for aligning the layer connector

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H01L2224/27015

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/27015for aligning the layer connector

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including an embedded surface mount device and...
- Patent number 9,589,938
- Issue date Mar 7, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including an embedded surface mount device an...
- Patent number 9,461,020
- Issue date Oct 4, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Der-Chyang Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including an embedded surface mount device and...
- Patent number 9,224,709
- Issue date Dec 29, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SUBSTRATE LAYERED BODY AND LAYERED BODY
- Publication number 20210391292
- Publication date Dec 16, 2021
- Mitsui Chemicals, Inc.
- Yasuhisa KAYABA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING AN EMBEDDED SURFACE MOUNT DEVICE AND...
- Publication number 20150228606
- Publication date Aug 13, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS