TREA

for immersion coating

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Industry

  • CPC
  • H01L2224/75183
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/75183for immersion coating
Industries

Patents Grantslast 30 patents

  • Information Patent Grant

    Semiconductor die dipping structure
    • Patent number 12,362,317
    • Issue date Jul 15, 2025
    • Taiwan Semiconductor Manufacturing Company, Ltd
    • Chi-Chun Peng
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Pick-and-place tool for packaging process
    • Patent number 9,966,357
    • Issue date May 8, 2018
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chien Ling Hwang
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Methods and apparatus for alignment in flip chip bonding
    • Patent number 8,664,039
    • Issue date Mar 4, 2014
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Ming-Chung Sung
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents