for aligning the bump connector

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H01L2224/11005

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/11005for aligning the bump connector

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packaging method, semiconductor assembly and electron...
- Patent number 12,218,090
- Issue date Feb 4, 2025
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging method, semiconductor assembly and electron...
- Patent number 12,159,850
- Issue date Dec 3, 2024
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and method of ball drop on thin wafer with edge...
- Patent number 12,154,877
- Issue date Nov 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor packaging method, semiconductor assembly and electron...
- Patent number 12,154,884
- Issue date Nov 26, 2024
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with solder on pillar
- Patent number 12,107,062
- Issue date Oct 1, 2024
- Texas Instruments Incorporated
- Rafael Jose Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluxless gang die bonding arrangement
- Patent number 11,972,968
- Issue date Apr 30, 2024
- SHARPACK TECHNOLOGY PTE. LTD.
- Jian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroplated indium bump stacks for cryogenic electronics
- Patent number 11,862,593
- Issue date Jan 2, 2024
- Microsoft Technology Licensing, LLC
- Christopher Cantaloube
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
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- Issue date Aug 22, 2023
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 11,367,704
- Issue date Jun 21, 2022
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level integration including design/co-design, structure proce...
- Patent number 11,201,138
- Issue date Dec 14, 2021
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of high aspect ratio solder bumping with stud bu...
- Patent number 11,181,704
- Issue date Nov 23, 2021
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and method of ball drop on thin wafer with edge...
- Patent number 11,164,835
- Issue date Nov 2, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication method of high aspect ratio solder bumping with stud bu...
- Patent number 11,112,570
- Issue date Sep 7, 2021
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flux-free solder ball mount arrangement
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- Issue date Dec 29, 2020
- Boston Process Technologies, Inc
- Jian Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods of forming connector pad structures, interconnect structure...
- Patent number 10,840,199
- Issue date Nov 17, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
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- Issue date Jul 7, 2020
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array and land grid array assemblies fabricated using tem...
- Patent number 10,679,931
- Issue date Jun 9, 2020
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal cored solder decal structure and process
- Patent number 10,658,267
- Issue date May 19, 2020
- International Business Machines Corporation
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication method of high aspect ratio solder bumping with stud bu...
- Patent number 10,598,874
- Issue date Mar 24, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- G02 - OPTICS
Information Patent Grant
Methods of forming connector pad structures, interconnect structure...
- Patent number 10,515,915
- Issue date Dec 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 10,497,666
- Issue date Dec 3, 2019
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for mounting components in semiconductor fabricat...
- Patent number 10,438,922
- Issue date Oct 8, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-conductive array disposed on target circuit substrate and condu...
- Patent number 10,431,561
- Issue date Oct 1, 2019
- Ultra Display Technology Corp.
- Hsien-Te Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for assembly of semiconductor structures in...
- Patent number 10,396,269
- Issue date Aug 27, 2019
- Massachusetts Institute of Technology
- William D. Oliver
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method for producing semiconductor chip
- Patent number 10,354,973
- Issue date Jul 16, 2019
- TDK Corporation
- Makoto Orikasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate-vias with self-aligned solder bumps
- Patent number 10,347,600
- Issue date Jul 9, 2019
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate-vias with self-aligned solder bumps
- Patent number 10,325,870
- Issue date Jun 18, 2019
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming connector pad structures, interconnect structure...
- Patent number 10,269,739
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array and land grid array assemblies fabricated using tem...
- Patent number 10,249,559
- Issue date Apr 2, 2019
- International Business Machines Corporation
- Jae-Woong Nah
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect structure and semiconductor structures for assembly of...
- Patent number 10,242,968
- Issue date Mar 26, 2019
- Massachusetts Institute of Technology
- Rabindra N. Das
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR WAFER AND METHOD OF BALL DROP ON THIN WAFER WITH EDGE...
- Publication number 20250062263
- Publication date Feb 20, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE WITH SOLDER ON PILLAR
- Publication number 20250015032
- Publication date Jan 9, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUXLESS GANG DIE BONDING ARRANGEMENT
- Publication number 20240304485
- Publication date Sep 12, 2024
- SHARPACK TECHNOLOGY PTE. LTD.
- Jian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE, METHOD FOR MANUFACTURING CHIP STRUCTURE, AND ELECTR...
- Publication number 20240290706
- Publication date Aug 29, 2024
- HONOR DEVICE CO., LTD.
- Yuan HUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROPLATED INDIUM BUMP STACKS FOR CRYOGENIC ELECTRONICS
- Publication number 20240088080
- Publication date Mar 14, 2024
- Microsoft Technology Licensing, LLC
- Christopher CANTALOUBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230343744
- Publication date Oct 26, 2023
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SOLDER ON PILLAR
- Publication number 20230299031
- Publication date Sep 21, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROPLATED INDIUM BUMP STACKS FOR CRYOGENIC ELECTRONICS
- Publication number 20220359444
- Publication date Nov 10, 2022
- Microsoft Technology Licensing, LLC
- Christopher CANTALOUBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20220278072
- Publication date Sep 1, 2022
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packaging Method, Semiconductor Assembly and Electron...
- Publication number 20220246576
- Publication date Aug 4, 2022
- Yibu Semiconductor Co., Ltd.
- Weiping LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packaging Method, Semiconductor Assembly and Electron...
- Publication number 20220208708
- Publication date Jun 30, 2022
- Yibu Semiconductor Co., Ltd.
- Weiping LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packaging Method, Semiconductor Assembly and Electron...
- Publication number 20220208709
- Publication date Jun 30, 2022
- Yibu Semiconductor Co., Ltd.
- Weiping LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER AND METHOD OF BALL DROP ON THIN WAFER WITH EDGE...
- Publication number 20220028812
- Publication date Jan 27, 2022
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fluxless gang die bonding arrangement
- Publication number 20220005720
- Publication date Jan 6, 2022
- Jian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20200321308
- Publication date Oct 8, 2020
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF HIGH ASPECT RATIO SOLDER BUMPING WITH STUD BU...
- Publication number 20200150362
- Publication date May 14, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL INTEGRATION INCLUDING DESIGN/CO-DESIGN, STRUCTURE PROCE...
- Publication number 20200126951
- Publication date Apr 23, 2020
- International Business Machines Corporation
- Bing DANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20200066675
- Publication date Feb 27, 2020
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING CONNECTOR PAD STRUCTURES, INTERCONNECT STRUCTURE...
- Publication number 20190244918
- Publication date Aug 8, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A BUMP STRUCTURE AND METHOD FOR MANUFAC...
- Publication number 20190214357
- Publication date Jul 11, 2019
- Chipbond Technology Corporation
- Chun-Te Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20190157239
- Publication date May 23, 2019
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF HIGH ASPECT RATIO SOLDER BUMPING WITH STUD BU...
- Publication number 20190131266
- Publication date May 2, 2019
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-CONDUCTIVE ARRAY DISPOSED ON TARGET CIRCUIT SUBSTRATE AND CONDU...
- Publication number 20190096835
- Publication date Mar 28, 2019
- ULTRA DISPLAY TECHNOLOGY CORP.
- Hsien-Te CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flux-free solder ball mount arrangement
- Publication number 20190043745
- Publication date Feb 7, 2019
- Boston Process Technologies, Inc
- Jian Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THROUGH-SUBSTRATE-VIAS WITH SELF-ALIGNED SOLDER BUMPS
- Publication number 20180331058
- Publication date Nov 15, 2018
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE-VIAS WITH SELF-ALIGNED SOLDER BUMPS
- Publication number 20180331057
- Publication date Nov 15, 2018
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Connector Pad Structures, Interconnect Structure...
- Publication number 20180211928
- Publication date Jul 26, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL CORED SOLDER DECAL STRUCTURE AND PROCESS
- Publication number 20180174949
- Publication date Jun 21, 2018
- International Business Machines Corporation
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MANUFACTURING PROCESS AND PACKAGE CARRIER
- Publication number 20170317033
- Publication date Nov 2, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Hui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated System and Method of Making the Integrated System
- Publication number 20170278836
- Publication date Sep 28, 2017
- INFINEON TECHNOLOGIES AG
- Thomas Kilger
- H01 - BASIC ELECTRIC ELEMENTS

for aligning the bump connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor packaging method, semiconductor assembly and electron...

