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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49562for devices being provided for in H01L29/00

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Systems and methods for power module for inverter for electric vehicle
- Patent number 12,368,391
- Issue date Jul 22, 2025
- BorgWarner US Technologies LLC
- David Paul Buehler
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Sandwich structure power supply module
- Patent number 12,356,550
- Issue date Jul 8, 2025
- Monolithic Power Systems, Inc.
- Daocheng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,354,981
- Issue date Jul 8, 2025
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 12,354,934
- Issue date Jul 8, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Siang Miang Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Replacement buried power rail in backside power delivery
- Patent number 12,354,991
- Issue date Jul 8, 2025
- Tokyo Electron Limited
- Hoyoung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacture
- Patent number 12,347,751
- Issue date Jul 1, 2025
- Nexperia B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,347,756
- Issue date Jul 1, 2025
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,347,752
- Issue date Jul 1, 2025
- Rohm Co., Ltd.
- Yoshikatsu Miura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with load terminals on which coupled power component and lo...
- Patent number 12,347,754
- Issue date Jul 1, 2025
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for power module for inverter for electric vehicle
- Patent number 12,348,157
- Issue date Jul 1, 2025
- BorgWarner US Technologies LLC
- David Paul Buehler
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems and methods for multiple output integrated gate driver for...
- Patent number 12,341,454
- Issue date Jun 24, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems and methods for galvanic isolation for inverter for electri...
- Patent number 12,328,083
- Issue date Jun 10, 2025
- BorgWarner US Technologies LLC
- Srikanth Vijaykumar
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems and methods for data recorder for inverter for electric veh...
- Patent number 12,323,080
- Issue date Jun 3, 2025
- BorgWarner US Technologies LLC
- Marc R. Engelhardt
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor device package assemblies with direct leadframe attac...
- Patent number 12,315,826
- Issue date May 27, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for an interlocking feature on a power module
- Patent number 12,316,257
- Issue date May 27, 2025
- BorgWarner US Technologies LLC
- Edward Choi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor device having wire pieces in bonding member
- Patent number 12,315,825
- Issue date May 27, 2025
- Denso Corporation
- Daisuke Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Side-solderable leadless package
- Patent number 12,293,960
- Issue date May 6, 2025
- Semtech Corporation
- Henry Descalzo Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacture for a cascode semiconductor device
- Patent number 12,293,961
- Issue date May 6, 2025
- Nexperia B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of fabricating the same
- Patent number 12,288,738
- Issue date Apr 29, 2025
- Samsung Electronics Co., Ltd.
- Younghwan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,288,739
- Issue date Apr 29, 2025
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded semiconductor package having an embedded inlay
- Patent number 12,283,538
- Issue date Apr 22, 2025
- Infineon Technologies AG
- Marcus Boehm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for cooling system and power module for inverte...
- Patent number 12,284,791
- Issue date Apr 22, 2025
- BorgWarner US Technologies LLC
- Bryan Rohl
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems and methods for parameter drift correction for inverter for...
- Patent number 12,279,402
- Issue date Apr 15, 2025
- BorgWarner US Technologies LLC
- Seyed R. Zarabadi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Leadframe spacer for double-sided power module
- Patent number 12,278,158
- Issue date Apr 15, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Tzu-Hsuan Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising a drain back contact electrode, met...
- Patent number 12,272,743
- Issue date Apr 8, 2025
- GPOWER SEMICONDUCTOR, INC.
- Junfeng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,272,627
- Issue date Apr 8, 2025
- Kabushiki Kaisha Toshiba
- Hiroshi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having wettable lead flanks and tie bars and...
- Patent number 12,261,101
- Issue date Mar 25, 2025
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for cooling system and power module for inverte...
- Patent number 12,261,558
- Issue date Mar 25, 2025
- BorgWarner US Technologies LLC
- Bryan Rohl
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,255,127
- Issue date Mar 18, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hidekazu Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intelligent power module containing exposed surfaces of transistor...
- Patent number 12,249,562
- Issue date Mar 11, 2025
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250233056
- Publication date Jul 17, 2025
- Mitsubishi Electric Corporation
- Hongbo ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINING STRUCTURE AND SEMICONDUCTOR DEVICE
- Publication number 20250233057
- Publication date Jul 17, 2025
- ROHM CO., LTD.
- Oji SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250226296
- Publication date Jul 10, 2025
- ROHM CO., LTD.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR COOLING SYSTEM AND POWER MODULE FOR INVERTE...
- Publication number 20250219554
- Publication date Jul 3, 2025
- BorgWarner US Technologies LLC
- Bryan Rohl
- B60 - VEHICLES IN GENERAL
Information Patent Application
PACKAGE WITH COMPONENT-CARRYING INTERMEDIATE STRUCTURE AND ADDITION...
- Publication number 20250218914
- Publication date Jul 3, 2025
- INFINEON TECHNOLOGIES AG
- Hao ZHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250210476
- Publication date Jun 26, 2025
- FUJI ELECTRIC CO., LTD.
- Koji OSAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250201676
- Publication date Jun 19, 2025
- INFINEON TECHNOLOGIES AG
- Achim Althaus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING USING A FLOATING PAD
- Publication number 20250201681
- Publication date Jun 19, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Hiroshi INOGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250201678
- Publication date Jun 19, 2025
- RENESAS ELECTRONICS CORPORATION
- Yasutaka NAKASHIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE MOUNT PACKAGE HAVING AN INTERNAL REDUNDANT ELECTRICAL CONNE...
- Publication number 20250201682
- Publication date Jun 19, 2025
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250201679
- Publication date Jun 19, 2025
- DENSO CORPORATION
- Mitsuki KAWANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRIVING DEVICE
- Publication number 20250192009
- Publication date Jun 12, 2025
- ACTRON TECHNOLOGY CORPORATION
- PEN-HUNG HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250192006
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Jungmin Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND METHOD FOR PRODUCING THE SAME
- Publication number 20250191916
- Publication date Jun 12, 2025
- Mitsubishi Electric Corporation
- Kazuhiro NISHIMURA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250192007
- Publication date Jun 12, 2025
- ROHM CO., LTD.
- Kenichi YOSHIMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Package
- Publication number 20250183105
- Publication date Jun 5, 2025
- Wolfspeed, Inc.
- Geza Dezsi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING WETTABLE LEAD FLANKS AND TIE BARS AND...
- Publication number 20250183132
- Publication date Jun 5, 2025
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250183126
- Publication date Jun 5, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- Hidekazu NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A LEADFRAME WITH A METAL-PLATED BOND AREA
- Publication number 20250183221
- Publication date Jun 5, 2025
- Infineon Technologies Austria AG
- Yi Ting Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250174527
- Publication date May 29, 2025
- ROHM CO., LTD.
- Ryuta YAGINUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH RECESSED TERMINALS
- Publication number 20250167082
- Publication date May 22, 2025
- Navitas Semiconductor Limited
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REVERSIBLE POWER MODULE AND A PROCESS OF IMPLEMENTING A REVERSIBLE...
- Publication number 20250167081
- Publication date May 22, 2025
- Wolfspeed, Inc.
- Ajit R. Kanale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCRETE SEMICONDUCTOR DEVICE PACKAGE WITH LEAD FRAME CLIP
- Publication number 20250157893
- Publication date May 15, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jie CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20250157896
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Sangjine PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20250149402
- Publication date May 8, 2025
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Ting-An Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149424
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149425
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20250142852
- Publication date May 1, 2025
- Mitsubishi Electric Corporation
- Reona FURUKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250140660
- Publication date May 1, 2025
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING SAME
- Publication number 20250140657
- Publication date May 1, 2025
- IDEAL SEMICONDUCTOR DEVICES, INC.
- Ryan Thorpe
- H01 - BASIC ELECTRIC ELEMENTS

