for holding or transferring the layer preform

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CPC
H01L2224/27003

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/27003for holding or transferring the layer preform

Industries

Patents Grantslast 30 patents

Information Patent Grant
Low pressure sintering powder
- Patent number 12,113,039
- Issue date Oct 8, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Connection structure and manufacturing method therefor
- Patent number 12,100,923
- Issue date Sep 24, 2024
- Resonac Corporation
- Kunihiko Akai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive film adhesive
- Patent number 12,053,934
- Issue date Aug 6, 2024
- Ormet Circuits, Inc.
- Catherine A. Shearer
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,935,872
- Issue date Mar 19, 2024
- Kioxia Corporation
- Takahiro Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer substrate
- Patent number 11,901,325
- Issue date Feb 13, 2024
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and method of producing the same
- Patent number 11,784,154
- Issue date Oct 10, 2023
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure
- Patent number 11,735,556
- Issue date Aug 22, 2023
- Mikuni Electron Corporation
- Sakae Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and method of producing the same
- Patent number 11,710,716
- Issue date Jul 25, 2023
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bond tips and related apparatus and methods
- Patent number 11,705,425
- Issue date Jul 18, 2023
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of applying conductive adhesive and manufacturing device usi...
- Patent number 11,626,295
- Issue date Apr 11, 2023
- Epistar Corporation
- Min-Hsun Hsieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anisotropic conductive film and method of producing the same
- Patent number 11,404,391
- Issue date Aug 2, 2022
- Dexerials Corporation
- Seiichiro Shinohara
- B32 - LAYERED PRODUCTS
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method of transferring light emitting device for display and displa...
- Patent number 11,387,383
- Issue date Jul 12, 2022
- SEOUL VIOSYS CO., LTD.
- Chung Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and method of producing the same
- Patent number 11,348,891
- Issue date May 31, 2022
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of surface-mounting components
- Patent number 11,342,489
- Issue date May 24, 2022
- DST Innovations Limited
- Anthony Miles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and method of fabricating the same
- Patent number 11,282,796
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film-shaped firing material and film-shaped firing material with su...
- Patent number 11,267,992
- Issue date Mar 8, 2022
- Lintec Corporation
- Isao Ichikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Anisotropic conductive film and production method of the same
- Patent number 11,195,813
- Issue date Dec 7, 2021
- Dexerials Corporation
- Reiji Tsukao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film-like adhesive and method for producing semiconductor package u...
- Patent number 11,139,261
- Issue date Oct 5, 2021
- Furukawa Electric Co., Ltd.
- Minoru Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure
- Patent number 11,133,279
- Issue date Sep 28, 2021
- Mikuni Electron Corporation
- Sakae Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment method, method for connecting electronic component, metho...
- Patent number 11,049,842
- Issue date Jun 29, 2021
- Dexerials Corporation
- Yasushi Akutsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Thermocompression bond tips and related apparatus and methods
- Patent number 11,024,595
- Issue date Jun 1, 2021
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of applying conductive adhesive and manufacturing device usi...
- Patent number 11,018,028
- Issue date May 25, 2021
- Epistar Corporation
- Min-Hsun Hsieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low pressure sintering powder
- Patent number 10,998,284
- Issue date May 4, 2021
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Bump-forming film, semiconductor device and manufacturing method th...
- Patent number 10,943,879
- Issue date Mar 9, 2021
- Dexerials Corporation
- Yasushi Akutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic electrically conductive film, method for producing same...
- Patent number 10,832,830
- Issue date Nov 10, 2020
- Dexerials Corporation
- Tomoyuki Ishimatsu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Connection structure
- Patent number 10,804,235
- Issue date Oct 13, 2020
- Mikuni Electron Corporation
- Sakae Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and method of fabricating the same
- Patent number 10,790,235
- Issue date Sep 29, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,770,333
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,770,332
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SINTERING FILM FRAMES AND RELATED METHODS
- Publication number 20240304596
- Publication date Sep 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Dukyong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE TRANSFER FILM AND METHOD FOR MANUFACTURING POWER MODULE SU...
- Publication number 20230178509
- Publication date Jun 8, 2023
- AMOSENSE CO., LTD.
- Younghwan JUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20230060577
- Publication date Mar 2, 2023
- Showa Denko Materials Co., Ltd.
- Kunihiko AKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE FOR DISPLAY AND DISPLAY APPARATUS
- Publication number 20220352413
- Publication date Nov 3, 2022
- Seoul Viosys Co., Ltd.
- Chung Hoon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20220238489
- Publication date Jul 28, 2022
- KIOXIA Corporation
- Takahiro MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING FILM, TAPE FOR WAFER PROCESSING, METHOD FOR PRODUCING BONDE...
- Publication number 20220139864
- Publication date May 5, 2022
- FURUKAWA ELECTRIC CO., LTD.
- Norzafriza NITTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION STRUCTURE
- Publication number 20210398931
- Publication date Dec 23, 2021
- MIKUNI ELECTRON CORPORATION
- SAKAE TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF APPLYING CONDUCTIVE ADHESIVE AND MANUFACTURING DEVICE USI...
- Publication number 20210280436
- Publication date Sep 9, 2021
- EPISTAR CORPORATION
- Min-Hsun HSIEH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOCOMPRESSION BOND TIPS AND RELATED APPARATUS AND METHODS
- Publication number 20210233887
- Publication date Jul 29, 2021
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION STRUCTURE
- Publication number 20200343211
- Publication date Oct 29, 2020
- MIKUNI ELECTRON CORPORATION
- SAKAE TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM-SHAPED FIRING MATERIAL AND FILM-SHAPED FIRING MATERIAL WITH SU...
- Publication number 20200277515
- Publication date Sep 3, 2020
- LINTEC CORPORATION
- Isao ICHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM, METHOD FOR PRODUCING SAME...
- Publication number 20200152352
- Publication date May 14, 2020
- DEXERIALS CORPORATION
- Tomoyuki ISHIMATSU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM
- Publication number 20200144214
- Publication date May 7, 2020
- DEXERIALS CORPORATION
- Yasushi AKUTSU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CONNECTION STRUCTURE
- Publication number 20200098718
- Publication date Mar 26, 2020
- Mikuni Electron Corporation
- SAKAE TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING MEMBER TO BE TREATED AND LAMINATE
- Publication number 20200009845
- Publication date Jan 9, 2020
- FUJIFILM CORPORATION
- Shotaro OGAWA
- B32 - LAYERED PRODUCTS
Information Patent Application
COVER FILM AND APPLICATION THEREOF
- Publication number 20190244927
- Publication date Aug 8, 2019
- TAIFLEX SCIENTIFIC CO., LTD.
- Sheng-Chin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE
- Publication number 20190237424
- Publication date Aug 1, 2019
- Mikuni Electron Corporation
- SAKAE TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOSCALE INTERCONNECT ARRAY FOR STACKED DIES
- Publication number 20190237437
- Publication date Aug 1, 2019
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM
- Publication number 20190139927
- Publication date May 9, 2019
- DEXERIALS CORPORATION
- Yasushi AKUTSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE TAPE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20180286737
- Publication date Oct 4, 2018
- DEXERIALS CORPORATION
- Hironobu Moriyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE DISPLAY PANELS AND THE MANUFACTURING METHODS THEREOF
- Publication number 20180277572
- Publication date Sep 27, 2018
- WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Yun YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM, METHOD FOR PRODUCING ANISOTROPIC CONDU...
- Publication number 20180218994
- Publication date Aug 2, 2018
- DEXERIALS CORPORATION
- Kouichi SATO
- B32 - LAYERED PRODUCTS
Information Patent Application
WAFER LEVEL FLAT NO-LEAD SEMICONDUCTOR PACKAGES AND METHODS OF MANU...
- Publication number 20180174881
- Publication date Jun 21, 2018
- Semiconductor Components Industries, LLC
- Darrell D. TRUHITTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nanoscale Interconnect Array for Stacked Dies
- Publication number 20170323867
- Publication date Nov 9, 2017
- Invensas Corporatoin
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND CONNECTION STRUCTURE
- Publication number 20170309590
- Publication date Oct 26, 2017
- DEXERIALS CORPORATION
- Reiji TSUKAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH DIELECTRIC OR ANISOTROPIC CONDUCTIVE (ACF) BUILDUP LAYER
- Publication number 20170179099
- Publication date Jun 22, 2017
- Intel Corporation
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND PRODUCTION METHOD OF THE SAME
- Publication number 20170107406
- Publication date Apr 20, 2017
- DEXERIALS CORPORATION
- Yuta ARAKI
- B32 - LAYERED PRODUCTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND PRODUCTION METHOD OF THE SAME
- Publication number 20170077056
- Publication date Mar 16, 2017
- DEXERIALS CORPORATION
- Reiji TSUKAO
- B32 - LAYERED PRODUCTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND PRODUCTION METHOD OF THE SAME
- Publication number 20170077055
- Publication date Mar 16, 2017
- DEXERIALS CORPORATION
- Yasushi AKUTSU
- B32 - LAYERED PRODUCTS
Information Patent Application
ADHESIVE COMPOSITION AND ADHESIVE FILM HAVING SAME, SUBSTRATE PROVI...
- Publication number 20160340558
- Publication date Nov 24, 2016
- TORAY INDUSTRIES, INC.
- Takuro ODA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

