for electroless plating

Industry

CPC
H01L21/76874

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76874for electroless plating

Industries

Patents Grantslast 30 patents

Information Patent Grant
High aspect ratio buried power rail metallization
- Patent number 12,148,699
- Issue date Nov 19, 2024
- International Business Machines Corporation
- Sagarika Mukesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and semiconductor device having the same
- Patent number 12,142,521
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Jiun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method
- Patent number 12,094,771
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bo-Jiun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming contact plugs with reduced corrosion
- Patent number 12,068,197
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroless plating process
- Patent number 12,018,378
- Issue date Jun 25, 2024
- KOJIMA CHEMICALS, CO., LTD.
- Tomohito Kato
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Flat metal features for microelectronics applications
- Patent number 11,908,739
- Issue date Feb 20, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion layers in metal interconnects
- Patent number 11,901,225
- Issue date Feb 13, 2024
- Applied Materials, Inc.
- Eric J. Bergman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rework for metal interconnects using etch and thermal anneal
- Patent number 11,901,224
- Issue date Feb 13, 2024
- International Business Machines Corporation
- Prasad Bhosale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated passive device and fabrication method using a last throu...
- Patent number 11,735,497
- Issue date Aug 22, 2023
- Semiconductor Components Industries, LLC
- Takashi Noma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of copper plating filling
- Patent number 11,728,213
- Issue date Aug 15, 2023
- Shanghai Huali Integrated Circuit Corporation
- Junjie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating an RF filter on a semiconductor package using selective...
- Patent number 11,605,867
- Issue date Mar 14, 2023
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Immersion plating treatments for indium passivation
- Patent number 11,535,945
- Issue date Dec 27, 2022
- Texas Instruments Incorporated
- Simon Joshua Jacobs
- B32 - LAYERED PRODUCTS
Information Patent Grant
Selective metal deposition by patterning direct electroless metal p...
- Patent number 11,501,967
- Issue date Nov 15, 2022
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming interconnect structure
- Patent number 11,456,211
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Jiun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method
- Patent number 11,450,563
- Issue date Sep 20, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bo-Jiun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded electronic modules and methods of forming the same utilizi...
- Patent number 11,387,190
- Issue date Jul 12, 2022
- Qorvo US, Inc.
- Thomas Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation structuring and plating for semiconductor devices
- Patent number 11,387,095
- Issue date Jul 12, 2022
- Infineon Technologies Austria AG
- Ravi Keshav Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor element front side electrode
- Patent number 11,335,595
- Issue date May 17, 2022
- Mitsubishi Electric Corporation
- Masatoshi Sunamoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Package-integrated vertical capacitors and methods of assembling same
- Patent number 11,296,186
- Issue date Apr 5, 2022
- Intel Corporation
- Brandon C Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of conductive connection tracks in package mold body usin...
- Patent number 11,296,000
- Issue date Apr 5, 2022
- Infineon Technologies AG
- Cher Hau Danny Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and method of laminati...
- Patent number 11,183,425
- Issue date Nov 23, 2021
- Kabushiki Kaisha Toshiba
- Kengo Furutani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing a contact pad, method for manufacturing a...
- Patent number 11,171,050
- Issue date Nov 9, 2021
- Tokyo Electron Limited
- Koichi Yatsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lattice bump interconnect
- Patent number 11,145,598
- Issue date Oct 12, 2021
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing wiring structure
- Patent number 11,094,547
- Issue date Aug 17, 2021
- HAMAMATSU PHOTONICS K.K.
- Masaharu Muramatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating an RF filter on a semiconductor package using selective...
- Patent number 11,081,768
- Issue date Aug 3, 2021
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tungsten feature fill
- Patent number 11,075,115
- Issue date Jul 27, 2021
- Novellus Systems, Inc.
- Anand Chandrashekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate, semiconductor package, and method for form...
- Patent number 11,024,555
- Issue date Jun 1, 2021
- Advanced Semiconductor Engineering, Inc.
- Cheng-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming metal electrodes concurrently on silicon region...
- Patent number 11,018,272
- Issue date May 25, 2021
- Imec VZW
- Richard Russell
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for forming contact plugs with reduced corrosion
- Patent number 10,985,061
- Issue date Apr 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 10,943,843
- Issue date Mar 9, 2021
- Advanced Semiconductor Engineering, Inc.
- Hsiu-Chi Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTROLESS PLATING METHODS
- Publication number 20240404879
- Publication date Dec 5, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Takashi NOMA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240379417
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Jiun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHOD
- Publication number 20240363402
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Jiun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING CONTACT PLUGS WITH REDUCED CORROSION
- Publication number 20240363409
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR THIN ELECTROLESS DEPOSITION
- Publication number 20240355676
- Publication date Oct 24, 2024
- Applied Materials, Inc.
- Marvin L. Bernt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE LIQUID PROCESSING METHOD, AND RECORDING MEDIUM
- Publication number 20240213090
- Publication date Jun 27, 2024
- TOKYO ELECTRON LIMITED
- Keiichi Fujita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WIRING BODY, MOUNTING SUBSTRATE, METHOD FOR MANUFACTURING WIRING BO...
- Publication number 20240153859
- Publication date May 9, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Takayoshi NIRENGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATING METHOD AND PLATING APPARATUS
- Publication number 20240079269
- Publication date Mar 7, 2024
- TOKYO ELECTRON LIMITED
- Tomonori Esaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE HAVING FOUR SIDES PROVIDED WITH ELECTROMAGNETIC INTERF...
- Publication number 20240063138
- Publication date Feb 22, 2024
- Walton Advanced Engineering, Inc
- HONG-CHI YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR DEVICE EMBEDDED PACKAGING STRUCTURE
- Publication number 20240063055
- Publication date Feb 22, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ASPECT RATIO BURIED POWER RAIL METALLIZATION
- Publication number 20230402378
- Publication date Dec 14, 2023
- International Business Machines Corporation
- Sagarika Mukesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION LAYERS IN METAL INTERCONNECTS
- Publication number 20230077737
- Publication date Mar 16, 2023
- Applied Materials, Inc.
- Eric J. Bergman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE
- Publication number 20230058819
- Publication date Feb 23, 2023
- Samsung Electronics Co., Ltd.
- Ui Hyoung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOPING PROCESSES IN METAL INTERCONNECT STRUCTURES
- Publication number 20220415819
- Publication date Dec 29, 2022
- LAM RESEARCH CORPORATION
- Aniruddha Joi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND SEMICONDUCTOR DEVICE HAVING THE SAME
- Publication number 20220384256
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Jiun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHOD
- Publication number 20220384334
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Jiun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20220376111
- Publication date Nov 24, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kan-Ju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE HAVING A STRUCTURED METALLIZATION LAYER
- Publication number 20220285149
- Publication date Sep 8, 2022
- Infineon Technologies Austria AG
- Ravi Keshav Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATING APPARATUS FOR PLATING SEMICONDUCTOR WAFER AND PLATING METHOD
- Publication number 20220205126
- Publication date Jun 30, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Yu Tsai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER-FILLED TRENCH CONTACT FOR TRANSISTOR PERFORMANCE IMPROVEMENT
- Publication number 20220115505
- Publication date Apr 14, 2022
- Intel Corporation
- KELIN J. KUHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLESS SEMICONDUCTOR BONDING STRUCTURE, ELECTROLESS PLATING SY...
- Publication number 20220056589
- Publication date Feb 24, 2022
- Advanced Semiconductor Engineering, Inc.
- Chun-Wei CHIANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PASSIVATION STRUCTURING AND PLATING FOR SEMICONDUCTOR DEVICES
- Publication number 20220059347
- Publication date Feb 24, 2022
- Ravi Keshav Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING INTERCONNECT STRUCTURE
- Publication number 20220037202
- Publication date Feb 3, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Jiun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20220013409
- Publication date Jan 13, 2022
- IBIDEN CO., LTD.
- Isao OHNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER WIRING FORMING METHOD AND RECORDING MEDIUM
- Publication number 20210358767
- Publication date Nov 18, 2021
- TOKYO ELECTRON LIMITED
- Takashi Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHOD
- Publication number 20210343588
- Publication date Nov 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Jiun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNGSTEN FEATURE FILL
- Publication number 20210327754
- Publication date Oct 21, 2021
- Novellus Systems, Inc.
- Anand Chandrashekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATING AN RF FILTER ON A SEMICONDUCTOR PACKAGE USING SELECTIVE...
- Publication number 20210305668
- Publication date Sep 30, 2021
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Forming Contact Plugs with Reduced Corrosion
- Publication number 20210257254
- Publication date Aug 19, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMMERSION PLATING TREATMENTS FOR INDIUM PASSIVATION
- Publication number 20210198798
- Publication date Jul 1, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Simon Joshua Jacobs
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

for electroless plating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

High aspect ratio buried power rail metallization

Interconnect structure and semiconductor device having the same

Interconnect structure and method

Methods for forming contact plugs with reduced corrosion

Electroless plating process

Flat metal features for microelectronics applications

Diffusion layers in metal interconnects

Rework for metal interconnects using etch and thermal anneal

Integrated passive device and fabrication method using a last throu...

Method of copper plating filling

Fabricating an RF filter on a semiconductor package using selective...

Immersion plating treatments for indium passivation

Selective metal deposition by patterning direct electroless metal p...

Method of forming interconnect structure

Interconnect structure and method

Shielded electronic modules and methods of forming the same utilizi...

Passivation structuring and plating for semiconductor devices

Method of manufacturing a semiconductor element front side electrode

Package-integrated vertical capacitors and methods of assembling same

Formation of conductive connection tracks in package mold body usin...

Method of manufacturing semiconductor device and method of laminati...

Method for manufacturing a contact pad, method for manufacturing a...

Lattice bump interconnect

Method for producing wiring structure

Fabricating an RF filter on a semiconductor package using selective...

Tungsten feature fill

Semiconductor substrate, semiconductor package, and method for form...

Methods for forming metal electrodes concurrently on silicon region...

Methods for forming contact plugs with reduced corrosion

Semiconductor package structure

Patents Applicationslast 30 patents

ELECTROLESS PLATING METHODS

INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME

INTERCONNECT STRUCTURE AND METHOD

METHODS FOR FORMING CONTACT PLUGS WITH REDUCED CORROSION

PROCESS FOR THIN ELECTROLESS DEPOSITION

SUBSTRATE LIQUID PROCESSING METHOD, AND RECORDING MEDIUM

WIRING BODY, MOUNTING SUBSTRATE, METHOD FOR MANUFACTURING WIRING BO...

PLATING METHOD AND PLATING APPARATUS

CHIP PACKAGE HAVING FOUR SIDES PROVIDED WITH ELECTROMAGNETIC INTERF...

MANUFACTURING METHOD FOR DEVICE EMBEDDED PACKAGING STRUCTURE

HIGH ASPECT RATIO BURIED POWER RAIL METALLIZATION

DIFFUSION LAYERS IN METAL INTERCONNECTS

METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE

DOPING PROCESSES IN METAL INTERCONNECT STRUCTURES

INTERCONNECT STRUCTURE AND SEMICONDUCTOR DEVICE HAVING THE SAME

INTERCONNECT STRUCTURE AND METHOD

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

POWER SEMICONDUCTOR DEVICE HAVING A STRUCTURED METALLIZATION LAYER

PLATING APPARATUS FOR PLATING SEMICONDUCTOR WAFER AND PLATING METHOD

COPPER-FILLED TRENCH CONTACT FOR TRANSISTOR PERFORMANCE IMPROVEMENT

ELECTROLESS SEMICONDUCTOR BONDING STRUCTURE, ELECTROLESS PLATING SY...

PASSIVATION STRUCTURING AND PLATING FOR SEMICONDUCTOR DEVICES

METHOD OF FORMING INTERCONNECT STRUCTURE

METHOD FOR MANUFACTURING WIRING SUBSTRATE

MULTILAYER WIRING FORMING METHOD AND RECORDING MEDIUM

INTERCONNECT STRUCTURE AND METHOD

TUNGSTEN FEATURE FILL

FABRICATING AN RF FILTER ON A SEMICONDUCTOR PACKAGE USING SELECTIVE...

Methods for Forming Contact Plugs with Reduced Corrosion

IMMERSION PLATING TREATMENTS FOR INDIUM PASSIVATION