for devices being provided for in H01L29/00

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Systems and methods for power module for inverter for electric vehicle

Sandwich structure power supply module

Semiconductor device and method for manufacturing the same

Method of manufacturing a semiconductor device

Replacement buried power rail in backside power delivery

Semiconductor device and a method of manufacture

Semiconductor device

Semiconductor device

Package with load terminals on which coupled power component and lo...

Systems and methods for power module for inverter for electric vehicle

Systems and methods for multiple output integrated gate driver for...

Systems and methods for galvanic isolation for inverter for electri...

Systems and methods for data recorder for inverter for electric veh...

Semiconductor device package assemblies with direct leadframe attac...

Systems and methods for an interlocking feature on a power module

Semiconductor device having wire pieces in bonding member

Side-solderable leadless package

Method of manufacture for a cascode semiconductor device

Semiconductor device package and method of fabricating the same

Semiconductor device and method for manufacturing the same

Molded semiconductor package having an embedded inlay

Systems and methods for cooling system and power module for inverte...

Systems and methods for parameter drift correction for inverter for...

Leadframe spacer for double-sided power module

Semiconductor device comprising a drain back contact electrode, met...

Semiconductor device

Semiconductor package having wettable lead flanks and tie bars and...

Systems and methods for cooling system and power module for inverte...

Semiconductor device and method for manufacturing the same

Intelligent power module containing exposed surfaces of transistor...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

JOINING STRUCTURE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SYSTEMS AND METHODS FOR COOLING SYSTEM AND POWER MODULE FOR INVERTE...

PACKAGE WITH COMPONENT-CARRYING INTERMEDIATE STRUCTURE AND ADDITION...

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

WIRE BONDING USING A FLOATING PAD

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SURFACE MOUNT PACKAGE HAVING AN INTERNAL REDUNDANT ELECTRICAL CONNE...

SEMICONDUCTOR DEVICE

DRIVING DEVICE

INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR APPARATUS AND METHOD FOR PRODUCING THE SAME

SEMICONDUCTOR DEVICE

Power Semiconductor Package

SEMICONDUCTOR PACKAGE HAVING WETTABLE LEAD FLANKS AND TIE BARS AND...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE HAVING A LEADFRAME WITH A METAL-PLATED BOND AREA

SEMICONDUCTOR DEVICE

ELECTRONIC PACKAGE WITH RECESSED TERMINALS

REVERSIBLE POWER MODULE AND A PROCESS OF IMPLEMENTING A REVERSIBLE...

DISCRETE SEMICONDUCTOR DEVICE PACKAGE WITH LEAD FRAME CLIP

INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

SEMICONDUCTOR APPARATUS

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING SAME