for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Industry

CPC
B24B57/02

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B24Grinding technology B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS B24B57/00Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents

Current Industry

B24B57/02for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Industries

Patents Grantslast 30 patents

Information Patent Grant
Flow divider with internal vane
- Patent number 11,971,127
- Issue date Apr 30, 2024
- Cummins Inc.
- George Martin Tolhurst
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing tool for narrow part, method of manufacturing polishing t...
- Patent number 11,951,594
- Issue date Apr 9, 2024
- Mitsubishi Heavy Industries Compressor Corporation
- Kosei Kawahara
- B24 - GRINDING POLISHING
Information Patent Grant
Slurry monitoring device, CMP system and method of in-line monitori...
- Patent number 11,938,586
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chwen Yu
- G01 - MEASURING TESTING
Information Patent Grant
Control method of grinding water flow rate during double side grind...
- Patent number 11,938,588
- Issue date Mar 26, 2024
- Zhonghuan Advanced Semiconductor Technology Co., Ltd.
- Chien-Ming Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for polishing and method of polishing
- Patent number 11,926,018
- Issue date Mar 12, 2024
- Ebara Corporation
- Masayoshi Ito
- B24 - GRINDING POLISHING
Information Patent Grant
Fluid processing systems including a plurality of material tanks, a...
- Patent number 11,925,912
- Issue date Mar 12, 2024
- Fujifilm Electronic Materials U.S.A., Inc.
- Shih-Pin Chou
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Blasting system with dual dispensers from single chamber
- Patent number 11,884,480
- Issue date Jan 30, 2024
- Benjamin LeCompte
- B24 - GRINDING POLISHING
Information Patent Grant
Temperature-based in-situ edge assymetry correction during CMP
- Patent number 11,865,671
- Issue date Jan 9, 2024
- Applied Materials, Inc.
- Haosheng Wu
- B24 - GRINDING POLISHING
Information Patent Grant
High-throughput, precise semiconductor slurry blending tool
- Patent number 11,858,086
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Wei Chiu
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Polishing apparatus
- Patent number 11,858,088
- Issue date Jan 2, 2024
- Disco Corporation
- Toshiyuki Moriya
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and method for recirculating fluids
- Patent number 11,858,091
- Issue date Jan 2, 2024
- Mega Fluid Systems, Inc.
- Robert Eiseler
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Magnetic slurry for highly efficiency CMP
- Patent number 11,854,827
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Ting Chen
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 11,850,697
- Issue date Dec 26, 2023
- Tokyo Electron Limited
- Osamu Miyahara
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus
- Patent number 11,839,948
- Issue date Dec 12, 2023
- Ebara Corporation
- Takashi Yamazaki
- B24 - GRINDING POLISHING
Information Patent Grant
On-demand in-line-blending and supply of chemicals
- Patent number 11,839,860
- Issue date Dec 12, 2023
- DIVERSIFIED FLUID SOLUTIONS, LLC
- Darren Willey
- B24 - GRINDING POLISHING
Information Patent Grant
Temperature and slurry flow rate control in CMP
- Patent number 11,826,872
- Issue date Nov 28, 2023
- Applied Materials, Inc.
- Haosheng Wu
- B24 - GRINDING POLISHING
Information Patent Grant
Slurry distribution device for chemical mechanical polishing
- Patent number 11,806,835
- Issue date Nov 7, 2023
- Applied Materials, Inc.
- Yen-Chu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing with applied magnetic field
- Patent number 11,787,008
- Issue date Oct 17, 2023
- Applied Materials, Inc.
- Xingfeng Wang
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing apparatus including a multi-zone platen
- Patent number 11,772,228
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ting-Hsun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Small batch polishing fluid delivery for CMP
