for aligning the bonding area

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H01L2224/03015

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/03015for aligning the bonding area

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for permanent connection of two metal surfaces
- Patent number 12,107,057
- Issue date Oct 1, 2024
- EV Group E. Thallner GmbH
- Viorel Dragoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having alignment pads and method of manufactur...
- Patent number 11,616,032
- Issue date Mar 28, 2023
- Infineon Technologies AG
- Daniel Maurer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing a semiconductor device with spacer over sidewa...
- Patent number 11,552,032
- Issue date Jan 10, 2023
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit backside metallization
- Patent number 11,367,699
- Issue date Jun 21, 2022
- Texas Instruments Incorporated
- Hiroyuki Sada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for permanent connection of two metal surfaces
- Patent number 11,282,801
- Issue date Mar 22, 2022
- EV Group E. Thallner GmbH
- Viorel Dragoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with interconnect structure and method for pre...
- Patent number 11,177,194
- Issue date Nov 16, 2021
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with spacer over sidewall of bonding pad and m...
- Patent number 11,024,592
- Issue date Jun 1, 2021
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming connector pad structures, interconnect structure...
- Patent number 10,840,199
- Issue date Nov 17, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit backside metallization
- Patent number 10,763,230
- Issue date Sep 1, 2020
- Texas Instruments Incorporated
- Hiroyuki Sada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a corresponding method of manufacturing se...
- Patent number 10,593,625
- Issue date Mar 17, 2020
- STMicroelectronics S.r.l.
- Samuele Sciarrillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming connector pad structures, interconnect structure...
- Patent number 10,515,915
- Issue date Dec 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming connector pad structures, interconnect structure...
- Patent number 10,269,739
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with sacrificial anode and method for forming
- Patent number 10,199,339
- Issue date Feb 5, 2019
- NXP USA, INC.
- Sheila F. Chopin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with sacrificial anode and passivation laye...
- Patent number 9,412,709
- Issue date Aug 9, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Sheila F. Chopin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of the same
- Patent number 9,379,081
- Issue date Jun 28, 2016
- KING DRAGON NTERNATIONAL INC.
- Wen Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor devices having a glass subst...
- Patent number 8,865,522
- Issue date Oct 21, 2014
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor devices having a glass subst...
- Patent number 8,803,312
- Issue date Aug 12, 2014
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor devices having a glass subst...
- Patent number 8,546,934
- Issue date Oct 1, 2013
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor devices having a glass subst...
- Patent number 8,202,786
- Issue date Jun 19, 2012
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FINE-PITCH JOINING PAD STRUCTURE
- Publication number 20230317652
- Publication date Oct 5, 2023
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF, AND MANUFACT...
- Publication number 20220302059
- Publication date Sep 22, 2022
- TDK Corporation
- Atsushi YOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING ALIGNMENT PADS AND METHOD OF MANUFACTUR...
- Publication number 20210242148
- Publication date Aug 5, 2021
- INFINEON TECHNOLOGIES AG
- Daniel Maurer
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR PREPARING A SEMICONDUCTOR DEVICE WITH SPACER OVER SIDEWA...
- Publication number 20210202416
- Publication date Jul 1, 2021
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTERCONNECT STRUCTURE AND METHOD FOR PRE...
- Publication number 20210193559
- Publication date Jun 24, 2021
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SPACER OVER SIDEWALL OF BONDING PAD AND M...
- Publication number 20210118830
- Publication date Apr 22, 2021
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT BACKSIDE METALLIZATION
- Publication number 20210035932
- Publication date Feb 4, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Hiroyuki SADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING CONNECTOR PAD STRUCTURES, INTERCONNECT STRUCTURE...
- Publication number 20190244918
- Publication date Aug 8, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA STRUCTURE, SUBSTRATE STRUCTURE INCLUDING THE SAME, AND METHOD F...
- Publication number 20180342473
- Publication date Nov 29, 2018
- Advanced Semiconductor Engineering, Inc.
- Wen-Long LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Connector Pad Structures, Interconnect Structure...
- Publication number 20180211928
- Publication date Jul 26, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PERMANENT CONNECTION OF TWO METAL SURFACES
- Publication number 20160322318
- Publication date Nov 3, 2016
- EV GROUP E. THALLNER GMBH
- Viorel Dragoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package and Method of the Same
- Publication number 20150270239
- Publication date Sep 24, 2015
- King Dragon International Inc.
- Wen Kun Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH SACRIFICIAL ANODE AND METHOD FOR FORMING
- Publication number 20140346663
- Publication date Nov 27, 2014
- Sheila F. Chopin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS SUBST...
- Publication number 20130328183
- Publication date Dec 12, 2013
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS SUBST...
- Publication number 20130228905
- Publication date Sep 5, 2013
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS...
- Publication number 20120248631
- Publication date Oct 4, 2012
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS...
- Publication number 20120012994
- Publication date Jan 19, 2012
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS

for aligning the bonding area

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for permanent connection of two metal surfaces

Semiconductor device having alignment pads and method of manufactur...

Method for preparing a semiconductor device with spacer over sidewa...

Integrated circuit backside metallization

Method for permanent connection of two metal surfaces

Semiconductor device with interconnect structure and method for pre...

Semiconductor device with spacer over sidewall of bonding pad and m...

Methods of forming connector pad structures, interconnect structure...

Integrated circuit backside metallization

Semiconductor device and a corresponding method of manufacturing se...

Methods of forming connector pad structures, interconnect structure...

Methods of forming connector pad structures, interconnect structure...

Semiconductor structure with sacrificial anode and method for forming

Semiconductor structure with sacrificial anode and passivation laye...

Semiconductor device package and method of the same

Method for manufacturing semiconductor devices having a glass subst...

Method for manufacturing semiconductor devices having a glass subst...

Method for manufacturing semiconductor devices having a glass subst...

Method for manufacturing semiconductor devices having a glass subst...

Patents Applicationslast 30 patents

FINE-PITCH JOINING PAD STRUCTURE

ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF, AND MANUFACT...

SEMICONDUCTOR DEVICE HAVING ALIGNMENT PADS AND METHOD OF MANUFACTUR...

METHOD FOR PREPARING A SEMICONDUCTOR DEVICE WITH SPACER OVER SIDEWA...

SEMICONDUCTOR DEVICE WITH INTERCONNECT STRUCTURE AND METHOD FOR PRE...

SEMICONDUCTOR DEVICE WITH SPACER OVER SIDEWALL OF BONDING PAD AND M...

INTEGRATED CIRCUIT BACKSIDE METALLIZATION

METHODS OF FORMING CONNECTOR PAD STRUCTURES, INTERCONNECT STRUCTURE...

VIA STRUCTURE, SUBSTRATE STRUCTURE INCLUDING THE SAME, AND METHOD F...

Methods of Forming Connector Pad Structures, Interconnect Structure...

METHOD FOR PERMANENT CONNECTION OF TWO METAL SURFACES

Semiconductor Device Package and Method of the Same

SEMICONDUCTOR STRUCTURE WITH SACRIFICIAL ANODE AND METHOD FOR FORMING

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS SUBST...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS SUBST...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS...