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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00

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H01L2223/6666for decoupling

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Three dimensional metal insulator metal capacitor structure
- Patent number 12,087,811
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sai-Hooi Yeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic multi-I region diode limiters
- Patent number 12,080,708
- Issue date Sep 3, 2024
- MACOM Technology Solutions Holdings, Inc.
- James Joseph Brogle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures with integrated passive component
- Patent number 12,057,383
- Issue date Aug 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor die embedded in package substrate for providing capacitan...
- Patent number 12,046,568
- Issue date Jul 23, 2024
- Intel Corporation
- Andrew Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer
- Patent number 11,973,013
- Issue date Apr 30, 2024
- AMOSENSE CO., LTD.
- Changwoo Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with rotated semiconductor die
- Patent number 11,830,820
- Issue date Nov 28, 2023
- Mediatek Inc.
- Yao-Chun Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor die embedded in package substrate for providing capacitan...
- Patent number 11,728,294
- Issue date Aug 15, 2023
- Intel Corporation
- Andrew Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-board power control arrangements for integrated circuit dev...
- Patent number 11,710,726
- Issue date Jul 25, 2023
- Microsoft Technology Licensing, LLC
- William Paul Hovis
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Monolithic multi-I region diode limiters
- Patent number 11,705,448
- Issue date Jul 18, 2023
- MACOM Technology Solutions Holdings, Inc.
- James Joseph Brogle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures with integrated passive component
- Patent number 11,626,363
- Issue date Apr 11, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with an integral filtering component
- Patent number 11,574,880
- Issue date Feb 7, 2023
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional metal insulator metal capacitor structure
- Patent number 11,450,733
- Issue date Sep 20, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sai-Hooi Yeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-chip power supply noise suppression through hyperabrupt junction...
- Patent number 11,444,210
- Issue date Sep 13, 2022
- Drexel University
- Divya Pathak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Channel loss compensation circuits
- Patent number 11,316,548
- Issue date Apr 26, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Lan-Chou Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed semiconductor chip stack
- Patent number 11,257,762
- Issue date Feb 22, 2022
- L. Pierre de Rochemont
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mitigating thermal-mechanical strain and warpage of an organic lami...
- Patent number 11,239,183
- Issue date Feb 1, 2022
- International Business Machines Corporation
- Tuhin Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with rotated semiconductor die
- Patent number 11,222,850
- Issue date Jan 11, 2022
- Mediatek Inc.
- Yao-Chun Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor die embedded in package substrate for providing capacitan...
- Patent number 11,195,805
- Issue date Dec 7, 2021
- Intel Corporation
- Andrew Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 11,133,750
- Issue date Sep 28, 2021
- Delta Electronics (Shanghai) Co., Ltd.
- Jinping Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic multi-I region diode limiters
- Patent number 11,127,737
- Issue date Sep 21, 2021
- MACOM Technology Solutions Holdings, Inc.
- James Joseph Brogle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
And placement of de-coupling capacitors for PDN design
- Patent number 11,024,590
- Issue date Jun 1, 2021
- Seagate Technology LLC
- Abhishek Nagaraj Laguvaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked capacitors for use in integrated circuit modules and the like
- Patent number 11,004,614
- Issue date May 11, 2021
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical electrode decoupling/bypass capacitor
- Patent number 11,004,603
- Issue date May 11, 2021
- AVX Corporation
- Jeffrey A. Horn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit system having compact decoupling structure
- Patent number 10,978,413
- Issue date Apr 13, 2021
- AP MEMORY TECHNOLOGY CORP.
- Masaru Haraguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Orthogonal transistor layouts
- Patent number 10,950,635
- Issue date Mar 16, 2021
- Skyworks Solutions, Inc.
- Tzung-Yin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-low profile package shielding technique using magnetic and co...
- Patent number 10,950,555
- Issue date Mar 16, 2021
- Intel Corporation
- Kaladhar Radhakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with in-package compartmental shielding and f...
- Patent number 10,847,480
- Issue date Nov 24, 2020
- Chung-Che Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of manufacturing the same
- Patent number 10,833,029
- Issue date Nov 10, 2020
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,818,604
- Issue date Oct 27, 2020
- Samsung Electronics Co., Ltd.
- Myung Sam Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power radio frequency amplifiers and methods of manufacture th...
- Patent number 10,784,821
- Issue date Sep 22, 2020
- NXP USA, INC.
- Ning Zhu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THREE DIMENSIONAL METAL INSULATOR METAL CAPACITOR STRUCTURE
- Publication number 20240363681
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sai-Hooi YEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE, POWER CONVERSION DEVICE, AND VEHICLE
- Publication number 20240321761
- Publication date Sep 26, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Hao PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR DIE EMBEDDED IN PACKAGE SUBSTRATE FOR PROVIDING CAPACITAN...
- Publication number 20240321785
- Publication date Sep 26, 2024
- Intel Corporation
- Andrew COLLINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip-On-Wafer Assembly Containing A Decoupling Capacitor
- Publication number 20240145451
- Publication date May 2, 2024
- KYOCERA AVX Components Corporation
- Laurent Desclos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH ROTATED SEMICONDUCTOR DIE
- Publication number 20240055358
- Publication date Feb 15, 2024
- MEDIATEK INC.
- Yao-Chun Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI CHIP FRONT END MODULE WITH SHIELDING VIAS
- Publication number 20230378103
- Publication date Nov 23, 2023
- Skyworks Solutions, Inc.
- Abdulhadi Ebrahim Abdulhadi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH CAPACITOR (DTC) REGION IN SEMICONDUCTOR PACKAGE
- Publication number 20230307389
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fu-Chiang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL METAL INSULATOR METAL CAPACITOR STRUCTURE
- Publication number 20220367608
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sai-Hooi Yeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH ROTATED SEMICONDUCTOR DIE
- Publication number 20220108954
- Publication date Apr 7, 2022
- MEDIATEK INC.
- Yao-Chun Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER
- Publication number 20220005757
- Publication date Jan 6, 2022
- AMOSENSE CO., LTD.
- Changwoo OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MITIGATING THERMAL-MECHANICAL STRAIN AND WARPAGE OF AN ORGANIC LAMI...
- Publication number 20210242139
- Publication date Aug 5, 2021
- International Business Machines Corporation
- Tuhin Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROWAVE DEVICE AND ANTENNA
- Publication number 20210233865
- Publication date Jul 29, 2021
- Mitsubishi Electric Corporation
- Yukinobu TARUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH AN INTEGRAL FILTERING COMPONENT
- Publication number 20210020590
- Publication date Jan 21, 2021
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL METAL INSULATOR METAL CAPACITOR STRUCTURE
- Publication number 20210020739
- Publication date Jan 21, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sai-Hooi Yeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-BOARD POWER CONTROL ARRANGEMENTS FOR INTEGRATED CIRCUIT DEV...
- Publication number 20200411494
- Publication date Dec 31, 2020
- Microsoft Technology Licensing, LLC
- William Paul Hovis
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THROUGH-BOARD DECOUPLING CAPACITANCE ARRANGEMENTS FOR INTEGRATED CI...
- Publication number 20200411495
- Publication date Dec 31, 2020
- Microsoft Technology Licensing, LLC
- William Paul Hovis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DECOUPLING CAPACITANCE ARRANGEMENTS FOR INTEGRATED CIRCUIT DEVICES
- Publication number 20200373260
- Publication date Nov 26, 2020
- Microsoft Technology Licensing, LLC
- William Paul Hovis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH ROTATED SEMICONDUCTOR DIE
- Publication number 20200365515
- Publication date Nov 19, 2020
- MEDIATEK INC.
- Yao-Chun Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200303314
- Publication date Sep 24, 2020
- Samsung Electronics Co., Ltd.
- Myung Sam KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHANNEL LOSS COMPENSATION CIRCUITS
- Publication number 20200274566
- Publication date Aug 27, 2020
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Lan-Chou CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHIC MULTI-I REGION DIODE LIMITERS
- Publication number 20200258883
- Publication date Aug 13, 2020
- MACOM Technology Solutions Holdings, Inc.
- James Joseph Brogle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH CUTOFF FREQUENCY METAL-INSULATOR-METAL CAPACITORS IMPLEMENTED...
- Publication number 20200211955
- Publication date Jul 2, 2020
- International Business Machines Corporation
- Joshua M. Rubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH POWER RADIO FREQUENCY AMPLIFIERS AND METHODS OF MANUFACTURE TH...
- Publication number 20200204121
- Publication date Jun 25, 2020
- NXP USA, Inc.
- Ning ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH POWER RADIO FREQUENCY AMPLIFIERS AND METHODS OF MANUFACTURE TH...
- Publication number 20200204122
- Publication date Jun 25, 2020
- NXP USA, Inc.
- Ning ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200176403
- Publication date Jun 4, 2020
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH IN-PACKAGE COMPARTMENTAL SHIELDING AND F...
- Publication number 20200168566
- Publication date May 28, 2020
- Chung-Che Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SYSTEM HAVING COMPACT DECOUPLING STRUCTURE
- Publication number 20200105688
- Publication date Apr 2, 2020
- AP Memory Technology Corp.
- Masaru HARAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON-CHIP POWER SUPPLY NOISE SUPPRESSION THROUGH HYPERABRUPT JUNCTION...
- Publication number 20190393360
- Publication date Dec 26, 2019
- Drexel University
- Divya Pathak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-LOW PROFILE PACKAGE SHIELDING TECHNIQUE USING MAGNETIC AND CO...
- Publication number 20190393165
- Publication date Dec 26, 2019
- Intel Corporation
- Kaladhar RADHAKRISHNAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR DIE EMBEDDED IN PACKAGE SUBSTRATE FOR PROVIDING CAPACITAN...
- Publication number 20190304935
- Publication date Oct 3, 2019
- Intel Corporation
- Andrew COLLINS
- H01 - BASIC ELECTRIC ELEMENTS

for decoupling

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Three dimensional metal insulator metal capacitor structure

