for passive devices

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H01L2223/6661

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00

Current Industry

H01L2223/6661for passive devices

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device capable of realizing a wide band impedance mat...
- Patent number 12,094,840
- Issue date Sep 17, 2024
- Sumitomo Electric Device Innovations, Inc.
- Masahiro Hirayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module
- Patent number 12,093,766
- Issue date Sep 17, 2024
- Murata Manufacturing Co., Ltd.
- Hiroki Yoshimori
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for fabricating an integrated circuit device
- Patent number 12,087,712
- Issue date Sep 10, 2024
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 12,057,414
- Issue date Aug 6, 2024
- Mitsubishi Electric Corporation
- Yusuke Yamakaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance integrated RF passives using dual lithography process
- Patent number 12,002,745
- Issue date Jun 4, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency silicon on insulator structure with superior perfor...
- Patent number 11,942,360
- Issue date Mar 26, 2024
- GlobalWafers Co., Ltd.
- Michael R. Seacrist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module with high peak bandwidth I/O channels
- Patent number 11,901,956
- Issue date Feb 13, 2024
- L. Pierre de Rochemont
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency silicon on insulator wafer platform with superior p...
- Patent number 11,887,885
- Issue date Jan 30, 2024
- GlobalWafers Co., Ltd.
- Michael R. Seacrist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous integration of radio frequency transistor chiplets ha...
- Patent number 11,810,876
- Issue date Nov 7, 2023
- PseudolithIC, Inc.
- James Buckwalter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitors of semiconductor device capable of operating in high fre...
- Patent number 11,791,372
- Issue date Oct 17, 2023
- Samsung Electronics Co., Ltd.
- Jaeho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit, front-end module, and communication apparatus
- Patent number 11,764,172
- Issue date Sep 19, 2023
- Murata Manufacturing Co., Ltd.
- Hiroshi Nishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating an integrated circuit device
- Patent number 11,637,080
- Issue date Apr 25, 2023
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,626,374
- Issue date Apr 11, 2023
- Renesas Electronics Corporation
- Tatsuaki Tsukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package architecture with tunable magnetic properties for embedded...
- Patent number 11,574,993
- Issue date Feb 7, 2023
- Intel Corporation
- Rengarajan Shanmugam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device capable of realizing a wide band impedance mat...
- Patent number 11,469,192
- Issue date Oct 11, 2022
- Sumitomo Electric Device Innovations, Inc.
- Masahiro Hirayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor and transmission line with air gap
- Patent number 11,469,189
- Issue date Oct 11, 2022
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor die with output bondpad at the input side of the die, an...
- Patent number 11,444,044
- Issue date Sep 13, 2022
- NXP USA, INC.
- Ibrahim Khalil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier packages containing multi-path integrated passive d...
- Patent number 11,349,438
- Issue date May 31, 2022
- NXP USA, INC.
- Yun Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic control device
- Patent number 11,330,704
- Issue date May 10, 2022
- HITACHI ASTEMO, LTD.
- Masahiro Toyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple band multiple mode transceiver front end flip-chip archite...
- Patent number 11,309,926
- Issue date Apr 19, 2022
- Skyworks Solutions, Inc.
- Lisette L. Zhang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device
- Patent number 11,276,626
- Issue date Mar 15, 2022
- Mitsubishi Electric Corporation
- Yutaro Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrally-formed multiple-path power amplifier with on-die combini...
- Patent number 11,277,098
- Issue date Mar 15, 2022
- NXP USA, INC.
- Xavier Hue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switch IC, front-end module, and communication apparatus
- Patent number 11,270,961
- Issue date Mar 8, 2022
- Murata Manufacturing Co., Ltd.
- Hiroshi Nishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module with high peak bandwidth I/O channels
- Patent number 11,239,922
- Issue date Feb 1, 2022
- L. Pierre de Rochemont
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance integrated RF passives using dual lithography process
- Patent number 11,227,825
- Issue date Jan 18, 2022
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for tunable filtering
- Patent number 11,201,602
- Issue date Dec 14, 2021
- Analog Devices, Inc.
- Ekrem Oran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic microwave integrated circuit (MMIC) cooling structure
- Patent number 11,152,279
- Issue date Oct 19, 2021
- Raytheon Company
- Susan C. Trulli
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Integrated circuit device
- Patent number 11,127,700
- Issue date Sep 21, 2021
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for forming backside die planar devices and sa...
- Patent number 11,037,896
- Issue date Jun 15, 2021
- Intel Corporation
- Kevin J. Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power integrated module
- Patent number 11,024,588
- Issue date Jun 1, 2021
- Delta Electronics (Shanghai) Co., Ltd.
- Jianhong Zeng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Partial Shielding with Embedded...
- Publication number 20240321768
- Publication date Sep 26, 2024
- STATS ChipPAC Pte Ltd.
- YongMoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL (MIM) CAPACITOR INTERCONNECT FOR HIGH-QUALITY...
- Publication number 20240321724
- Publication date Sep 26, 2024
- QUALCOMM Incorporated
- Doosoub SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO REDUCE IMPEDANCE DISCONTINUITIES AND CROSS...
- Publication number 20240274521
- Publication date Aug 15, 2024
- Intel Corporation
- Chenghai Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE WITH HIGH PEAK BANDWIDTH I/O CHANNELS
- Publication number 20240223283
- Publication date Jul 4, 2024
- L. Pierre de Rochemont
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240194617
- Publication date Jun 13, 2024
- Mitsubishi Electric Corporation
- Yusuke YAMAKAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND ELECTRONIC APPARATUS
- Publication number 20240145415
- Publication date May 2, 2024
- PanelSemi Corporation
- HSIEN-TE CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITORS OF SEMICONDUCTOR DEVICE CAPABLE OF OPERATING IN HIGH FRE...
- Publication number 20230420487
- Publication date Dec 28, 2023
- Samsung Electronics Co., Ltd.
- Jaeho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT, FRONT-END MODULE, AND COMMUNICATION APPARATUS
- Publication number 20230387048
- Publication date Nov 30, 2023
- Murata Manufacturing Co., Ltd.
- Hiroshi NISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
- Publication number 20230298959
- Publication date Sep 21, 2023
- MURATA MANUFACTURING CO., LTD.
- Hiroyuki KANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING HIGH-FREQUENCY DEVICE
- Publication number 20230290750
- Publication date Sep 14, 2023
- Sumitomo Electric Industries, Ltd.
- Tatsuya HASHINAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY SILICON ON INSULATOR STRUCTURE WITH SUPERIOR PERFOR...
- Publication number 20230215759
- Publication date Jul 6, 2023
- GLOBALWAFERS CO., LTD.
- Michael R. Seacrist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE
- Publication number 20230187388
- Publication date Jun 15, 2023
- Murata Manufacturing Co., Ltd.
- Shota HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230163085
- Publication date May 25, 2023
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Ayuhiko SAITOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220415833
- Publication date Dec 29, 2022
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Masahiro HIRAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE WITH HIGH PEAK BANDWIDTH I/O CHANNELS
- Publication number 20220209871
- Publication date Jun 30, 2022
- L. Pierre de Rochemont
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT, FRONT-END MODULE, AND COMMUNICATION APPARATUS
- Publication number 20220148986
- Publication date May 12, 2022
- Murata Manufacturing Co., Ltd.
- Hiroshi NISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE INTEGRATED RF PASSIVES USING DUAL LITHOGRAPHY PROCESS
- Publication number 20220102261
- Publication date Mar 31, 2022
- Intel Corporation
- Adel A. ELSHERBINI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING AN INTEGRATED CIRCUIT DEVICE
- Publication number 20210375800
- Publication date Dec 2, 2021
- UNITED MICROELECTRONICS CORP.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE
- Publication number 20210350196
- Publication date Nov 11, 2021
- Murata Manufacturing Co., Ltd.
- Hiroki YOSHIMORI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CAPACITORS OF SEMICONDUCTOR DEVICE CAPABLE OF OPERATING IN HIGH FRE...
- Publication number 20210328004
- Publication date Oct 21, 2021
- Samsung Electronics Co., Ltd.
- Jaeho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR DIE WITH OUTPUT BONDPAD AT THE INPUT SIDE OF THE DIE, AN...
- Publication number 20210202408
- Publication date Jul 1, 2021
- NXP USA, Inc.
- Ibrahim Khalil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER PACKAGES CONTAINING MULTI-PATH INTEGRATED PASSIVE D...
- Publication number 20210203278
- Publication date Jul 1, 2021
- NXP USA, Inc.
- Yun Wei
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210028132
- Publication date Jan 28, 2021
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Masahiro HIRAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210005535
- Publication date Jan 7, 2021
- Mitsubishi Electric Corporation
- Yutaro YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER INTEGRATED MODULE
- Publication number 20200303326
- Publication date Sep 24, 2020
- DELTA ELECTRONICS (SHANGHAI) CO., LTD.
- Jianhong ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE WITH TUNABLE MAGNETIC PROPERTIES FOR EMBEDDED...
- Publication number 20200258975
- Publication date Aug 13, 2020
- Intel Corporation
- Rengarajan SHANMUGAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRALLY-FORMED MULTIPLE-PATH POWER AMPLIFIER WITH ON-DIE COMBINI...
- Publication number 20200186097
- Publication date Jun 11, 2020
- NXP USA, Inc.
- Xavier Hue
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHOD FOR MINIMIZING DISTORTION OF A SIGNAL IN A RADIOFREQUENCY CI...
- Publication number 20200169222
- Publication date May 28, 2020
- SOITEC
- Marcel Broekaart
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
PACKAGE STRUCTURE OF A FOLDING MAGNETIC COUPLING ISOLATOR, LEADFRAM...
- Publication number 20200091049
- Publication date Mar 19, 2020
- LITE-ON SINGAPORE PTE. LTD.
- You-Fa WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE WITH HIGH PEAK BANDWIDTH I/O CHANNELS
- Publication number 20200092014
- Publication date Mar 19, 2020
- L. Pierre de Rochemont
- H03 - BASIC ELECTRONIC CIRCUITRY

