for drying etching

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CPC
H01L21/67069

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/67069for drying etching

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Systems and methods for pulse width modulated dose control
- Patent number 12,215,421
- Issue date Feb 4, 2025
- Lam Research Corporation
- Mariusch Gregor
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Method for non-destructive inspection of cell etch redeposition
- Patent number 12,218,014
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- I-Che Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
FinFET device and method of forming same
- Patent number 12,218,222
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method and etching apparatus
- Patent number 12,211,695
- Issue date Jan 28, 2025
- Tokyo Electron Limited
- Nobuhiro Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for metastable activated radical selective stri...
- Patent number 12,211,709
- Issue date Jan 28, 2025
- Lam Research Corporation
- Dengliang Yang
- B08 - CLEANING
Information Patent Grant
Stage, film-forming apparatus, and film-processing apparatus
- Patent number 12,211,710
- Issue date Jan 28, 2025
- NHK Spring Co., Ltd.
- Toshihiko Hanamachi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Rating substrate support assemblies based on impedance circuit elec...
- Patent number 12,205,791
- Issue date Jan 21, 2025
- Applied Materials, Inc.
- Arvind Shankar Raman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus for anisotropic pattern etching and treatment
- Patent number 12,205,793
- Issue date Jan 21, 2025
- Lam Research Corporation
- Seokmin Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma control method in semiconductor wafer fabrication
- Patent number 12,205,844
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Huang-Shao Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate support with multiple embedded electrodes
- Patent number 12,198,966
- Issue date Jan 14, 2025
- Applied Materials, Inc.
- Philip Allan Kraus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vapor delivery head for preventing stiction of high aspect ratio st...
- Patent number 12,198,945
- Issue date Jan 14, 2025
- Lam Research AG
- Bhaskar Bandarapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum system, low-pressure vacuum process device, and cutoff member
- Patent number 12,191,167
- Issue date Jan 7, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Tao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer coating for corrosion resistance
- Patent number 12,191,120
- Issue date Jan 7, 2025
- Applied Materials, Inc.
- Amir H. Tavakoli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact openings in semiconductor devices
- Patent number 12,191,202
- Issue date Jan 7, 2025
- Tokyo Electron Limited
- Blaze Messer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor reaction chamber and atomic layer plasma etching appa...
- Patent number 12,191,114
- Issue date Jan 7, 2025
- BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.
- Xingfei Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer treatment system and method of treating wafer
- Patent number 12,183,550
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Po Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom and middle edge rings
- Patent number 12,183,554
- Issue date Dec 31, 2024
- Lam Research Corporation
- Hiran Rajitha Rathnasinghe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for filling a recess formed within a substrate...
- Patent number 12,176,243
- Issue date Dec 24, 2024
- ASM IP Holding B.V.
- Viljami Pore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective passivation and selective deposition
- Patent number 12,170,197
- Issue date Dec 17, 2024
- ASM IP Holding B.V.
- Eva E. Tois
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for cleaning high aspect ratio structures
- Patent number 12,170,196
- Issue date Dec 17, 2024
- Applied Materials, Inc.
- Schubert S. Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for advanced ion control for etching processes
- Patent number 12,165,872
- Issue date Dec 10, 2024
- Lam Research Corporation
- Zhongkui Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic sintered body and member for plasma processing apparatus
- Patent number 12,165,853
- Issue date Dec 10, 2024
- Kyocera Corporation
- Manpei Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for continuous atomic layer deposition
- Patent number 12,163,221
- Issue date Dec 10, 2024
- UChicago Argonne, LLC
- Jeffrey W. Elam
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Etching apparatus and etching method
- Patent number 12,154,793
- Issue date Nov 26, 2024
- Tokyo Electron Limited
- Koichi Nagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method and plasma processing apparatus
- Patent number 12,154,790
- Issue date Nov 26, 2024
- Tokyo Electron Limited
- Seiichi Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etching method
- Patent number 12,154,792
- Issue date Nov 26, 2024
- Tokyo Electron Limited
- Takayuki Katsunuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate support
- Patent number 12,148,636
- Issue date Nov 19, 2024
- Tokyo Electron Limited
- Masanori Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus and method for releasing sample
- Patent number 12,148,633
- Issue date Nov 19, 2024
- HITACHI HIGH-TECH CORPORATION
- Masaki Ishiguro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for etching the periphery edge of a substrate comprising sub...
- Patent number 12,148,634
- Issue date Nov 19, 2024
- DEVICEENG CO., LTD
- Taek Youb Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Symmetric plasma source to generate pie-shaped treatment
- Patent number 12,142,458
- Issue date Nov 12, 2024
- Applied Materials, Inc.
- Anantha K. Subramani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
ION BEAM ETCHING APPARATUS, METHOD FOR MANUFACTURING SEMICONDUCTOR...
- Publication number 20250046629
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Geun Young YEOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PATTERNING A TARGET LAYER, APPARATUS FOR PATTERNING A TAR...
- Publication number 20250046577
- Publication date Feb 6, 2025
- ASML NETHERLANDS B.V.
- Syam Parayil VENUGOPALAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE-PROCESSING METHOD AND SUBSTRATE-PROCESSING APPARATUS
- Publication number 20250029843
- Publication date Jan 23, 2025
- TOKYO ELECTRON LIMITED
- Hiroto FUJIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20250029817
- Publication date Jan 23, 2025
- JUSUNG ENGINEERING CO., LTD.
- WOONG KYO OH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE SUPPORT
- Publication number 20250022724
- Publication date Jan 16, 2025
- TOKYO ELECTRON LIMITED
- Masanori TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH
- Publication number 20250022755
- Publication date Jan 16, 2025
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
GAS CLUSTER ASSISTED PLASMA PROCESSING
- Publication number 20250022689
- Publication date Jan 16, 2025
- TOKYO ELECTRON LIMITED
- Peter Ventzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20250022706
- Publication date Jan 16, 2025
- TOKYO ELECTRON LIMITED
- Tomohiko NIIZEKI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROCESS SYSTEM, METHOD, AND SUBSTRATE CHUCK
- Publication number 20250022739
- Publication date Jan 16, 2025
- TOKYO ELECTRON LIMITED
- Matthew Charles Gwinn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR ETCHING SILICON OXIDE
- Publication number 20250014906
- Publication date Jan 9, 2025
- Central Glass Company, Limited
- Shoi SUZUKI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PROCESS PLATFORM
- Publication number 20250014931
- Publication date Jan 9, 2025
- Beijing E-Town Semiconductor Technology Co., Ltd.
- Haiwei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED TUNGSTEN GALVANIC CORROSION IN WET CLEANING FOR ADVANCED SE...
- Publication number 20250006554
- Publication date Jan 2, 2025
- Intel Corporation
- Ramanan Ehamparam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESSING PRECLEAN METHODS AND APPARATUS
- Publication number 20240429038
- Publication date Dec 26, 2024
- ASM IP HOLDING B.V.
- Chuang Wei
- B08 - CLEANING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS HAVING A MIDDLE ELECTRODE
- Publication number 20240429070
- Publication date Dec 26, 2024
- SK HYNIX INC.
- Jin Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO CREATE AIR GAPS
- Publication number 20240429091
- Publication date Dec 26, 2024
- LAM RESEARCH CORPORATION
- Patrick A. Van Cleemput
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR BEAM PROCESSING OF SUBSTRATES
- Publication number 20240419080
- Publication date Dec 19, 2024
- TOKYO ELECTRON LIMITED
- Mirko Vukovic
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
GAS TREATMENT METHOD AND GAS TREATMENT DEVICE
- Publication number 20240412978
- Publication date Dec 12, 2024
- Tokyo Electron Limited
- Kimihiko DEMICHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATING PLATFORM, THERMAL TREATMENT AND MANUFACTURING METHOD
- Publication number 20240387203
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao-Hua Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER TREATMENT SYSTEM AND METHOD OF TREATING WAFER
- Publication number 20240387146
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Po Hsun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BY-SITE-COMENSATED ETCH BACK FOR LOCAL PLANARIZATION/TOPOGRAPHY ADJ...
- Publication number 20240387185
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SELECTIVE ETCHING BY LOCAL PHOTON SURFACE ACTIVATION
- Publication number 20240387186
- Publication date Nov 21, 2024
- TOKYO ELECTRON LIMITED
- Sergey Voronin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER CHUCK STRUCTURE WITH HOLES IN UPPER SURFACE TO IMPROVE TEMPER...
- Publication number 20240379400
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Jung Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SMALL GAS FLOW MONITORING OF DRY ETCHER BY OES SIGNAL
- Publication number 20240379387
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Lung HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS
- Publication number 20240371609
- Publication date Nov 7, 2024
- TOKYO ELECTRON LIMITED
- Shin MATSUURA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD, SYSTEM AND APPARATUS FOR SURFACE MODIFICATION
- Publication number 20240371662
- Publication date Nov 7, 2024
- ASM IP HOLDING B.V.
- Rajkumar Jakkaraju
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARCING PROTECTION METHOD, PROCESSING TOOL AND FABRICATION SYSTEM
- Publication number 20240363318
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wun-Kai TSAI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SYSTEM AND METHOD FOR SELECTIVE ETCHING OF AMORPHOUS SILICON OVER E...
- Publication number 20240363374
- Publication date Oct 31, 2024
- Applied Materials, Inc.
- Mukhles SOWWAN
- C01 - INORGANIC CHEMISTRY
Information Patent Application
Program, Information Processing Method, Information Processing Devi...
- Publication number 20240355653
- Publication date Oct 24, 2024
- SPP Technologies Co., Ttd.
- Tatsuo Hiramura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDGE RING ARRANGEMENT WITH MOVEABLE EDGE RINGS
- Publication number 20240355667
- Publication date Oct 24, 2024
- LAM RESEARCH CORPORATION
- Haoquan Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR PROCESSING SUBSTRATE
- Publication number 20240355615
- Publication date Oct 24, 2024
- TOKYO ELECTRON LIMITED
- Tadahiro ISHIZAKA
- H01 - BASIC ELECTRIC ELEMENTS

for drying etching

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Systems and methods for pulse width modulated dose control

Method for non-destructive inspection of cell etch redeposition

FinFET device and method of forming same

Etching method and etching apparatus

Systems and methods for metastable activated radical selective stri...

Stage, film-forming apparatus, and film-processing apparatus

Rating substrate support assemblies based on impedance circuit elec...

Method and apparatus for anisotropic pattern etching and treatment

Plasma control method in semiconductor wafer fabrication

Substrate support with multiple embedded electrodes

Vapor delivery head for preventing stiction of high aspect ratio st...

Vacuum system, low-pressure vacuum process device, and cutoff member

Multilayer coating for corrosion resistance

Contact openings in semiconductor devices

Semiconductor reaction chamber and atomic layer plasma etching appa...

Wafer treatment system and method of treating wafer

Bottom and middle edge rings

Method and apparatus for filling a recess formed within a substrate...

Selective passivation and selective deposition

Methods and systems for cleaning high aspect ratio structures

Methods and systems for advanced ion control for etching processes

Ceramic sintered body and member for plasma processing apparatus

System for continuous atomic layer deposition

Etching apparatus and etching method

Etching method and plasma processing apparatus

Plasma etching method

Substrate support

Plasma processing apparatus and method for releasing sample

Device for etching the periphery edge of a substrate comprising sub...

Symmetric plasma source to generate pie-shaped treatment

Patents Applicationslast 30 patents

ION BEAM ETCHING APPARATUS, METHOD FOR MANUFACTURING SEMICONDUCTOR...

METHOD OF PATTERNING A TARGET LAYER, APPARATUS FOR PATTERNING A TAR...

SUBSTRATE-PROCESSING METHOD AND SUBSTRATE-PROCESSING APPARATUS

SUBSTRATE PROCESSING APPARATUS

SUBSTRATE SUPPORT

WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH

GAS CLUSTER ASSISTED PLASMA PROCESSING

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

PROCESS SYSTEM, METHOD, AND SUBSTRATE CHUCK

METHOD AND DEVICE FOR ETCHING SILICON OXIDE

PROCESS PLATFORM

REDUCED TUNGSTEN GALVANIC CORROSION IN WET CLEANING FOR ADVANCED SE...

SEMICONDUCTOR PROCESSING PRECLEAN METHODS AND APPARATUS

SUBSTRATE PROCESSING APPARATUS HAVING A MIDDLE ELECTRODE

METHOD TO CREATE AIR GAPS

APPARATUS AND METHODS FOR BEAM PROCESSING OF SUBSTRATES

GAS TREATMENT METHOD AND GAS TREATMENT DEVICE

HEATING PLATFORM, THERMAL TREATMENT AND MANUFACTURING METHOD

WAFER TREATMENT SYSTEM AND METHOD OF TREATING WAFER

BY-SITE-COMENSATED ETCH BACK FOR LOCAL PLANARIZATION/TOPOGRAPHY ADJ...

METHOD FOR SELECTIVE ETCHING BY LOCAL PHOTON SURFACE ACTIVATION

WAFER CHUCK STRUCTURE WITH HOLES IN UPPER SURFACE TO IMPROVE TEMPER...

SMALL GAS FLOW MONITORING OF DRY ETCHER BY OES SIGNAL

PLASMA PROCESSING APPARATUS

METHOD, SYSTEM AND APPARATUS FOR SURFACE MODIFICATION

ARCING PROTECTION METHOD, PROCESSING TOOL AND FABRICATION SYSTEM

SYSTEM AND METHOD FOR SELECTIVE ETCHING OF AMORPHOUS SILICON OVER E...

Program, Information Processing Method, Information Processing Devi...

EDGE RING ARRANGEMENT WITH MOVEABLE EDGE RINGS

METHOD AND APPARATUS FOR PROCESSING SUBSTRATE