TREA

for forming devices by joining two substrates together

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Industry

  • CPC
  • H01L51/0024
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof

Current Industry

H01L51/0024for forming devices by joining two substrates together
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