for double side lapping

Industry

CPC
B24B37/08

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B24Grinding technology B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS B24B37/00Lapping machines or devices Accessories

Current Industry

B24B37/08for double side lapping

Industries

Patents Grantslast 30 patents

Information Patent Grant
Automated semiconductor substrate polishing and cleaning
- Patent number 12,154,810
- Issue date Nov 26, 2024
- GlobalWafers Co., Ltd.
- ShinBae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical member, method of producing optical member, and apparatus f...
- Patent number 11,988,807
- Issue date May 21, 2024
- MITSUI CHEMICALS, INC.
- Soichiro Ahiko
- B24 - GRINDING POLISHING
Information Patent Grant
Glass article and method of producing glass article
- Patent number 11,969,857
- Issue date Apr 30, 2024
- AGC Inc.
- Toru Momose
- B24 - GRINDING POLISHING
Information Patent Grant
Control method of grinding water flow rate during double side grind...
- Patent number 11,938,588
- Issue date Mar 26, 2024
- Zhonghuan Advanced Semiconductor Technology Co., Ltd.
- Chien-Ming Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Double-sided polishing apparatus
- Patent number 11,883,924
- Issue date Jan 30, 2024
- Fujikoshi Machinery Corp.
- Masashi Maruta
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and method for double-side polishing work
- Patent number 11,826,870
- Issue date Nov 28, 2023
- Sumco Corporation
- Mami Kubota
- B24 - GRINDING POLISHING
Information Patent Grant
Workpiece processing apparatus including a resin coater and a resin...
- Patent number 11,819,975
- Issue date Nov 21, 2023
- Disco Corporation
- Shinya Watanabe
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Apparatus and method for double-side polishing work
- Patent number 11,717,931
- Issue date Aug 8, 2023
- Sumco Corporation
- Mami Kubota
- B24 - GRINDING POLISHING
Information Patent Grant
Method of double-side polishing wafer
- Patent number 11,648,640
- Issue date May 16, 2023
- Sumco Corporation
- Yuji Miyazaki
- B24 - GRINDING POLISHING
Information Patent Grant
Method for polishing silicon substrate and polishing composition set
- Patent number 11,648,641
- Issue date May 16, 2023
- FUJIMI INCORPORATED
- Makoto Tabata
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Workpiece processing and resin grinding apparatus
- Patent number 11,574,804
- Issue date Feb 7, 2023
- Disco Corporation
- Shinya Watanabe
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Method of polishing silicon wafer including notch polishing process...
- Patent number 11,551,922
- Issue date Jan 10, 2023
- Sumco Corporation
- Tsuyoshi Morita
- B24 - GRINDING POLISHING
Information Patent Grant
Carrier for double-side polishing apparatus, double-side polishing...
- Patent number 11,453,098
- Issue date Sep 27, 2022
- Shin-Etsu Handotai Co., Ltd.
- Yuki Tanaka
- B24 - GRINDING POLISHING
Information Patent Grant
Method of lapping semiconductor wafer and semiconductor wafer
- Patent number 11,456,168
- Issue date Sep 27, 2022
- Sumco Corporation
- Daisuke Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-surface polishing device and dual-surface polishing method
- Patent number 11,440,157
- Issue date Sep 13, 2022
- Sumco Corporation
- Keisuke Esaki
- B24 - GRINDING POLISHING
Information Patent Grant
Double-side polishing method and double-side polishing apparatus
- Patent number 11,325,220
- Issue date May 10, 2022
- Shin-Etsu Handotai Co., Ltd.
- Yuki Tanaka
- B24 - GRINDING POLISHING
Information Patent Grant
Method for double-side polishing wafer
- Patent number 11,298,796
- Issue date Apr 12, 2022
- Shin-Etsu Handotai Co., Ltd.
- Yuki Tanaka
- B24 - GRINDING POLISHING
Information Patent Grant
Double disc surface grinding machine and grinding method
- Patent number 11,278,998
- Issue date Mar 22, 2022
- NISSEI INDUSTRY CORPORATION
- Sajio Osaki
- B24 - GRINDING POLISHING
Information Patent Grant
Indium phosphide wafer having pits on the back side, method and etc...
- Patent number 11,094,549
- Issue date Aug 17, 2021
- Beijing Tongmei Xtal Technology Co., Ltd.
- Liugang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of carrier for double-side polishing apparatus...
- Patent number 11,065,735
- Issue date Jul 20, 2021
- Shin-Etsu Handotai Co., Ltd.
- Daichi Kitazume
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier ring, grinding device, and grinding method
- Patent number 11,052,506
- Issue date Jul 6, 2021
- Sumco Corporation
- Yoshinobu Nishimura
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer surface beveling method, method of manufacturing wafer, and w...
- Patent number 10,971,351
- Issue date Apr 6, 2021
- Sumco Corporation
- Kenji Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer polishing chamber and wafer polishing system including same
- Patent number 10,784,112
- Issue date Sep 22, 2020
- SK SILTRON CO., LTD.
- Sang Ho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for conditioning polishing pad and polishing apparatus
- Patent number 10,730,161
- Issue date Aug 4, 2020
- Shin-Etsu Handotai Co., Ltd.
- Taichi Yasuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer, and method for polishing semiconductor wafer
- Patent number 10,679,842
- Issue date Jun 9, 2020
- JX Nippon Mining & Metals Corporation
- Taku Yoshida
- B24 - GRINDING POLISHING
Information Patent Grant
Indium phosphide substrate, method of inspecting indium phosphide s...
- Patent number 10,663,277
- Issue date May 26, 2020
- Sumitomo Electric Industries, Ltd.
- Shinya Fujiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic-disk glass substrate, magnetic disk and method for manufac...
- Patent number 10,580,448
- Issue date Mar 3, 2020
- Hoya Corporation
- Masaaki Ueda
- B24 - GRINDING POLISHING
Information Patent Grant
Indium phosphide substrate, method of inspecting indium phosphide s...
- Patent number 10,473,445
- Issue date Nov 12, 2019
- Sumitomo Electric Industries, Ltd.
- Shinya Fujiwara
- B24 - GRINDING POLISHING
Information Patent Grant
Workpiece processing apparatus and workpiece processing method
- Patent number 10,434,621
- Issue date Oct 8, 2019
- Shin-Etsu Handotai Co., Ltd.
- Taichi Yasuda
- B24 - GRINDING POLISHING
Information Patent Grant
Indium phosphide substrate, method of inspecting indium phosphide s...
- Patent number 10,436,566
- Issue date Oct 8, 2019
- Sumitomo Electric Industries, Ltd.
- Shinya Fujiwara
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR GRINDING SEMICONDUCTOR WAFERS
- Publication number 20240379342
- Publication date Nov 14, 2024
- Siltronic AG
- Stephan OBERHANS
- B24 - GRINDING POLISHING
Information Patent Application
SIMPLIFIED CARRIER REMOVABLE BY REDUCED NUMBER OF CMP PROCESSES
- Publication number 20240375236
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Wei Chang
- B24 - GRINDING POLISHING
Information Patent Application
Process for Polishing and Grinding Copper Foil Surface for Reducing...
- Publication number 20240316718
- Publication date Sep 26, 2024
- Taichi Metal Material Technology Co., Ltd.
- Kuan-Wei Chen
- B24 - GRINDING POLISHING
Information Patent Application
DOUBLE-SIDE POLISHING METHOD FOR WORK AND DOUBLE-SIDE POLISHING APP...
- Publication number 20240278379
- Publication date Aug 22, 2024
- SUMCO CORPORATION
- Ryo KURAMOTO
- B24 - GRINDING POLISHING
Information Patent Application
DOUBLE-SIDE POLISHING APPARATUS AND DOUBLE-SIDE POLISHING METHOD FO...
- Publication number 20240261929
- Publication date Aug 8, 2024
- SUMCO CORPORATION
- Yuji MIYAZAKI
- B24 - GRINDING POLISHING
Information Patent Application
GLASS ARTICLE AND METHOD OF PRODUCING GLASS ARTICLE
- Publication number 20240227117
- Publication date Jul 11, 2024
- AGC Inc.
- Toru MOMOSE
- B24 - GRINDING POLISHING
Information Patent Application
DOUBLE SIDE GRINDING APPARATUS HAVING CONVEX POLYGON-SHAPED ABRASIV...
- Publication number 20240217053
- Publication date Jul 4, 2024
- GLOBALWAFERS CO., LTD.
- Minkyu Lee
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR PROCESSING A WAFER AND WAFER
- Publication number 20240139902
- Publication date May 2, 2024
- Shin-Etsu Handotai Co., Ltd.
- Yasuki YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED POLISHING METHOD FOR OPTICAL LENS
- Publication number 20240123567
- Publication date Apr 18, 2024
- DALIAN UNIVERSITY OF TECHNOLOGY
- Jiang GUO
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD, DOUBLE-SIDE POLISHING DEVICE, AND DOUBLE-SIDE POLISH...
- Publication number 20240009799
- Publication date Jan 11, 2024
- Shin-Etsu Handotai Co., Ltd.
- Junichi UENO
- B24 - GRINDING POLISHING
Information Patent Application
Double-Sided Polishing Apparatus
- Publication number 20230415298
- Publication date Dec 28, 2023
- Fujikoshi Machinery Corp.
- Masashi MARUTA
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF DOUBLE-SIDE POLISHING WORK, METHOD OF PRODUCING WORK, AND...
- Publication number 20230201993
- Publication date Jun 29, 2023
- SUMCO CORPORATION
- Kazushige TAKAISHI
- B24 - GRINDING POLISHING
Information Patent Application
APPARATUS FOR DOUBLE-SIDE POLISHING WORK
- Publication number 20230106784
- Publication date Apr 6, 2023
- SUMCO CORPORATION
- Yuji MIYAZAKI
- B24 - GRINDING POLISHING
Information Patent Application
GLASS ARTICLE AND METHOD OF PRODUCING GLASS ARTICLE
- Publication number 20230051824
- Publication date Feb 16, 2023
- AGC Inc.
- Toru MOMOSE
- B24 - GRINDING POLISHING
Information Patent Application
Simplified Carrier Removable by Reduced Number of CMP Processes
- Publication number 20220395953
- Publication date Dec 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Wei Chang
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR OPERATING A DOUBLE-SIDED PROCESSING MACHINE AND DOUBLE-S...
- Publication number 20220371154
- Publication date Nov 24, 2022
- Lapmaster Wolters GmbH
- Robert Ravlic
- B24 - GRINDING POLISHING
Information Patent Application
DOUBLE-SIDE OR ONE-SIDE MACHINE TOOL
- Publication number 20220258300
- Publication date Aug 18, 2022
- Lapmaster Wolters GmbH
- Hans-Peter Boller
- B24 - GRINDING POLISHING
Information Patent Application
INSTALLATION AND METHOD FOR POLISHING SEMICONDUCTOR WAFERS
- Publication number 20220258303
- Publication date Aug 18, 2022
- Siltronic AG
- Jonny FRANKE
- B24 - GRINDING POLISHING
Information Patent Application
METHOD AND APPARATUS FOR DOUBLE-SIDE POLISHING WORK
- Publication number 20220184772
- Publication date Jun 16, 2022
- SUMCO CORPORATION
- Yuji MIYAZAKI
- B24 - GRINDING POLISHING
Information Patent Application
DOUBLE-SIDE POLISHING METHOD
- Publication number 20220168865
- Publication date Jun 2, 2022
- Shin-Etsu Handotai Co., Ltd.
- Yuki TANAKA
- B24 - GRINDING POLISHING
Information Patent Application
OPTICAL MEMBER, METHOD OF PRODUCING OPTICAL MEMBER, AND APPARATUS F...
- Publication number 20220120935
- Publication date Apr 21, 2022
- Mitsui Chemicals, Inc.
- Soichiro AHIKO
- B24 - GRINDING POLISHING
Information Patent Application
WATER-BASED GRINDING MACHINE FOR POLISHING SURFACE OF A METAL STRIP
- Publication number 20210331225
- Publication date Oct 28, 2021
- Kun Shan Futianda Metal Technology Co.,Ltd.
- Xing ZHANG
- B24 - GRINDING POLISHING
Information Patent Application
AN APPARATUS FOR WORKING OPPOSITE ARRANGED SURFACES
- Publication number 20210316373
- Publication date Oct 14, 2021
- LS FLEXO APS
- Lars Schantz SIMONSEN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DOUBLE-SIDED POLISHING OR SANDING MEMBER FOR ATTACHMENT TO A HAND-G...
- Publication number 20210308824
- Publication date Oct 7, 2021
- Guido Valentini
- B24 - GRINDING POLISHING
Information Patent Application
Control Method of Grinding Water Flow Rate During Double Side Grind...
- Publication number 20210276150
- Publication date Sep 9, 2021
- Xuzhou Xinjing Semiconductor Technology Co., Ltd.
- Chien-Ming CHEN
- B24 - GRINDING POLISHING
Information Patent Application
APPARATUS AND METHOD FOR DOUBLE-SIDE POLISHING WORK
- Publication number 20210245321
- Publication date Aug 12, 2021
- SUMCO CORPORATION
- Mami KUBOTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROTOR DISK AND DOUBLE-SIDED PROCESSING MACHINE FOR PROCESSING AT LE...
- Publication number 20210220963
- Publication date Jul 22, 2021
- Lapmaster Wolters GmbH
- Helge Möller
- B24 - GRINDING POLISHING
Information Patent Application
APPARATUS AND METHOD FOR DOUBLE-SIDE POLISHING WORKPIECE
- Publication number 20210205949
- Publication date Jul 8, 2021
- SUMCO CORPORATION
- Mami KUBOTA
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF DOUBLE-SIDE POLISHING WAFER
- Publication number 20200353585
- Publication date Nov 12, 2020
- SUMCO CORPORATION
- Yuji MIYAZAKI
- B24 - GRINDING POLISHING
Information Patent Application
APPARATUS AND METHOD FOR DOUBLE-SIDE POLISHING WORK
- Publication number 20200346319
- Publication date Nov 5, 2020
- SUMCO CORPORATION
- Mami KUBOTA
- B24 - GRINDING POLISHING