for holding or transferring the layer preform

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Low pressure sintering powder

Connection structure and manufacturing method therefor

Conductive film adhesive

Semiconductor device and method of manufacturing semiconductor device

Multilayer substrate

Anisotropic conductive film and method of producing the same

Connection structure

Anisotropic conductive film and method of producing the same

Thermocompression bond tips and related apparatus and methods

Method of applying conductive adhesive and manufacturing device usi...

Anisotropic conductive film and method of producing the same

Sintering materials and attachment methods using same

Method of transferring light emitting device for display and displa...

Anisotropic conductive film and method of producing the same

Method of surface-mounting components

Integrated fan-out package and method of fabricating the same

Film-shaped firing material and film-shaped firing material with su...

Anisotropic conductive film and production method of the same

Film-like adhesive and method for producing semiconductor package u...

Connection structure

Alignment method, method for connecting electronic component, metho...

Thermocompression bond tips and related apparatus and methods

Method of applying conductive adhesive and manufacturing device usi...

Low pressure sintering powder

Bump-forming film, semiconductor device and manufacturing method th...

Anisotropic electrically conductive film, method for producing same...

Connection structure

Integrated fan-out package and method of fabricating the same

Wafer level flat no-lead semiconductor packages and methods of manu...

Wafer level flat no-lead semiconductor packages and methods of manu...

Patents Applicationslast 30 patents

SINTERING FILM FRAMES AND RELATED METHODS

ADHESIVE TRANSFER FILM AND METHOD FOR MANUFACTURING POWER MODULE SU...

CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR

LIGHT EMITTING DEVICE FOR DISPLAY AND DISPLAY APPARATUS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

BONDING FILM, TAPE FOR WAFER PROCESSING, METHOD FOR PRODUCING BONDE...

CONNECTION STRUCTURE

METHOD OF APPLYING CONDUCTIVE ADHESIVE AND MANUFACTURING DEVICE USI...

THERMOCOMPRESSION BOND TIPS AND RELATED APPARATUS AND METHODS

CONNECTION STRUCTURE

FILM-SHAPED FIRING MATERIAL AND FILM-SHAPED FIRING MATERIAL WITH SU...

ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM, METHOD FOR PRODUCING SAME...

ANISOTROPIC CONDUCTIVE FILM

CONNECTION STRUCTURE

METHOD FOR MANUFACTURING MEMBER TO BE TREATED AND LAMINATE

COVER FILM AND APPLICATION THEREOF

CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE

NANOSCALE INTERCONNECT ARRAY FOR STACKED DIES

ANISOTROPIC CONDUCTIVE FILM

PROTECTIVE TAPE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

FLEXIBLE DISPLAY PANELS AND THE MANUFACTURING METHODS THEREOF

ANISOTROPIC CONDUCTIVE FILM, METHOD FOR PRODUCING ANISOTROPIC CONDU...

WAFER LEVEL FLAT NO-LEAD SEMICONDUCTOR PACKAGES AND METHODS OF MANU...

Nanoscale Interconnect Array for Stacked Dies

ANISOTROPIC CONDUCTIVE FILM AND CONNECTION STRUCTURE

PACKAGE WITH DIELECTRIC OR ANISOTROPIC CONDUCTIVE (ACF) BUILDUP LAYER

ANISOTROPIC CONDUCTIVE FILM AND PRODUCTION METHOD OF THE SAME

ANISOTROPIC CONDUCTIVE FILM AND PRODUCTION METHOD OF THE SAME

ANISOTROPIC CONDUCTIVE FILM AND PRODUCTION METHOD OF THE SAME

ADHESIVE COMPOSITION AND ADHESIVE FILM HAVING SAME, SUBSTRATE PROVI...