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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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H01L21/4817
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Patents Grants
last 30 patents
Information
Patent Grant
Package structure and measurement method for the package structure
Patent number
11,965,731
Issue date
Apr 23, 2024
Taiwan Semiconductor Manufacturing Company Ltd.
Kuei-Sung Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,955,398
Issue date
Apr 9, 2024
Fuji Electric Co., Ltd.
Eri Ogawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated passive device (IPD) components and a package and proces...
Patent number
11,935,879
Issue date
Mar 19, 2024
Wolfspeed, Inc.
Eng Wah Woo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package including sheilding cover that covers molded...
Patent number
11,923,319
Issue date
Mar 5, 2024
Samsung Electronics Co., Ltd.
Young-Woo Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ceramic semiconductor device package with copper tungsten conductiv...
Patent number
11,915,986
Issue date
Feb 27, 2024
Texas Instruments Incorporated
Ramlah Binte Abdul Razak
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power module
Patent number
11,894,292
Issue date
Feb 6, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Qing Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermal transfer structures for semiconductor die assemblies
Patent number
11,862,611
Issue date
Jan 2, 2024
Micron Technology, Inc.
Ed A. Schrock
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Radio-frequency device comprising semiconductor device and waveguid...
Patent number
11,854,917
Issue date
Dec 26, 2023
Infineon Technologies AG
Ernst Seler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structures and method for forming the same
Patent number
11,830,859
Issue date
Nov 28, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chin-Hua Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronics unit with integrated metallic pattern
Patent number
11,817,377
Issue date
Nov 14, 2023
STMicroelectronics (Grenoble 2) SAS
Romain Coffy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method of housing for semiconductor device
Patent number
11,806,903
Issue date
Nov 7, 2023
Mitsubishi Electric Corporation
Hiroyuki Masumoto
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Semiconductor devices comprising a lid structure and methods of man...
Patent number
11,784,101
Issue date
Oct 10, 2023
Amkor Technology Singapore Holding Pte Ltd.
Shaun Bowers
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structure and formation method of chip package with protective lid
Patent number
11,764,118
Issue date
Sep 19, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Wen-Yi Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device packages with internal moisture barriers
Patent number
11,742,302
Issue date
Aug 29, 2023
Wolfspeed, Inc.
Arthur Pun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power semiconductor module arrangement
Patent number
11,699,625
Issue date
Jul 11, 2023
Infineon Technologies AG
Alexander Hoehn
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device manufacturing method and semiconductor device
Patent number
11,640,926
Issue date
May 2, 2023
Fuji Electric Co., Ltd.
Yuji Ichimura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Through-hole sealing structure
Patent number
11,626,334
Issue date
Apr 11, 2023
Tanaka Kikinzoku Kogyo K.K.
Toshinori Ogashiwa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor apparatus and manufacturing method of semiconductor a...
Patent number
11,605,568
Issue date
Mar 14, 2023
Mitsubishi Electric Corporation
Takuya Takahashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged die and assembling method
Patent number
11,597,647
Issue date
Mar 7, 2023
TDK Corporation
Andreas Barbul
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Heterogenous integration for RF, microwave and MM wave systems in p...
Patent number
11,594,457
Issue date
Feb 28, 2023
3D GLASS SOLUTIONS, INC.
Jeb H. Flemming
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Device package with reduced radio frequency losses
Patent number
11,574,879
Issue date
Feb 7, 2023
Infineon Technologies AG
Pedro Augusto Borrego Lambin Torres Amaral
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Semiconductor device and method for manufacturing semiconductor device
Patent number
11,532,590
Issue date
Dec 20, 2022
Mitsubishi Electric Corporation
Hiroyuki Masumoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power semiconductor module having a current sensor module fixed wit...
Patent number
11,502,064
Issue date
Nov 15, 2022
Infineon Technologies AG
Tomas Manuel Reiter
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Waferscale physiological characteristic sensor package with integra...
Patent number
11,490,811
Issue date
Nov 8, 2022
Medtronic MiniMed, Inc.
Daniel Hahn
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Enclosure for an electronic component
Patent number
11,488,880
Issue date
Nov 1, 2022
Intel Corporation
Vijay K. Nair
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of making semiconductor device package including conformal m...
Patent number
11,488,842
Issue date
Nov 1, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Yu Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power semiconductor module arrangement and method for producing the...
Patent number
11,462,446
Issue date
Oct 4, 2022
Infineon Technologies AG
Alexander Hoehn
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor module and method for manufacturing the same
Patent number
11,437,302
Issue date
Sep 6, 2022
Fuji Electric Co., Ltd.
Naoyuki Kanai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Device thermal management
Patent number
11,437,328
Issue date
Sep 6, 2022
QUALCOMM Incorporated
Peng Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronics unit with integrated metallic pattern
Patent number
11,437,306
Issue date
Sep 6, 2022
STMicroelectronics (Grenoble 2) SAS
Romain Coffy
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
WAFER LEVEL PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240128136
Publication date
Apr 18, 2024
Samsung Electro-Mechanics Co., Ltd.
Seung Wook PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE WITH ELECTRICALLY INSULATING AND THERMALLY CONDUCTIVE LAYER...
Publication number
20240105544
Publication date
Mar 28, 2024
INFINEON TECHNOLOGIES AG
Shih Kien LONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated Circuit Packages and Methods of Forming the Same
Publication number
20240071950
Publication date
Feb 29, 2024
Taiwan Semiconductor Manufacturing Co, LTD.
Wen-Yi Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method for Partial EMI Shielding
Publication number
20240063137
Publication date
Feb 22, 2024
STATS ChipPAC Pte Ltd.
JinHee Jung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE
Publication number
20240047441
Publication date
Feb 8, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chin-Hua Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONICS UNIT WITH INTEGRATED METALLIC PATTERN
Publication number
20240038644
Publication date
Feb 1, 2024
STMicroelectronics (Grenoble 2) SAS
Romain COFFY
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240038685
Publication date
Feb 1, 2024
Siliconware Precision Industries Co., Ltd.
Chao-Chiang Pu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
Publication number
20240038606
Publication date
Feb 1, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Shaun Bowers
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240021485
Publication date
Jan 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Kuei-Sung Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20230411229
Publication date
Dec 21, 2023
Fuji Electric Co., Ltd.
Yuko NAKAMATA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
REINFORCED STRUCTURE WITH CAPPING LAYER AND METHODS OF FORMING THE...
Publication number
20230395450
Publication date
Dec 7, 2023
Taiwan Semiconductor Manufacturing Company Limited
Jing-Ye Juang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE WITH PROTECTIVE LID
Publication number
20230369149
Publication date
Nov 16, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Wen-Yi LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIAMOND-METAL COMPOSITE HIGH POWER DEVICE PACKAGES
Publication number
20230352360
Publication date
Nov 2, 2023
MACOM Technology Solutions Holdings, Inc.
Quinn Don Martin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE PACKAGES WITH INTERNAL MOISTURE BARRIERS
Publication number
20230352425
Publication date
Nov 2, 2023
Wolfspeed, Inc.
Arthur Pun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20230335506
Publication date
Oct 19, 2023
Unimicron Technology Corp.
Chin-Sheng Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE
Publication number
20230317534
Publication date
Oct 5, 2023
Sumitomo Electric Industries, Ltd.
Masaki TANIYAMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Publication number
20230299038
Publication date
Sep 21, 2023
Kabushiki Kaisha Toshiba
Tomohiro Iguchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CERAMIC SEMICONDUCTOR DEVICE PACKAGE
Publication number
20230274989
Publication date
Aug 31, 2023
TEXAS INSTRUMENTS INCORPORATED
Ramlah Binte Abdul Razak
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERTER, AND MOVING VEHICLE
Publication number
20230268239
Publication date
Aug 24, 2023
Mitsubishi Electric Corporation
Yoichi HIRONAKA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER SEMICONDUCTOR MODULE, METHOD FOR ASSEMBLING A POWER SEMICONDU...
Publication number
20230170287
Publication date
Jun 1, 2023
INFINEON TECHNOLOGIES AG
Ulrich Nolten
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR...
Publication number
20230154808
Publication date
May 18, 2023
Mitsubishi Electric Corporation
Masaki KURACHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR APPARATUS
Publication number
20230146272
Publication date
May 11, 2023
Fuji Electric Co., Ltd.
Kenichiro SATO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Warpage Compensation for BGA Package
Publication number
20230147273
Publication date
May 11, 2023
Apple Inc.
Brett W. Degner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20230119240
Publication date
Apr 20, 2023
Fuji Electric Co., Ltd.
Katsumi TANIGUCHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20230096381
Publication date
Mar 30, 2023
Fuji Electric Co., Ltd.
Hiroaki ICHIKAWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFERSCALE PHYSIOLOGICAL CHARACTERISTIC SENSOR PACKAGE WITH INTEGRA...
Publication number
20230063689
Publication date
Mar 2, 2023
Medtronic MiniMed, Inc.
Daniel Hahn
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURES AND METHOD FOR FORMING THE SAME
Publication number
20230061269
Publication date
Mar 2, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chin-Hua Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20230063542
Publication date
Mar 2, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Shu-Shen Yeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DAM STRUCTURE ON LID TO CONSTRAIN A THERMAL INTERFACE MATERIAL IN A...
Publication number
20230022643
Publication date
Jan 26, 2023
Taiwan Semiconductor Manufacturing Company Limited
Wei Teng CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREFOR
Publication number
20230008663
Publication date
Jan 12, 2023
FUJI ELECTRIC CO., LTD.
Tadahiko SATO
H01 - BASIC ELECTRIC ELEMENTS