for double side lapping

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Automated semiconductor substrate polishing and cleaning

Optical member, method of producing optical member, and apparatus f...

Glass article and method of producing glass article

Control method of grinding water flow rate during double side grind...

Double-sided polishing apparatus

Apparatus and method for double-side polishing work

Workpiece processing apparatus including a resin coater and a resin...

Apparatus and method for double-side polishing work

Method of double-side polishing wafer

Method for polishing silicon substrate and polishing composition set

Workpiece processing and resin grinding apparatus

Method of polishing silicon wafer including notch polishing process...

Carrier for double-side polishing apparatus, double-side polishing...

Method of lapping semiconductor wafer and semiconductor wafer

Dual-surface polishing device and dual-surface polishing method

Double-side polishing method and double-side polishing apparatus

Method for double-side polishing wafer

Double disc surface grinding machine and grinding method

Indium phosphide wafer having pits on the back side, method and etc...

Manufacturing method of carrier for double-side polishing apparatus...

Carrier ring, grinding device, and grinding method

Wafer surface beveling method, method of manufacturing wafer, and w...

Wafer polishing chamber and wafer polishing system including same

Method for conditioning polishing pad and polishing apparatus

Semiconductor wafer, and method for polishing semiconductor wafer

Indium phosphide substrate, method of inspecting indium phosphide s...

Magnetic-disk glass substrate, magnetic disk and method for manufac...

Indium phosphide substrate, method of inspecting indium phosphide s...

Workpiece processing apparatus and workpiece processing method

Indium phosphide substrate, method of inspecting indium phosphide s...

Patents Applicationslast 30 patents

METHOD FOR GRINDING SEMICONDUCTOR WAFERS

SIMPLIFIED CARRIER REMOVABLE BY REDUCED NUMBER OF CMP PROCESSES

Process for Polishing and Grinding Copper Foil Surface for Reducing...

DOUBLE-SIDE POLISHING METHOD FOR WORK AND DOUBLE-SIDE POLISHING APP...

DOUBLE-SIDE POLISHING APPARATUS AND DOUBLE-SIDE POLISHING METHOD FO...

GLASS ARTICLE AND METHOD OF PRODUCING GLASS ARTICLE

DOUBLE SIDE GRINDING APPARATUS HAVING CONVEX POLYGON-SHAPED ABRASIV...

METHOD FOR PROCESSING A WAFER AND WAFER

DOUBLE-SIDED POLISHING METHOD FOR OPTICAL LENS

POLISHING PAD, DOUBLE-SIDE POLISHING DEVICE, AND DOUBLE-SIDE POLISH...

Double-Sided Polishing Apparatus

METHOD OF DOUBLE-SIDE POLISHING WORK, METHOD OF PRODUCING WORK, AND...

APPARATUS FOR DOUBLE-SIDE POLISHING WORK

GLASS ARTICLE AND METHOD OF PRODUCING GLASS ARTICLE

Simplified Carrier Removable by Reduced Number of CMP Processes

METHOD FOR OPERATING A DOUBLE-SIDED PROCESSING MACHINE AND DOUBLE-S...

DOUBLE-SIDE OR ONE-SIDE MACHINE TOOL

INSTALLATION AND METHOD FOR POLISHING SEMICONDUCTOR WAFERS

METHOD AND APPARATUS FOR DOUBLE-SIDE POLISHING WORK

DOUBLE-SIDE POLISHING METHOD

OPTICAL MEMBER, METHOD OF PRODUCING OPTICAL MEMBER, AND APPARATUS F...

WATER-BASED GRINDING MACHINE FOR POLISHING SURFACE OF A METAL STRIP

AN APPARATUS FOR WORKING OPPOSITE ARRANGED SURFACES

DOUBLE-SIDED POLISHING OR SANDING MEMBER FOR ATTACHMENT TO A HAND-G...

Control Method of Grinding Water Flow Rate During Double Side Grind...

APPARATUS AND METHOD FOR DOUBLE-SIDE POLISHING WORK

ROTOR DISK AND DOUBLE-SIDED PROCESSING MACHINE FOR PROCESSING AT LE...

APPARATUS AND METHOD FOR DOUBLE-SIDE POLISHING WORKPIECE

METHOD OF DOUBLE-SIDE POLISHING WAFER

APPARATUS AND METHOD FOR DOUBLE-SIDE POLISHING WORK