Monolithic multi-I region diode limiters

Bonded structures with integrated passive component

Capacitor die embedded in package substrate for providing capacitan...

Interposer

Electronic package with rotated semiconductor die

Capacitor die embedded in package substrate for providing capacitan...

Through-board power control arrangements for integrated circuit dev...

Monolithic multi-I region diode limiters

Bonded structures with integrated passive component

Electronic device with an integral filtering component

Three dimensional metal insulator metal capacitor structure

On-chip power supply noise suppression through hyperabrupt junction...

Channel loss compensation circuits

High speed semiconductor chip stack

Mitigating thermal-mechanical strain and warpage of an organic lami...

Electronic package with rotated semiconductor die

Capacitor die embedded in package substrate for providing capacitan...

Power module

Monolithic multi-I region diode limiters

And placement of de-coupling capacitors for PDN design

Stacked capacitors for use in integrated circuit modules and the like

Vertical electrode decoupling/bypass capacitor

Circuit system having compact decoupling structure

Orthogonal transistor layouts

Ultra-low profile package shielding technique using magnetic and co...

Semiconductor package with in-package compartmental shielding and f...

Electronic device and method of manufacturing the same

Semiconductor package

High power radio frequency amplifiers and methods of manufacture th...

Patents Applicationslast 30 patents

THREE DIMENSIONAL METAL INSULATOR METAL CAPACITOR STRUCTURE

POWER MODULE, POWER CONVERSION DEVICE, AND VEHICLE

CAPACITOR DIE EMBEDDED IN PACKAGE SUBSTRATE FOR PROVIDING CAPACITAN...

Chip-On-Wafer Assembly Containing A Decoupling Capacitor

ELECTRONIC PACKAGE WITH ROTATED SEMICONDUCTOR DIE

MULTI CHIP FRONT END MODULE WITH SHIELDING VIAS

DEEP TRENCH CAPACITOR (DTC) REGION IN SEMICONDUCTOR PACKAGE

THREE DIMENSIONAL METAL INSULATOR METAL CAPACITOR STRUCTURE

ELECTRONIC PACKAGE WITH ROTATED SEMICONDUCTOR DIE

INTERPOSER

MITIGATING THERMAL-MECHANICAL STRAIN AND WARPAGE OF AN ORGANIC LAMI...

MICROWAVE DEVICE AND ANTENNA

ELECTRONIC DEVICE WITH AN INTEGRAL FILTERING COMPONENT

THREE DIMENSIONAL METAL INSULATOR METAL CAPACITOR STRUCTURE

THROUGH-BOARD POWER CONTROL ARRANGEMENTS FOR INTEGRATED CIRCUIT DEV...

THROUGH-BOARD DECOUPLING CAPACITANCE ARRANGEMENTS FOR INTEGRATED CI...

DECOUPLING CAPACITANCE ARRANGEMENTS FOR INTEGRATED CIRCUIT DEVICES

ELECTRONIC PACKAGE WITH ROTATED SEMICONDUCTOR DIE

SEMICONDUCTOR PACKAGE

CHANNEL LOSS COMPENSATION CIRCUITS

MONOLITHIC MULTI-I REGION DIODE LIMITERS

HIGH CUTOFF FREQUENCY METAL-INSULATOR-METAL CAPACITORS IMPLEMENTED...

HIGH POWER RADIO FREQUENCY AMPLIFIERS AND METHODS OF MANUFACTURE TH...

HIGH POWER RADIO FREQUENCY AMPLIFIERS AND METHODS OF MANUFACTURE TH...

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE WITH IN-PACKAGE COMPARTMENTAL SHIELDING AND F...

CIRCUIT SYSTEM HAVING COMPACT DECOUPLING STRUCTURE

ON-CHIP POWER SUPPLY NOISE SUPPRESSION THROUGH HYPERABRUPT JUNCTION...

ULTRA-LOW PROFILE PACKAGE SHIELDING TECHNIQUE USING MAGNETIC AND CO...

CAPACITOR DIE EMBEDDED IN PACKAGE SUBSTRATE FOR PROVIDING CAPACITAN...