for monolithic microwave integrated circuit [MMIC]

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H01L2223/6683

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00

Current Industry

H01L2223/6683for monolithic microwave integrated circuit [MMIC]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Microwave integrated circuit
- Patent number 12,154,871
- Issue date Nov 26, 2024
- Sumitomo Electric Device Innovations, Inc.
- Kenshi Naito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wilkinson divider
- Patent number 12,142,808
- Issue date Nov 12, 2024
- Teknologian tutkimuskeskus VTT Oy
- Mikko Varonen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with interposer between integrated circuit dies
- Patent number 12,136,615
- Issue date Nov 5, 2024
- Qorvo US, Inc.
- Matthew Essar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device packages with internal moisture barriers
- Patent number 12,125,806
- Issue date Oct 22, 2024
- Wolfspeed, Inc.
- Arthur Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gallium nitride integrated circuits including non-gold-based metall...
- Patent number 12,087,713
- Issue date Sep 10, 2024
- Analog Devices, Inc.
- Daniel Piedra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic multi-I region diode limiters
- Patent number 12,080,708
- Issue date Sep 3, 2024
- MACOM Technology Solutions Holdings, Inc.
- James Joseph Brogle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package assemblies and processes for making
- Patent number 12,074,099
- Issue date Aug 27, 2024
- Materion Corporation
- Ramesh Kothandapani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integrations and methods of making thereof
- Patent number 12,068,231
- Issue date Aug 20, 2024
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency integrated circuit
- Patent number 12,040,290
- Issue date Jul 16, 2024
- National Tsing Hua University
- Rachit Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting device having a plurality of thermal sink layers an...
- Patent number 12,027,437
- Issue date Jul 2, 2024
- Northrop Grumman Systems Corporation
- Aaron Ashley Hathaway
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency power transistor and high-frequency power amplifier
- Patent number 11,984,413
- Issue date May 14, 2024
- FERDINAND-BRAUN-INSTITUT GGMBH, LEIBNIZ-INSTITUT FÜR HÖCHSTFREQUENZTECHNIK
- Olof Bengtsson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical etch heterolithic integrated circuit devices
- Patent number 11,978,808
- Issue date May 7, 2024
- MACOM Technology Solutions Holdings, Inc.
- Timothy Edward Boles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip suitable for 2.5D and 3D packaging integration a...
- Patent number 11,948,838
- Issue date Apr 2, 2024
- Qorvo US, Inc.
- Deep C. Dumka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component with lid to manage radiation feedback
- Patent number 11,948,893
- Issue date Apr 2, 2024
- Qorvo US, Inc.
- Zhunming Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for packaging an integrated circuit (IC) package with embedd...
- Patent number 11,929,300
- Issue date Mar 12, 2024
- Qorvo US, Inc.
- Kevin J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic microwave integrated circuit (MMIC) with embedded transm...
- Patent number 11,908,808
- Issue date Feb 20, 2024
- Qorvo US, Inc.
- Andrew Arthur Ketterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless module
- Patent number 11,901,317
- Issue date Feb 13, 2024
- Fujikura Ltd.
- Kohei Matsumaru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with isolation and/or protection structures
- Patent number 11,887,945
- Issue date Jan 30, 2024
- Wolfspeed, Inc.
- Lei Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and electronic device comprising a plurality of...
- Patent number 11,854,954
- Issue date Dec 26, 2023
- STMicroelectronics S.r.l.
- Angelo Scuderi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Group III nitride-based radio frequency amplifiers having back side...
- Patent number 11,837,559
- Issue date Dec 5, 2023
- Wolfspeed, Inc.
- Michael E. Watts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transmission line structures for millimeter wave signals
- Patent number 11,824,249
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jun-De Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with substrate integrated waveguide and waveguide inte...
- Patent number 11,824,019
- Issue date Nov 21, 2023
- Infineon Technologies AG
- Tuncay Erdoel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged integrated circuit device with built-in baluns
- Patent number 11,810,875
- Issue date Nov 7, 2023
- NXP B.V.
- Waqas Hassan Syed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,804,457
- Issue date Oct 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna-on-package integrated circuit device
- Patent number 11,799,190
- Issue date Oct 24, 2023
- Texas Instruments Incorporated
- Meysam Moallem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency transistor amplifiers having widened and/or asymmet...
- Patent number 11,791,389
- Issue date Oct 17, 2023
- Wolfspeed, Inc.
- Kyle Bothe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for a ground wire bonding attachment in MMIC d...
- Patent number 11,784,146
- Issue date Oct 10, 2023
- Scientific Components Corporation
- Fuad Haji Mokhtar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radar sensor, motor vehicle and method for producing a radar sensor
- Patent number 11,756,903
- Issue date Sep 12, 2023
- Audi AG
- Niels Koch
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Integrated circuit and electronic device comprising a plurality of...
- Patent number 11,742,311
- Issue date Aug 29, 2023
- STMicroelectronics S.r.l.
- Angelo Scuderi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device packages with internal moisture barriers