- Patent number 11,772,234
- Issue date Oct 3, 2023
- Applied Materials, Inc.
- Robert D. Tolles
- B24 - GRINDING POLISHING
Information Patent Grant
Slurry enhancement for polishing system
- Patent number 11,752,592
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Hung Liao
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus with an air curtain in a loading/unl...
- Patent number 11,749,549
- Issue date Sep 5, 2023
- KCTECH CO., LTD.
- Dong Min Kim
- B24 - GRINDING POLISHING
Information Patent Grant
Automatic wet sanding apparatus
- Patent number 11,745,308
- Issue date Sep 5, 2023
- Toyota Jidosha Kabushiki Kaisha
- Ryuji Hayashi
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate polish edge uniformity control with secondary fluid dispense
- Patent number 11,724,355
- Issue date Aug 15, 2023
- Applied Materials, Inc.
- Justin H. Wong
- B24 - GRINDING POLISHING
Information Patent Grant
Floor treatment apparatus
- Patent number 11,717,929
- Issue date Aug 8, 2023
- Edward Johannes Lagerwaard
- B24 - GRINDING POLISHING
Information Patent Grant
Rotor polishing device
- Patent number 11,712,776
- Issue date Aug 1, 2023
- Terry Sullivan
- B24 - GRINDING POLISHING
Information Patent Grant
Automatic wet sanding apparatus
- Patent number 11,701,752
- Issue date Jul 18, 2023
- Toyota Jidosha Kabushiki Kaisha
- Ryuji Hayashi
- B24 - GRINDING POLISHING
Information Patent Grant
Temperature-based assymetry correction during CMP and nozzle for me...
- Patent number 11,697,187
- Issue date Jul 11, 2023
- Applied Materials, Inc.
- Haosheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical-mechanical polishing apparatus
- Patent number 11,679,467
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hsi Huang
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus and polishing method
- Patent number 11,667,007
- Issue date Jun 6, 2023
- Ebara Corporation
- Mitsunori Sugiyama
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POLISHING PAD AND POLISHING METHOD
- Publication number 20240131654
- Publication date Apr 25, 2024
- FUJIMI INCORPORATED
- Kyosuke Tenko
- B24 - GRINDING POLISHING
Information Patent Application
MAGNET-DRIVEN CHEMICAL-MECHANICAL POLISHING
- Publication number 20240123561
- Publication date Apr 18, 2024
- Intel Corporation
- Yosef KORNBLUTH
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR CMP TEMPERATURE CONTROL
- Publication number 20240109163
- Publication date Apr 4, 2024
- Applied Materials, Inc.
- Haosheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ABRASIVE SLURRY REGENERATION METHOD AND ABRASIVE SLURRY REGENERATIO...
- Publication number 20240091905
- Publication date Mar 21, 2024
- Konica Minolta, Inc.
- Shin NAKAYAMA
- B24 - GRINDING POLISHING
Information Patent Application
RETAINER RING, CHEMICAL MECHANICAL POLISHING APPARATUS, AND SUBSTRA...
- Publication number 20240091902
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Sangyun LEE
- B24 - GRINDING POLISHING
Information Patent Application
SLURRY ARM AND CHEMICAL MECHANICAL POLISHING APPARATUS INCLUDING TH...
- Publication number 20240075581
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- DONGHOON KWON
- B24 - GRINDING POLISHING
Information Patent Application
PAD SURFACE CLEANING DEVICE AROUND PAD CONDITIONER TO ENABLE INSITU...
- Publication number 20240066664
- Publication date Feb 29, 2024
- Applied Materials, Inc.
- Shou-Sung CHANG
- B08 - CLEANING
Information Patent Application
WORKPIECE PROCESSING METHOD
- Publication number 20240058922
- Publication date Feb 22, 2024
- Disco Corporation
- Minoru MATSUZAWA
- B24 - GRINDING POLISHING
Information Patent Application
ELECTRICAL CLEANING TOOL FOR WAFER POLISHING TOOL SYSTEM
- Publication number 20240050995
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wen Liu
- B08 - CLEANING
Information Patent Application
POLISHING PAD
- Publication number 20240042573
- Publication date Feb 8, 2024
- Disco Corporation
- Norihisa ARIFUKU
- B24 - GRINDING POLISHING
Information Patent Application
TEMPERATURE AND SLURRY FLOW RATE CONTROL IN CMP