for passive devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device capable of realizing a wide band impedance mat...

Module

Method for fabricating an integrated circuit device

Printed circuit board

High performance integrated RF passives using dual lithography process

Radio frequency silicon on insulator structure with superior perfor...

Module with high peak bandwidth I/O channels

Radio frequency silicon on insulator wafer platform with superior p...

Heterogeneous integration of radio frequency transistor chiplets ha...

Capacitors of semiconductor device capable of operating in high fre...

Integrated circuit, front-end module, and communication apparatus

Method for fabricating an integrated circuit device

Semiconductor device

Package architecture with tunable magnetic properties for embedded...

Semiconductor device capable of realizing a wide band impedance mat...

Inductor and transmission line with air gap

Transistor die with output bondpad at the input side of the die, an...

Power amplifier packages containing multi-path integrated passive d...

Electronic control device

Multiple band multiple mode transceiver front end flip-chip archite...

Semiconductor device

Integrally-formed multiple-path power amplifier with on-die combini...

Switch IC, front-end module, and communication apparatus

Module with high peak bandwidth I/O channels

High performance integrated RF passives using dual lithography process

Apparatus and methods for tunable filtering

Monolithic microwave integrated circuit (MMIC) cooling structure

Integrated circuit device

Method and apparatus for forming backside die planar devices and sa...

Power integrated module

Patents Applicationslast 30 patents

Semiconductor Device and Method of Partial Shielding with Embedded...

METAL-INSULATOR-METAL (MIM) CAPACITOR INTERCONNECT FOR HIGH-QUALITY...

METHODS AND APPARATUS TO REDUCE IMPEDANCE DISCONTINUITIES AND CROSS...

MODULE WITH HIGH PEAK BANDWIDTH I/O CHANNELS

PRINTED CIRCUIT BOARD

ELECTRONIC DEVICE AND ELECTRONIC APPARATUS

CAPACITORS OF SEMICONDUCTOR DEVICE CAPABLE OF OPERATING IN HIGH FRE...

INTEGRATED CIRCUIT, FRONT-END MODULE, AND COMMUNICATION APPARATUS

HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE

METHOD OF MANUFACTURING HIGH-FREQUENCY DEVICE

RADIO FREQUENCY SILICON ON INSULATOR STRUCTURE WITH SUPERIOR PERFOR...

MODULE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

MODULE WITH HIGH PEAK BANDWIDTH I/O CHANNELS

INTEGRATED CIRCUIT, FRONT-END MODULE, AND COMMUNICATION APPARATUS

HIGH PERFORMANCE INTEGRATED RF PASSIVES USING DUAL LITHOGRAPHY PROCESS

METHOD FOR FABRICATING AN INTEGRATED CIRCUIT DEVICE

MODULE

CAPACITORS OF SEMICONDUCTOR DEVICE CAPABLE OF OPERATING IN HIGH FRE...

TRANSISTOR DIE WITH OUTPUT BONDPAD AT THE INPUT SIDE OF THE DIE, AN...

POWER AMPLIFIER PACKAGES CONTAINING MULTI-PATH INTEGRATED PASSIVE D...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

POWER INTEGRATED MODULE

PACKAGE ARCHITECTURE WITH TUNABLE MAGNETIC PROPERTIES FOR EMBEDDED...

INTEGRALLY-FORMED MULTIPLE-PATH POWER AMPLIFIER WITH ON-DIE COMBINI...

METHOD FOR MINIMIZING DISTORTION OF A SIGNAL IN A RADIOFREQUENCY CI...

PACKAGE STRUCTURE OF A FOLDING MAGNETIC COUPLING ISOLATOR, LEADFRAM...

MODULE WITH HIGH PEAK BANDWIDTH I/O CHANNELS