Fluorine [F]

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H01L2924/01009

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/01009Fluorine [F]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Process for manufacturing assembly pads on a carrier for the self-a...
- Patent number 11,380,648
- Issue date Jul 5, 2022
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Léa Di Cioccio
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Display device having a hollow polymer encapsulation layer
- Patent number 11,245,097
- Issue date Feb 8, 2022
- Samsung Display Co., Ltd.
- Jiyun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive composition, electronic-component-mounted substrate and se...
- Patent number 10,504,864
- Issue date Dec 10, 2019
- Hitachi Chemical Company, Ltd.
- Kaoru Konno
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Systems and methods for gap filling improvement
- Patent number 10,283,359
- Issue date May 7, 2019
- Taiwan Semiconductor Manufacturing Company Limited
- Chi-Yuan Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Conductive connecting member and manufacturing method of same
- Patent number 10,177,079
- Issue date Jan 8, 2019
- Furukawa Electric Co., Ltd.
- Hideo Nishikubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 9,805,980
- Issue date Oct 31, 2017
- Renesas Electronics Corporation
- Tadashi Munakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding substrates
- Patent number 9,673,167
- Issue date Jun 6, 2017
- EV Group E. Thallner GmbH
- Markus Wimplinger
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electronic component assembly
- Patent number 9,426,899
- Issue date Aug 23, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takashi Kitae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive composition, electronic-component-mounted substrate and se...
- Patent number 9,247,652
- Issue date Jan 26, 2016
- Hitachi Chemical Company, Ltd.
- Kaoru Konno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 8,877,613
- Issue date Nov 4, 2014
- Renesas Electronics Corporation
- Tadashi Munakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition and semiconductor device produced by using the same
- Patent number 8,853,312
- Issue date Oct 7, 2014
- Sumitomo Bakelite Co., Ltd.
- Hikaru Okubo
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Anisotropic conductive adhesive
- Patent number 8,845,849
- Issue date Sep 30, 2014
- Dexerials Corporation
- Hiroyuki Kumakura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Flip-chip mounting resin composition and bump forming resin composi...
- Patent number 8,709,293
- Issue date Apr 29, 2014
- Panasonic Corporation
- Takashi Kitae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive composition for semiconductor, semiconductor device making...
- Patent number 8,653,202
- Issue date Feb 18, 2014
- Toray Industries, Inc.
- Koichi Fujimaru
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor electronic component and semiconductor device using t...
- Patent number 8,629,564
- Issue date Jan 14, 2014
- Sumitomo Bakelite Co., Ltd.
- Satoru Katsurayama
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Positive-type photosensitive resin composition, method for producin...
- Patent number 8,461,699
- Issue date Jun 11, 2013
- Hitachi Chemical Company, Ltd.
- Hiroshi Matsutani
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Connecting material having metallic particles of an oxygen state ra...
- Patent number 8,421,247
- Issue date Apr 16, 2013
- Hitachi Chemical Company, Ltd.
- Hiroki Hayashi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor chip with coil element over passivation layer
- Patent number 8,362,588
- Issue date Jan 29, 2013
- Megica Corporation
- Wen-Chieh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device using an Al-Zn conn...
- Patent number 8,356,742
- Issue date Jan 22, 2013
- Hitachi, Ltd.
- Osamu Ikeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic assemblies having compliant layers
- Patent number 8,338,925
- Issue date Dec 25, 2012
- Tessera, Inc.
- Joseph Fjelstad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive tape and semiconductor device using the same
- Patent number 8,319,350
- Issue date Nov 27, 2012
- Sumitomo Bakelite Co., Ltd.
- Satoru Katsurayama
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Film-like adhesive, adhesive sheet, and semiconductor device using...
- Patent number 8,293,847
- Issue date Oct 23, 2012
- Hitachi Chemical Co., Ltd.
- Takashi Masuko
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Flip chip mounting method and bump forming method
- Patent number 8,283,246
- Issue date Oct 9, 2012
- Panasonic Corporation
- Takashi Kitae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component built-in wiring board
- Patent number 8,130,507
- Issue date Mar 6, 2012
- NGK Spark Plug Co., Ltd.
- Makoto Origuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip connection structure having powder-like conductive substa...
- Patent number 8,097,958
- Issue date Jan 17, 2012
- Panasonic Corporation
- Susumu Sawada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anisotropic conductive adhesive
- Patent number 8,092,636
- Issue date Jan 10, 2012
- Sony Chemical & Information Device Corporation
- Hiroyuki Kumakura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method and apparatus for loading solder balls
- Patent number 8,091,766
- Issue date Jan 10, 2012
- Ibiden Co., Ltd.
- Katsuhiko Tanno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition and semiconductor device produced by using the same
- Patent number 8,088,308
- Issue date Jan 3, 2012
- Sumitomo Bakelite Company, Ltd.
- Hikaru Okubo
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Noncontact information storage medium and method for manufacturing...
- Patent number 8,083,150
- Issue date Dec 27, 2011
- Panasonic Corporation
- Daisuke Sakurai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flip chip mounting body, flip chip mounting method and flip chip mo...
- Patent number 8,071,425
- Issue date Dec 6, 2011
- Panasonic Corporation
- Seiichi Nakatani
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROCESS FOR MANUFACTURING ASSEMBLY PADS ON A CARRIER FOR THE SELF-A...
- Publication number 20190259729
- Publication date Aug 22, 2019
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Léa DI CIOCCIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and Methods for Gap Filling Improvement
- Publication number 20170221710
- Publication date Aug 3, 2017
- Taiwan Semiconductor Manufacturing Company Limited
- Chi-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING SUBSTRATES
- Publication number 20150179604
- Publication date Jun 25, 2015
- EV GROUP E. THALLNER GMBH
- Markus Wimplinger
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140035115
- Publication date Feb 6, 2014
- SUMITOMO BAKELITE CO., LTD.
- Shin-ichi Zenbutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING MATERIAL, METHOD FOR MANUFACTURING CONNECTING MATERIAL A...
- Publication number 20130127026
- Publication date May 23, 2013
- Osamu Ikeda
- B32 - LAYERED PRODUCTS
Information Patent Application
RESIN COMPOSITION AND SEMICONDUCTOR DEVICE PRODUCED BY USING THE SAME
- Publication number 20130109798
- Publication date May 2, 2013
- SUMITOMO BAKELITE CO., LTD.
- Hikaru OKUBO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CONDUCTIVE CONNECTING MEMBER AND MANUFACTURING METHOD OF SAME
- Publication number 20130001775
- Publication date Jan 3, 2013
- Hideo Nishikubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE ADHESIVE
- Publication number 20120112136
- Publication date May 10, 2012
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Hiroyuki Kumakura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD AND APPARATUS FOR LOADING SOLDER BALLS
- Publication number 20120067938
- Publication date Mar 22, 2012
- IBIDEN CO., LTD.
- Katsuhiko TANNO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION AND SEMICONDUCTOR DEVICE PRODUCED BY USING THE SAME
- Publication number 20120068106
- Publication date Mar 22, 2012
- Sumitomo Bakelite Company, Ltd.
- Hikaru OKUBO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CONNECTING MATERIAL, METHOD FOR MANUFACTURING CONNECTING MATERIAL A...
- Publication number 20120000965
- Publication date Jan 5, 2012
- Osamu Ikeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCIN...
- Publication number 20110254178
- Publication date Oct 20, 2011
- Hiroshi Matsutani
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SEMICONDUCTOR CHIP WITH COIL ELEMENT OVER PASSIVATION LAYER
- Publication number 20110233776
- Publication date Sep 29, 2011
- MEGICA Corporation
- Wen-Chieh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALUMINUM FOR ULTRASONIC BONDING
- Publication number 20110236697
- Publication date Sep 29, 2011
- TANAKA DENSHI KOGYO, K.K.
- Michitaka Mikami
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
FLIP CHIP MOUNTING METHOD AND BUMP FORMING METHOD
- Publication number 20110201195
- Publication date Aug 18, 2011
- PANASONIC CORPORATION
- Takashi KITAE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP-CHIP MOUNTING METHOD AND BUMP FORMATION METHOD
- Publication number 20110162578
- Publication date Jul 7, 2011
- PANASONIC CORPORATION
- Koichi Hirano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTING MATERIAL AND SEMICONDUCTOR DEVICE
- Publication number 20110101543
- Publication date May 5, 2011
- Hiroki Hayashi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING COMPLIANT LAYERS
- Publication number 20110095441
- Publication date Apr 28, 2011
- Tessera, Inc.
- Joseph Fjelstad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20110089549
- Publication date Apr 21, 2011
- SUMITOMO BAKELITE CO., LTD.
- Shin-ichi Zenbutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing A Semiconductor Device
- Publication number 20110020984
- Publication date Jan 27, 2011
- Renesas Electronics Corporation
- Tadashi MUNAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER SUBSTRATE, LSI CHIP AND INFORMATION TERMINAL DEVICE USIN...
- Publication number 20100309641
- Publication date Dec 9, 2010
- Renesas Technology Corp.
- Hanae Hata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FILM-LIKE ADHESIVE, ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE USING...
- Publication number 20100239858
- Publication date Sep 23, 2010
- Takashi Masuko
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MOUNTED BODY AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100224986
- Publication date Sep 9, 2010
- PANASONIC CORPORATION
- Toshiyuki Kojima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE COMPOSITION, ELECTRONIC-COMPONENT-MOUNTED SUBSTRATE AND SE...
- Publication number 20100221559
- Publication date Sep 2, 2010
- Kaoru Konno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP CHIP MOUNTING BODY, FLIP CHIP MOUNTING METHOD AND FLIP CHIP MO...
- Publication number 20100203675
- Publication date Aug 12, 2010
- PANASONIC CORPORATION
- Seiichi NAKATANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE ADHESIVE
- Publication number 20100200160
- Publication date Aug 12, 2010
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Hiroyuki Kumakura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, AND SEMIC...
- Publication number 20100178501
- Publication date Jul 15, 2010
- Takashi Masuko
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
FLIP CHIP MOUNTING PROCESS AND FLIP CHIP ASSEMBLY
- Publication number 20100148376
- Publication date Jun 17, 2010
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE USING T...
- Publication number 20100102446
- Publication date Apr 29, 2010
- Satoru Katsurayama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE TAPE AND SEMICONDUCTOR DEVICE USING THE SAME
- Publication number 20100078830
- Publication date Apr 1, 2010
- SUMITOMO BAKELITE CO., LTD.
- Satoru Katsurayama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Fluorine [F]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Process for manufacturing assembly pads on a carrier for the self-a...

Display device having a hollow polymer encapsulation layer

Adhesive composition, electronic-component-mounted substrate and se...

Systems and methods for gap filling improvement

Conductive connecting member and manufacturing method of same

Method of manufacturing a semiconductor device

Method for bonding substrates

Electronic component assembly

Adhesive composition, electronic-component-mounted substrate and se...

Method of manufacturing a semiconductor device

Resin composition and semiconductor device produced by using the same

Anisotropic conductive adhesive

Flip-chip mounting resin composition and bump forming resin composi...

Adhesive composition for semiconductor, semiconductor device making...

Semiconductor electronic component and semiconductor device using t...

Positive-type photosensitive resin composition, method for producin...

Connecting material having metallic particles of an oxygen state ra...

Semiconductor chip with coil element over passivation layer

Method for manufacturing a semiconductor device using an Al-Zn conn...

Microelectronic assemblies having compliant layers

Adhesive tape and semiconductor device using the same

Film-like adhesive, adhesive sheet, and semiconductor device using...

Flip chip mounting method and bump forming method

Component built-in wiring board

Flip chip connection structure having powder-like conductive substa...

Anisotropic conductive adhesive

Method and apparatus for loading solder balls

Resin composition and semiconductor device produced by using the same

Noncontact information storage medium and method for manufacturing...

Flip chip mounting body, flip chip mounting method and flip chip mo...

Patents Applicationslast 30 patents

PROCESS FOR MANUFACTURING ASSEMBLY PADS ON A CARRIER FOR THE SELF-A...

Systems and Methods for Gap Filling Improvement

METHOD FOR BONDING SUBSTRATES

SEMICONDUCTOR DEVICE

CONNECTING MATERIAL, METHOD FOR MANUFACTURING CONNECTING MATERIAL A...

RESIN COMPOSITION AND SEMICONDUCTOR DEVICE PRODUCED BY USING THE SAME

CONDUCTIVE CONNECTING MEMBER AND MANUFACTURING METHOD OF SAME

ANISOTROPIC CONDUCTIVE ADHESIVE

METHOD AND APPARATUS FOR LOADING SOLDER BALLS

RESIN COMPOSITION AND SEMICONDUCTOR DEVICE PRODUCED BY USING THE SAME

CONNECTING MATERIAL, METHOD FOR MANUFACTURING CONNECTING MATERIAL A...

POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCIN...

SEMICONDUCTOR CHIP WITH COIL ELEMENT OVER PASSIVATION LAYER

ALUMINUM FOR ULTRASONIC BONDING

FLIP CHIP MOUNTING METHOD AND BUMP FORMING METHOD

FLIP-CHIP MOUNTING METHOD AND BUMP FORMATION METHOD

CONNECTING MATERIAL AND SEMICONDUCTOR DEVICE

MICROELECTRONIC ASSEMBLIES HAVING COMPLIANT LAYERS

SEMICONDUCTOR DEVICE

Method of Manufacturing A Semiconductor Device

INTERPOSER SUBSTRATE, LSI CHIP AND INFORMATION TERMINAL DEVICE USIN...

FILM-LIKE ADHESIVE, ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE USING...

MOUNTED BODY AND METHOD FOR MANUFACTURING THE SAME

ADHESIVE COMPOSITION, ELECTRONIC-COMPONENT-MOUNTED SUBSTRATE AND SE...

FLIP CHIP MOUNTING BODY, FLIP CHIP MOUNTING METHOD AND FLIP CHIP MO...

ANISOTROPIC CONDUCTIVE ADHESIVE

ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, AND SEMIC...

FLIP CHIP MOUNTING PROCESS AND FLIP CHIP ASSEMBLY

SEMICONDUCTOR ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE USING T...

ADHESIVE TAPE AND SEMICONDUCTOR DEVICE USING THE SAME