Semiconductor packaging method, semiconductor assembly and electron...

Semiconductor wafer and method of ball drop on thin wafer with edge...

Semiconductor packaging method, semiconductor assembly and electron...

Semiconductor device with solder on pillar

Fluxless gang die bonding arrangement

Electroplated indium bump stacks for cryogenic electronics

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device and method for manufacturing semiconductor device

Wafer level integration including design/co-design, structure proce...

Fabrication method of high aspect ratio solder bumping with stud bu...

Semiconductor wafer and method of ball drop on thin wafer with edge...

Fabrication method of high aspect ratio solder bumping with stud bu...

Flux-free solder ball mount arrangement

Methods of forming connector pad structures, interconnect structure...

Semiconductor device and method for manufacturing semiconductor device

Ball grid array and land grid array assemblies fabricated using tem...

Metal cored solder decal structure and process

Fabrication method of high aspect ratio solder bumping with stud bu...

Methods of forming connector pad structures, interconnect structure...

Semiconductor device and method for manufacturing semiconductor device

Method and system for mounting components in semiconductor fabricat...

Pre-conductive array disposed on target circuit substrate and condu...

Interconnect structures for assembly of semiconductor structures in...

Method for producing semiconductor chip

Through-substrate-vias with self-aligned solder bumps

Through-substrate-vias with self-aligned solder bumps

Methods of forming connector pad structures, interconnect structure...

Ball grid array and land grid array assemblies fabricated using tem...

Interconnect structure and semiconductor structures for assembly of...

Patents Applicationslast 30 patents

SEMICONDUCTOR WAFER AND METHOD OF BALL DROP ON THIN WAFER WITH EDGE...

SEMICONDUCTOR DEVICE WITH SOLDER ON PILLAR

FLUXLESS GANG DIE BONDING ARRANGEMENT

CHIP STRUCTURE, METHOD FOR MANUFACTURING CHIP STRUCTURE, AND ELECTR...

ELECTROPLATED INDIUM BUMP STACKS FOR CRYOGENIC ELECTRONICS

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE WITH SOLDER ON PILLAR

ELECTROPLATED INDIUM BUMP STACKS FOR CRYOGENIC ELECTRONICS

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor Packaging Method, Semiconductor Assembly and Electron...

Semiconductor Packaging Method, Semiconductor Assembly and Electron...

Semiconductor Packaging Method, Semiconductor Assembly and Electron...

SEMICONDUCTOR WAFER AND METHOD OF BALL DROP ON THIN WAFER WITH EDGE...

Fluxless gang die bonding arrangement

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

FABRICATION METHOD OF HIGH ASPECT RATIO SOLDER BUMPING WITH STUD BU...

WAFER LEVEL INTEGRATION INCLUDING DESIGN/CO-DESIGN, STRUCTURE PROCE...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

METHODS OF FORMING CONNECTOR PAD STRUCTURES, INTERCONNECT STRUCTURE...

SEMICONDUCTOR DEVICE HAVING A BUMP STRUCTURE AND METHOD FOR MANUFAC...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

FABRICATION METHOD OF HIGH ASPECT RATIO SOLDER BUMPING WITH STUD BU...

PRE-CONDUCTIVE ARRAY DISPOSED ON TARGET CIRCUIT SUBSTRATE AND CONDU...

Flux-free solder ball mount arrangement

THROUGH-SUBSTRATE-VIAS WITH SELF-ALIGNED SOLDER BUMPS

THROUGH-SUBSTRATE-VIAS WITH SELF-ALIGNED SOLDER BUMPS

Methods of Forming Connector Pad Structures, Interconnect Structure...

METAL CORED SOLDER DECAL STRUCTURE AND PROCESS

SEMICONDUCTOR MANUFACTURING PROCESS AND PACKAGE CARRIER

Integrated System and Method of Making the Integrated System