- Patent number 11,742,302
- Issue date Aug 29, 2023
- Wolfspeed, Inc.
- Arthur Pun
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED RESISTORS WITH INCREASED SHEET RESISTANCE FOR RF APPLICA...
- Publication number 20240429230
- Publication date Dec 26, 2024
- Wolfspeed, Inc.
- Matthew King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHICALLY INTEGRATED SEMICONDUCTOR DEVICE STRUCTURE
- Publication number 20240404967
- Publication date Dec 5, 2024
- ENKRIS SEMICONDUCTOR (WUXI), LTD.
- Guoqiao TAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240387417
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR IMPLEMENTING CAPACITORS IN SEMICONDUCTOR...
- Publication number 20240387353
- Publication date Nov 21, 2024
- Intel Corporation
- Michael Langenbuch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR MAKING A SECURED SUBSTRATE
- Publication number 20240355722
- Publication date Oct 24, 2024
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPERCONDUCTING DEVICE WITH MULTIPLE THERMAL SINKS
- Publication number 20240355701
- Publication date Oct 24, 2024
- AARON ASHLEY HATHAWAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND ASSEMBLIES FOR COOLING SEMICONDUCTOR DEVICES USING CARB...
- Publication number 20240258197
- Publication date Aug 1, 2024
- Qorvo US, Inc.
- Christo Bojkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT WITH LID TO MANAGE RADIATION FEEDBACK
- Publication number 20240250041
- Publication date Jul 25, 2024
- Qorvo US, Inc.
- Zhunming Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE PACKAGE WITH INTEGRAL ANTENNA MODULE AND SEM...
- Publication number 20240038691
- Publication date Feb 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Vijaylaxmi Gumaste Khanolkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240014151
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGE FOR MILLIMETRE WAVE AND THZ SIGNALS
- Publication number 20230387045
- Publication date Nov 30, 2023
- Teknologian Tutkimuskeskus VTT Oy
- Pekka Pursula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUP III NITRIDE-BASED MONOLITHIC MICROWAVE INTEGRATED CIRCUITS IN...
- Publication number 20230361059
- Publication date Nov 9, 2023
- Wolfspeed, Inc.
- Jeremy Fisher
- G11 - INFORMATION STORAGE
Information Patent Application
ELECTRONIC DEVICE PACKAGES WITH INTERNAL MOISTURE BARRIERS
- Publication number 20230352425
- Publication date Nov 2, 2023
- Wolfspeed, Inc.
- Arthur Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230343730
- Publication date Oct 26, 2023
- Mitsubishi Electric Corporation
- Shin Chaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND ELECTRONIC DEVICE COMPRISING A PLURALITY OF...
- Publication number 20230335524
- Publication date Oct 19, 2023
- STMicroelectronics S.r.l.
- Angelo SCUDERI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHIC MICROWAVE INTEGRATED CIRCUIT (MMIC) WITH EMBEDDED TRANSM...
- Publication number 20230253340
- Publication date Aug 10, 2023
- Qorvo US, Inc.
- Andrew Arthur Ketterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROWAVE INTEGRATED CIRCUITS INCLUDING GALLIUM-NITRIDE DEVICES ON...
- Publication number 20230207557
- Publication date Jun 29, 2023
- MACOM Technology Solutions Holdings, Inc.
- Douglas Carlson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROWAVE INTEGRATED CIRCUITS INCLUDING GALLIUM-NITRIDE DEVICES ON...
- Publication number 20230207558
- Publication date Jun 29, 2023
- MACOM Technology Solutions Holdings, Inc.
- Douglas Carlson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE WITH EMBEDDED HEAT SPREADER IN A RE...
- Publication number 20230207415
- Publication date Jun 29, 2023
- Qorvo US, Inc.
- Kevin J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT WITH LID TO MANAGE RADIATION FEEDBACK
- Publication number 20230197629
- Publication date Jun 22, 2023
- Qorvo US, Inc.
- Zhunming Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP SUITABLE FOR 2.5D AND 3D PACKAGING INTEGRATION A...
- Publication number 20230197517
- Publication date Jun 22, 2023
- Qorvo US, Inc.
- Deep C. Dumka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH INTERPOSER BETWEEN INTEGRATED CIRCUIT DIES
- Publication number 20230170340
- Publication date Jun 1, 2023
- Qorvo US, Inc.
- Matthew Essar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GALLIUM NITRIDE INTEGRATED CIRCUITS
- Publication number 20230154875
- Publication date May 18, 2023
- Analog Devices, Inc.
- Daniel Piedra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALUMINUM-BASED GALLIUM NITRIDE INTEGRATED CIRCUITS
- Publication number 20230133481
- Publication date May 4, 2023
- Analog Devices, Inc.
- Daniel Piedra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY INTEGRATED CIRCUIT
- Publication number 20230140612
- Publication date May 4, 2023
- National Tsing-Hua University
- RACHIT JOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSMISSION LINE STRUCTURES FOR MILLIMETER WAVE SIGNALS
- Publication number 20230089282
- Publication date Mar 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jun-De Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPENSATION OF TRAPPING IN FIELD EFFECT TRANSISTORS
- Publication number 20230040260
- Publication date Feb 9, 2023
- Wolfspeed, Inc.
- Young-Youl Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH SUBSTRATE INTEGRATED WAVEGUIDE AND WAVEGUIDE INTE...
- Publication number 20220415830
- Publication date Dec 29, 2022
- INFINEON TECHNOLOGIES AG
- Tuncay ERDOEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONICS PACKAGE ASSEMBLIES AND PROCESSES FOR MAKING
- Publication number 20220359351
- Publication date Nov 10, 2022
- MATERION CORPORATION
- Ramesh KOTHANDAPANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTEGRATED CIRCUIT DEVICE WITH BUILT-IN BALUNS
- Publication number 20220328432
- Publication date Oct 13, 2022
- NXP B.V.
- Waqas Hassan Syed
- H01 - BASIC ELECTRIC ELEMENTS

for monolithic microwave integrated circuit [MMIC]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Microwave integrated circuit

Wilkinson divider

Electronic package with interposer between integrated circuit dies

Electronic device packages with internal moisture barriers

Gallium nitride integrated circuits including non-gold-based metall...

Monolithic multi-I region diode limiters

Microelectronics package assemblies and processes for making

3D integrations and methods of making thereof

Radio frequency integrated circuit

Superconducting device having a plurality of thermal sink layers an...

High-frequency power transistor and high-frequency power amplifier

Vertical etch heterolithic integrated circuit devices

Semiconductor chip suitable for 2.5D and 3D packaging integration a...

Electronic component with lid to manage radiation feedback

Method for packaging an integrated circuit (IC) package with embedd...

Monolithic microwave integrated circuit (MMIC) with embedded transm...

Wireless module

Semiconductor device with isolation and/or protection structures

Integrated circuit and electronic device comprising a plurality of...

Group III nitride-based radio frequency amplifiers having back side...

Transmission line structures for millimeter wave signals

Chip package with substrate integrated waveguide and waveguide inte...

Packaged integrated circuit device with built-in baluns

Package structure and manufacturing method thereof

Antenna-on-package integrated circuit device

Radio frequency transistor amplifiers having widened and/or asymmet...

Method and apparatus for a ground wire bonding attachment in MMIC d...

Radar sensor, motor vehicle and method for producing a radar sensor

Integrated circuit and electronic device comprising a plurality of...

Electronic device packages with internal moisture barriers

Patents Applicationslast 30 patents

INTEGRATED RESISTORS WITH INCREASED SHEET RESISTANCE FOR RF APPLICA...

MONOLITHICALLY INTEGRATED SEMICONDUCTOR DEVICE STRUCTURE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

METHODS AND APPARATUS FOR IMPLEMENTING CAPACITORS IN SEMICONDUCTOR...

APPARATUS AND METHOD FOR MAKING A SECURED SUBSTRATE

SUPERCONDUCTING DEVICE WITH MULTIPLE THERMAL SINKS

METHODS AND ASSEMBLIES FOR COOLING SEMICONDUCTOR DEVICES USING CARB...

ELECTRONIC COMPONENT WITH LID TO MANAGE RADIATION FEEDBACK

MICROELECTRONIC DEVICE PACKAGE WITH INTEGRAL ANTENNA MODULE AND SEM...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

WAFER-LEVEL PACKAGE FOR MILLIMETRE WAVE AND THZ SIGNALS

GROUP III NITRIDE-BASED MONOLITHIC MICROWAVE INTEGRATED CIRCUITS IN...

ELECTRONIC DEVICE PACKAGES WITH INTERNAL MOISTURE BARRIERS

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT AND ELECTRONIC DEVICE COMPRISING A PLURALITY OF...

MONOLITHIC MICROWAVE INTEGRATED CIRCUIT (MMIC) WITH EMBEDDED TRANSM...

MICROWAVE INTEGRATED CIRCUITS INCLUDING GALLIUM-NITRIDE DEVICES ON...

MICROWAVE INTEGRATED CIRCUITS INCLUDING GALLIUM-NITRIDE DEVICES ON...

INTEGRATED CIRCUIT (IC) PACKAGE WITH EMBEDDED HEAT SPREADER IN A RE...

ELECTRONIC COMPONENT WITH LID TO MANAGE RADIATION FEEDBACK

SEMICONDUCTOR CHIP SUITABLE FOR 2.5D AND 3D PACKAGING INTEGRATION A...

ELECTRONIC PACKAGE WITH INTERPOSER BETWEEN INTEGRATED CIRCUIT DIES

GALLIUM NITRIDE INTEGRATED CIRCUITS

ALUMINUM-BASED GALLIUM NITRIDE INTEGRATED CIRCUITS

RADIO FREQUENCY INTEGRATED CIRCUIT

TRANSMISSION LINE STRUCTURES FOR MILLIMETER WAVE SIGNALS

COMPENSATION OF TRAPPING IN FIELD EFFECT TRANSISTORS

CHIP PACKAGE WITH SUBSTRATE INTEGRATED WAVEGUIDE AND WAVEGUIDE INTE...

MICROELECTRONICS PACKAGE ASSEMBLIES AND PROCESSES FOR MAKING

PACKAGED INTEGRATED CIRCUIT DEVICE WITH BUILT-IN BALUNS