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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/4817for containers

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Radio frequency package implementing a window frame with edge plati...
- Patent number 12,224,217
- Issue date Feb 11, 2025
- MACOM Technology Solutions Holdings, Inc.
- Richard Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated cooling assemblies for advanced device packaging and met...
- Patent number 12,191,234
- Issue date Jan 7, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures and method for forming the same
- Patent number 12,183,714
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device packages with internal moisture barriers
- Patent number 12,125,806
- Issue date Oct 22, 2024
- Wolfspeed, Inc.
- Arthur Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with protective lid
- Patent number 12,119,276
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged RF power device with PCB routing outside protective member
- Patent number 12,100,630
- Issue date Sep 24, 2024
- MACOM Technology Solutions Holdings, Inc.
- Marvin Marbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having heat dissipation structure of curved pr...
- Patent number 12,094,836
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an insulating sheet and a conductive fi...
- Patent number 12,080,612
- Issue date Sep 3, 2024
- Fuji Electric Co., Ltd.
- Katsumi Taniguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,033,906
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded lid for low cost and improved thermal performance
- Patent number 12,021,004
- Issue date Jun 25, 2024
- Texas Instruments Incorporated
- Hiep Xuan Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical device package with compatible lid and carrier
- Patent number 12,009,353
- Issue date Jun 11, 2024
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yueh Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for forming the same
- Patent number 11,984,381
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of chip package with protective lid
- Patent number 11,978,715
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Tsung Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and measurement method for the package structure
- Patent number 11,965,731
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kuei-Sung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,955,398
- Issue date Apr 9, 2024
- Fuji Electric Co., Ltd.
- Eri Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated passive device (IPD) components and a package and proces...
- Patent number 11,935,879
- Issue date Mar 19, 2024
- Wolfspeed, Inc.
- Eng Wah Woo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including sheilding cover that covers molded...
- Patent number 11,923,319
- Issue date Mar 5, 2024
- Samsung Electronics Co., Ltd.
- Young-Woo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic semiconductor device package with copper tungsten conductiv...
- Patent number 11,915,986
- Issue date Feb 27, 2024
- Texas Instruments Incorporated
- Ramlah Binte Abdul Razak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 11,894,292
- Issue date Feb 6, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Qing Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal transfer structures for semiconductor die assemblies
- Patent number 11,862,611
- Issue date Jan 2, 2024
- Micron Technology, Inc.
- Ed A. Schrock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio-frequency device comprising semiconductor device and waveguid...
- Patent number 11,854,917
- Issue date Dec 26, 2023
- Infineon Technologies AG
- Ernst Seler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures and method for forming the same
- Patent number 11,830,859
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics unit with integrated metallic pattern
- Patent number 11,817,377
- Issue date Nov 14, 2023
- STMicroelectronics (Grenoble 2) SAS
- Romain Coffy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of housing for semiconductor device
- Patent number 11,806,903
- Issue date Nov 7, 2023
- Mitsubishi Electric Corporation
- Hiroyuki Masumoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor devices comprising a lid structure and methods of man...
- Patent number 11,784,101
- Issue date Oct 10, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Shaun Bowers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of chip package with protective lid
- Patent number 11,764,118
- Issue date Sep 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device packages with internal moisture barriers
- Patent number 11,742,302
- Issue date Aug 29, 2023
- Wolfspeed, Inc.
- Arthur Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module arrangement
- Patent number 11,699,625
- Issue date Jul 11, 2023
- Infineon Technologies AG
- Alexander Hoehn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method and semiconductor device
- Patent number 11,640,926
- Issue date May 2, 2023
- Fuji Electric Co., Ltd.
- Yuji Ichimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-hole sealing structure
- Patent number 11,626,334
- Issue date Apr 11, 2023
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STIFFENER ASSEMBLY AND METHOD FOR MAKING A SEMICONDUCTOR ASSEMBLY
- Publication number 20250054819
- Publication date Feb 13, 2025
- Intel Corporation
- Seok Ling LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED SEMICONDUCTOR DEVICE
- Publication number 20240413066
- Publication date Dec 12, 2024
- Intel Corporation
- Ranjul BALAKRISHNAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...
- Publication number 20240387322
- Publication date Nov 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH PROTECTIVE LID
- Publication number 20240379475
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Yi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371794
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL DEVICE PACKAGE
- Publication number 20240332274
- Publication date Oct 3, 2024
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yueh TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20240312852
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSERT-MOLDED ARTICLE AND METHOD FOR MANUFACTURING INSERT-MOLDED AR...
- Publication number 20240304505
- Publication date Sep 12, 2024
- Fuji Electric Co., Ltd.
- Hisato INOKUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MEASUREMENT METHOD FOR THE PACKAGE STRUCTURE
- Publication number 20240263938
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- KUEI-SUNG CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240258193
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLOATING HEAT SPREADER WITH GUIDED MECHANISM
- Publication number 20240258190
- Publication date Aug 1, 2024
- ADVANCED MICRO DEVICES, INC.
- Gamal REFAI-AHMED
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH PROTECTIVE LID
- Publication number 20240250055
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsung KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ASSEMBLY WITH THERMAL INTERFACE MATERIAL GUTTER
- Publication number 20240249996
- Publication date Jul 25, 2024
- ADVANCED MICRO DEVICES, INC.
- Michael FLYNN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20240213177
- Publication date Jun 27, 2024
- Samsung Electronics Co., Ltd.
- YOUNG-WOO PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PASSIVE DEVICES (IPD) HAVING A BASEBAND DAMPING RESISTOR...
- Publication number 20240213184
- Publication date Jun 27, 2024
- Wolfspeed, Inc.
- Haedong JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240203803
- Publication date Jun 20, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jae Yun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH BONDING PAD AND METHOD FOR FORM...
- Publication number 20240170350
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR ASSEMBLING TH...
- Publication number 20240162099
- Publication date May 16, 2024
- INFINEON TECHNOLOGIES AG
- Alexander Schmer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240128136
- Publication date Apr 18, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Seung Wook PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH ELECTRICALLY INSULATING AND THERMALLY CONDUCTIVE LAYER...
- Publication number 20240105544
- Publication date Mar 28, 2024
- INFINEON TECHNOLOGIES AG
- Shih Kien LONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods of Forming the Same
- Publication number 20240071950
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co, LTD.
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Partial EMI Shielding
- Publication number 20240063137
- Publication date Feb 22, 2024
- STATS ChipPAC Pte Ltd.
- JinHee Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240047441
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS UNIT WITH INTEGRATED METALLIC PATTERN
- Publication number 20240038644
- Publication date Feb 1, 2024
- STMicroelectronics (Grenoble 2) SAS
- Romain COFFY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240038685
- Publication date Feb 1, 2024
- Siliconware Precision Industries Co., Ltd.
- Chao-Chiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240038606
- Publication date Feb 1, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Shaun Bowers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240021485
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230411229
- Publication date Dec 21, 2023
- Fuji Electric Co., Ltd.
- Yuko NAKAMATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REINFORCED STRUCTURE WITH CAPPING LAYER AND METHODS OF FORMING THE...
- Publication number 20230395450
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Jing-Ye Juang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH PROTECTIVE LID
- Publication number 20230369149
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Yi LIN
- H01 - BASIC ELECTRIC ELEMENTS

for containers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Radio frequency package implementing a window frame with edge plati...

Integrated cooling assemblies for advanced device packaging and met...

Package structures and method for forming the same

Electronic device packages with internal moisture barriers

Package structure with protective lid

Packaged RF power device with PCB routing outside protective member

Semiconductor device having heat dissipation structure of curved pr...

Semiconductor device having an insulating sheet and a conductive fi...

Semiconductor package and manufacturing method thereof

Embedded lid for low cost and improved thermal performance

Optical device package with compatible lid and carrier

Semiconductor package structure and method for forming the same

Structure and formation method of chip package with protective lid

Package structure and measurement method for the package structure

Semiconductor device

Integrated passive device (IPD) components and a package and proces...

Semiconductor package including sheilding cover that covers molded...

Ceramic semiconductor device package with copper tungsten conductiv...

Power module

Thermal transfer structures for semiconductor die assemblies

Radio-frequency device comprising semiconductor device and waveguid...

Package structures and method for forming the same

Electronics unit with integrated metallic pattern

Manufacturing method of housing for semiconductor device

Semiconductor devices comprising a lid structure and methods of man...

Structure and formation method of chip package with protective lid

Electronic device packages with internal moisture barriers

Power semiconductor module arrangement

Semiconductor device manufacturing method and semiconductor device

Through-hole sealing structure

Patents Applicationslast 30 patents

STIFFENER ASSEMBLY AND METHOD FOR MAKING A SEMICONDUCTOR ASSEMBLY

EMBEDDED SEMICONDUCTOR DEVICE

INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...

PACKAGE STRUCTURE WITH PROTECTIVE LID

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

OPTICAL DEVICE PACKAGE

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

INSERT-MOLDED ARTICLE AND METHOD FOR MANUFACTURING INSERT-MOLDED AR...

PACKAGE STRUCTURE AND MEASUREMENT METHOD FOR THE PACKAGE STRUCTURE

METHOD FOR FORMING SEMICONDUCTOR PACKAGE STRUCTURE

FLOATING HEAT SPREADER WITH GUIDED MECHANISM

PACKAGE STRUCTURE WITH PROTECTIVE LID

PACKAGE ASSEMBLY WITH THERMAL INTERFACE MATERIAL GUTTER

FABRICATION METHOD OF SEMICONDUCTOR PACKAGE

INTEGRATED PASSIVE DEVICES (IPD) HAVING A BASEBAND DAMPING RESISTOR...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICE STRUCTURE WITH BONDING PAD AND METHOD FOR FORM...

POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR ASSEMBLING TH...

WAFER LEVEL PACKAGE AND METHOD OF MANUFACTURING THE SAME

PACKAGE WITH ELECTRICALLY INSULATING AND THERMALLY CONDUCTIVE LAYER...

Integrated Circuit Packages and Methods of Forming the Same

Semiconductor Device and Method for Partial EMI Shielding

PACKAGE STRUCTURE

ELECTRONICS UNIT WITH INTEGRATED METALLIC PATTERN

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

REINFORCED STRUCTURE WITH CAPPING LAYER AND METHODS OF FORMING THE...

PACKAGE STRUCTURE WITH PROTECTIVE LID