- Publication number 20190385974
- Publication date Dec 19, 2019
- TONGFU MICROELECTRONICS CO., LTD.
- Lei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SUBSTRATE
- Publication number 20190378808
- Publication date Dec 12, 2019
- Murata Manufacturing Co., Ltd.
- Minoru Hatase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Trace Design for Bump-on-Trace (BOT) Assembly
- Publication number 20190252347
- Publication date Aug 15, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Liang Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP-CHIP ELECTRONIC DEVICE WITH CARRIER HAVING HEAT DISSIPATION EL...
- Publication number 20190043838
- Publication date Feb 7, 2019
- International Business Machines Corporation
- Stefano OGGIONI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP-ON-TRACE PACKAGING STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20180337106
- Publication date Nov 22, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL COMPONENT WITH THIN SOLDER RESIST LAYER AND METHOD FOR T...
- Publication number 20180331062
- Publication date Nov 15, 2018
- Alexander SCHMAJEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE WITH A REFLOW WALL
- Publication number 20180190608
- Publication date Jul 5, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Vikas Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP ELECTRONIC DEVICE WITH CARRIER HAVING HEAT DISSIPATION EL...
- Publication number 20160307874
- Publication date Oct 20, 2016
- International Business Machines Corporation
- Stefano OGGIONI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Self-Confinement of Conductive B...
- Publication number 20160071813
- Publication date Mar 10, 2016
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BUMP REFLOW BY INDUCTION HEATING
- Publication number 20150294948
- Publication date Oct 15, 2015
- International Business Machines Corporation
- Stephen P. Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER LAYER ON BUMP AND NON-WETTABLE COATING ON TRACE
- Publication number 20140322868
- Publication date Oct 30, 2014
- Omar James Bchir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20140306339
- Publication date Oct 16, 2014
- FUJITSU SEMICONDUCTOR LIMITED
- Hikaru Ohira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP INTERPOSER, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING...
- Publication number 20140306355
- Publication date Oct 16, 2014
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20140284789
- Publication date Sep 25, 2014
- RENESAS ELECTRONICS CORPORATION
- Masaki Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20140264792
- Publication date Sep 18, 2014
- United Test & Assembly Center Ltd.
- Yong Bo YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP HYBRIDIZATION OF MICROELECTRONIC COMPONENTS BY LOCAL HEAT...
- Publication number 20140210076
- Publication date Jul 31, 2014
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Abdelkader ALIANE
- H01 - BASIC ELECTRIC ELEMENTS

Flow barriers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods of manufacturing semiconductor device with bump interconnec...

Method of manufacturing substrate structure with filling material f...

Printed circuit board and electronic component package

Metal-bump sidewall protection

Packaged semiconductor device with a reflow wall

Semiconductor device

Manufacturing of flip-chip electronic device with carrier having he...

Packaged semiconductor devices and methods of packaging thereof

Circuit substrate

Flip-chip electronic device with carrier having heat dissipation el...

Metal-bump sidewall protection

Flip-chip method

Mounting structure and module

Bump-on-trace packaging structure and method for forming the same

Package substrate and semiconductor package including the same

Fiducial mark for chip bonding

Semiconductor chip mounted on a packaging substrate

Trace design for bump-on-trace (BOT) assembly

Bump-on-trace packaging structure and method for forming the same

Flip-chip electronic device with carrier having heat dissipation el...

Wiring board and semiconductor device

Semiconductor substrate and semiconductor package structure having...

Package substrate and LED flip chip package structure

Copper pillar sidewall protection

Semiconductor device and method of self-confinement of conductive b...

Packaging device having plural microstructures disposed proximate t...

Semiconductor device

Semiconductor device and method for manufacturing the same

Semiconductor device and method of confining conductive bump materi...

Semiconductor device and method of forming conductive layer over su...

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE

ELECTRONIC PACKAGE, PACKAGING SUBSTRATE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR ASSEMBLY INCLUDING MULTIPLE SOLDER MASKS

SEMICONDUCTOR PACKAGE

INTERCONNECT FOR IC PACKAGE

Metal-Bump Sidewall Protection

PACKAGED SEMICONDUCTOR DEVICES WITH UNIFORM SOLDER JOINTS

Metal-Bump Sidewall Protection

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE PACKAGE WITH IMPROVED DIE PAD AND SOLDER MASK...

METHOD OF MANUFACTURING SUBSTRATE STRUCTURE WITH FILLING MATERIAL F...

MOUNTING STRUCTURE AND MODULE

FLIP-CHIP METHOD

CIRCUIT SUBSTRATE

Trace Design for Bump-on-Trace (BOT) Assembly

FLIP-CHIP ELECTRONIC DEVICE WITH CARRIER HAVING HEAT DISSIPATION EL...

BUMP-ON-TRACE PACKAGING STRUCTURE AND METHOD FOR FORMING THE SAME

ELECTRICAL COMPONENT WITH THIN SOLDER RESIST LAYER AND METHOD FOR T...

PACKAGED SEMICONDUCTOR DEVICE WITH A REFLOW WALL

FLIP-CHIP ELECTRONIC DEVICE WITH CARRIER HAVING HEAT DISSIPATION EL...

Semiconductor Device and Method of Self-Confinement of Conductive B...

SOLDER BUMP REFLOW BY INDUCTION HEATING

BARRIER LAYER ON BUMP AND NON-WETTABLE COATING ON TRACE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

CHIP INTERPOSER, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

FLIP-CHIP HYBRIDIZATION OF MICROELECTRONIC COMPONENTS BY LOCAL HEAT...