- Publication number 20240025006
- Publication date Jan 25, 2024
- Applied Materials, Inc.
- Haosheng Wu
- B24 - GRINDING POLISHING
Information Patent Application
APPARATUS AND METHOD FOR POLISHING OBJECTS USING THIN FILM OF SLURRY
- Publication number 20240025013
- Publication date Jan 25, 2024
- Biz Mohammed
- B24 - GRINDING POLISHING
Information Patent Application
MONITORING THICKNESS IN FACE-UP POLISHING WITH ROLLER
- Publication number 20240017376
- Publication date Jan 18, 2024
- Applied Materials, Inc.
- Brian J. Brown
- B24 - GRINDING POLISHING
Information Patent Application
HIGH-THROUGHPUT, PRECISE SEMICONDUCTOR SLURRY BLENDING TOOL
- Publication number 20240017372
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chi-Wei CHIU
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
GRINDING LIQUID MIXING AND SUPPLYING SYSTEM
- Publication number 20230405534
- Publication date Dec 21, 2023
- Creative System Technology Ltd.
- Huo Lung Cheng
- B24 - GRINDING POLISHING
Information Patent Application
FACE-UP WAFER ELECTROCHEMICAL PLANARIZATION APPARATUS
- Publication number 20230390887
- Publication date Dec 7, 2023
- Applied Materials, Inc.
- Kevin H. Song
- B24 - GRINDING POLISHING
Information Patent Application
GROUNDING TECHNIQUES FOR ESD POLYMERIC FLUID LINES
- Publication number 20230381922
- Publication date Nov 30, 2023
- Applied Materials, Inc.
- Chad Pollard
- B24 - GRINDING POLISHING
Information Patent Application
SYSTEM AND METHOD FOR REMOVING DEBRIS DURING CHEMICAL MECHANICAL PL...
- Publication number 20230381923
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Wei HSU
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING APPARATUS WITH INTEGRATED SLURRY MIXE...
- Publication number 20230373062
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Chen Wei
- B24 - GRINDING POLISHING
Information Patent Application
Chemical Mechanical Polishing Apparatus Including a Multi-Zone Platen
- Publication number 20230364733
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Hsun Chang
- B24 - GRINDING POLISHING
Information Patent Application
GRINDING APPARATUS
- Publication number 20230364740
- Publication date Nov 16, 2023
- TOKYO ELECTRON LIMITED
- Munehisa KODAMA
- B24 - GRINDING POLISHING
Information Patent Application
SLURRY ENHANCEMENT FOR POLISHING SYSTEM
- Publication number 20230356356
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hung LIAO
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE POLISH EDGE UNIFORMITY CONTROL WITH SECONDARY FLUID DISPENSE
- Publication number 20230339066
- Publication date Oct 26, 2023
- Applied Materials, Inc.
- Justin H. WONG
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD
- Publication number 20230321696
- Publication date Oct 12, 2023
- EBARA CORPORATION
- Hiroki TAKAHASHI
- B08 - CLEANING
Information Patent Application
POLISHING METHOD AND POLISHING APPARATUS FOR WORKPIECE
- Publication number 20230311267
- Publication date Oct 5, 2023
- EBARA CORPORATION
- Toshifumi KIMBA
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE POLISHING APPARATUS AND POLISHING LIQUID DISCHARGE METHOD...
- Publication number 20230302604
- Publication date Sep 28, 2023
- EBARA CORPORATION
- Tetsuji TOGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTERNAL HEATING SYSTEM FOR USE IN CHEMICAL MECHANICAL POLISHING SY...
- Publication number 20230294237
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Sheng LIN
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING METHOD AND POLISHING APPARATUS
- Publication number 20230294241
- Publication date Sep 21, 2023
- EBARA CORPORATION
- Ban ITO
- B24 - GRINDING POLISHING
Information Patent Application
NOVEL CHEMICAL-MECHANICAL POLISHING APPARATUS
- Publication number 20230286106
- Publication date Sep 14, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Hsi Huang
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS FOR SUBSTRATE AND POLISHING METHOD FOR SUBSTRAT...
- Publication number 20230286108
- Publication date Sep 14, 2023
- SAMSUNG ELECTRONICS CO., LTD.
- Donghoon Kwon
- B24 - GRINDING POLISHING

for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Flow divider with internal vane

Polishing tool for narrow part, method of manufacturing polishing t...

Slurry monitoring device, CMP system and method of in-line monitori...

Control method of grinding water flow rate during double side grind...

Apparatus for polishing and method of polishing

Fluid processing systems including a plurality of material tanks, a...

Blasting system with dual dispensers from single chamber

Temperature-based in-situ edge assymetry correction during CMP

High-throughput, precise semiconductor slurry blending tool

Polishing apparatus

Apparatus and method for recirculating fluids

Magnetic slurry for highly efficiency CMP

Substrate processing apparatus and substrate processing method

Polishing apparatus

On-demand in-line-blending and supply of chemicals

Temperature and slurry flow rate control in CMP

Slurry distribution device for chemical mechanical polishing

Chemical mechanical polishing with applied magnetic field

Chemical mechanical polishing apparatus including a multi-zone platen

Small batch polishing fluid delivery for CMP

Slurry enhancement for polishing system

Substrate processing apparatus with an air curtain in a loading/unl...

Automatic wet sanding apparatus

Substrate polish edge uniformity control with secondary fluid dispense

Floor treatment apparatus

Rotor polishing device

Automatic wet sanding apparatus

Temperature-based assymetry correction during CMP and nozzle for me...

Chemical-mechanical polishing apparatus

Polishing apparatus and polishing method

Patents Applicationslast 30 patents

POLISHING PAD AND POLISHING METHOD

MAGNET-DRIVEN CHEMICAL-MECHANICAL POLISHING

METHOD FOR CMP TEMPERATURE CONTROL

ABRASIVE SLURRY REGENERATION METHOD AND ABRASIVE SLURRY REGENERATIO...

RETAINER RING, CHEMICAL MECHANICAL POLISHING APPARATUS, AND SUBSTRA...

SLURRY ARM AND CHEMICAL MECHANICAL POLISHING APPARATUS INCLUDING TH...

PAD SURFACE CLEANING DEVICE AROUND PAD CONDITIONER TO ENABLE INSITU...

WORKPIECE PROCESSING METHOD

ELECTRICAL CLEANING TOOL FOR WAFER POLISHING TOOL SYSTEM

POLISHING PAD

TEMPERATURE AND SLURRY FLOW RATE CONTROL IN CMP

APPARATUS AND METHOD FOR POLISHING OBJECTS USING THIN FILM OF SLURRY

MONITORING THICKNESS IN FACE-UP POLISHING WITH ROLLER

HIGH-THROUGHPUT, PRECISE SEMICONDUCTOR SLURRY BLENDING TOOL

GRINDING LIQUID MIXING AND SUPPLYING SYSTEM

FACE-UP WAFER ELECTROCHEMICAL PLANARIZATION APPARATUS

GROUNDING TECHNIQUES FOR ESD POLYMERIC FLUID LINES

SYSTEM AND METHOD FOR REMOVING DEBRIS DURING CHEMICAL MECHANICAL PL...

CHEMICAL MECHANICAL POLISHING APPARATUS WITH INTEGRATED SLURRY MIXE...

Chemical Mechanical Polishing Apparatus Including a Multi-Zone Platen

GRINDING APPARATUS

SLURRY ENHANCEMENT FOR POLISHING SYSTEM

SUBSTRATE POLISH EDGE UNIFORMITY CONTROL WITH SECONDARY FLUID DISPENSE

SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD

POLISHING METHOD AND POLISHING APPARATUS FOR WORKPIECE

SUBSTRATE POLISHING APPARATUS AND POLISHING LIQUID DISCHARGE METHOD...

EXTERNAL HEATING SYSTEM FOR USE IN CHEMICAL MECHANICAL POLISHING SY...

POLISHING METHOD AND POLISHING APPARATUS

NOVEL CHEMICAL-MECHANICAL POLISHING APPARATUS

POLISHING APPARATUS FOR SUBSTRATE AND POLISHING METHOD FOR SUBSTRAT...