for positioning, orientation or alignment

Industry

CPC
H01L21/68

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/68for positioning, orientation or alignment

Industries

Patents Grantslast 30 patents

Information Patent Grant
Integrated fan-out package with 3D magnetic core inductor
- Patent number 12,272,637
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacking structure, package structure and method of fabricating the...
- Patent number 12,272,674
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-bonding machine
- Patent number 12,272,584
- Issue date Apr 8, 2025
- SHENZHEN XINYICHANG TECHNOLOGY CO., LTD
- Xinrong Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer chuck structure with holes in upper surface to improve temper...
- Patent number 12,272,585
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Jung Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wafer clamping method and semiconductor manufacturing apparatus
- Patent number 12,272,588
- Issue date Apr 8, 2025
- NISSIN ION EQUIPMENT CO., LTD.
- Takayuki Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ejector pin device for chip packaging
- Patent number 12,272,589
- Issue date Apr 8, 2025
- CHIPMORE TECHNOLOGY CORPORATION LIMITED
- Chaochao Jin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Inspection apparatus
- Patent number 12,270,790
- Issue date Apr 8, 2025
- Disco Corporation
- Naoki Murazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate supporting plate, thin film deposition apparatus includin...
- Patent number 12,270,118
- Issue date Apr 8, 2025
- ASM IP Holding B.V.
- Yong Min Yoo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate retaining apparatus, system including the apparatus, and...
- Patent number 12,270,106
- Issue date Apr 8, 2025
- ASM IP Holding B.V.
- Shiva K. T. Rajavelu Muralidhar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Temperature control system with circulating fluid
- Patent number 12,271,157
- Issue date Apr 8, 2025
- Kelk Ltd.
- Kazuhiro Mimura
- G05 - CONTROLLING REGULATING
Information Patent Grant
Process control enabled VDC sensor for plasma process
- Patent number 12,272,520
- Issue date Apr 8, 2025
- Tokyo Electron Limited
- Merritt Funk
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing apparatus
- Patent number 12,272,590
- Issue date Apr 8, 2025
- Tokyo Electron Limited
- Junnosuke Taguchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Friction stir welding in semiconductor manufacturing applications
- Patent number 12,272,591
- Issue date Apr 8, 2025
- Lam Research Corporation
- Nick Ray Linebarger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Etching method and etching apparatus
- Patent number 12,272,541
- Issue date Apr 8, 2025
- Tokyo Electron Limited
- Naoki Shindo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system and method for providing a fiber optic coupler
- Patent number 12,272,587
- Issue date Apr 8, 2025
- JABIL INC.
- Jeroen Bosboom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor devices in a layer of epitaxial si...
- Patent number 12,272,738
- Issue date Apr 8, 2025
- Infineon Technologies AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly apparatus
- Patent number 12,272,760
- Issue date Apr 8, 2025
- LG Electronics Inc.
- Junghun Rho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stage and plasma processing apparatus
- Patent number 12,272,528
- Issue date Apr 8, 2025
- Tokyo Electron Limited
- Yasuharu Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for treating substrate and method for treating substrate
- Patent number 12,272,544
- Issue date Apr 8, 2025
- Semes Co., Ltd.
- Do Gyeong Ha
- B08 - CLEANING
Information Patent Grant
3D semiconductor memory device and structure with memory and metal...
- Patent number 12,272,586
- Issue date Apr 8, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Holding device and method of manufacturing holding device
- Patent number 12,273,965
- Issue date Apr 8, 2025
- NITERRA CO., LTD.
- Ryunosuke Sakamaki
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Apparatus for cleaning semiconductor silicon wafer and method for c...
- Patent number 12,272,542
- Issue date Apr 8, 2025
- Shin-Etsu Handotai Co., Ltd.
- Kensaku Igarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced footprint wafer handling platform
- Patent number 12,272,583
- Issue date Apr 8, 2025
- Lam Research Corporation
- Christopher W. Burkhart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked dies and methods for forming bonded structures
- Patent number 12,266,650
- Issue date Apr 1, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manipulator
- Patent number 12,263,574
- Issue date Apr 1, 2025
- BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.
- Hao Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive tapes for receiving discrete components
- Patent number 12,266,558
- Issue date Apr 1, 2025
- KULICKE & SOFFA NETHERLANDS B.V.
- Val Marinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid supply nozzle for semiconductor substrate treatment and semic...
- Patent number 12,266,549
- Issue date Apr 1, 2025
- APET CO., LTD.
- Tae Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer placement table
- Patent number 12,266,557
- Issue date Apr 1, 2025
- NGK Insulators, Ltd.
- Tatsuya Kuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for treating substrate and method of coupling support unit
- Patent number 12,266,561
- Issue date Apr 1, 2025
- Semes Co., Ltd.
- Sang Min Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated devices in semiconductor packages and methods of forming...
- Patent number 12,266,619
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS AND METHODS FOR MAINTAINING VACUUM CHECKING FORCE ON SEMI...
- Publication number 20250118590
- Publication date Apr 10, 2025
- Axcelis Technologies, Inc.
- Michael F. Leahy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING CHAMBER WITH RF RETURN PATH
- Publication number 20250118593
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Vellaichamy NAGAPPAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
RF TUNING SYSTEMS INCLUDING TUNING CIRCUITS HAVING IMPEDANCES FOR S...
- Publication number 20250118535
- Publication date Apr 10, 2025
- LAM RESEARCH CORPORATION
- David French
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE TRANSFER DEVICE, NOTCH POSITION CORRECTION METHOD, SUBSTR...
- Publication number 20250118584
- Publication date Apr 10, 2025
- ASM IP HOLDING B.V.
- Masashi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATICALLY SECURED SUBSTRATE SUPPORT ASSEMBLY
- Publication number 20250118586
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Arvinder Manmohan Singh Chadha
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR DIVIDING WAFER
- Publication number 20250118601
- Publication date Apr 10, 2025
- Disco Corporation
- Shinya ARUGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20250118642
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hsuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250118678
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE SUPPORT ASSEMBLY WITH DIELETRIC COOLING PLATE
- Publication number 20250119076
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Arvinder Manmohan Singh Chadha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEALING RING
- Publication number 20250116332
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Jihwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE PROCESSING METHOD
- Publication number 20250118561
- Publication date Apr 10, 2025
- Disco Corporation
- Younsuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PEDESTAL HEATER WITH SUBSTRATE TEMPERATURE MEASUREMENT SYSTEM
- Publication number 20250118578
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Ajith Karonnan Ramapurath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CALIBRATION HARDWARE FOR ION IMPLANTER
- Publication number 20250118585
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lung-Yin Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIMULTANEOUS BONDING APPROACH FOR HIGH QUALITY WAFER STACKING APPLI...
- Publication number 20250118587
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE TRANSFER METHOD AND APPARATUS FOR MULTI-CHIP MODULE
- Publication number 20250118589
- Publication date Apr 10, 2025
- Silicon Box, Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPACT DYNAMIC LEVELING LIFT MECHANISM
- Publication number 20250115999
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Tuan Anh Nguyen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SYSTEM AND METHODS FOR A MULTI-STACK ARCHITECTURE
- Publication number 20250118677
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Jin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR CHIP
- Publication number 20250118565
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Hyunho Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANNEAL CHAMBER
- Publication number 20250118572
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Paul R. McHugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES
- Publication number 20250118574
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Jeonggi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHAMBER KITS, PROCESSING CHAMBERS, AND METHODS FOR GAS ACTIVATION I...
- Publication number 20250118576
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Chen-Ying WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE, MANUFACTURING EQUIPMENT OF DISPLAY DEVICE, AND MANU...
- Publication number 20250118588
- Publication date Apr 10, 2025
- SAMSUNG DISPLAY CO., LTD.
- Dong Jun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20250118591
- Publication date Apr 10, 2025
- Kokusai Electric Corporation
- Naofumi OHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES FOR BACKSIDE WAFER PROCESSING WITH EDGE-ONLY WAFER CONTACT
- Publication number 20250118592
- Publication date Apr 10, 2025
- LAM RESEARCH CORPORATION
- Nick Ray Linebarger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARCHITECTURES FOR FACILITATING BONDING IN WAFER-LEVEL SELECTIVE TRA...
- Publication number 20250112077
- Publication date Apr 3, 2025
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VACUUM WAFER CHUCK FOR MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20250112081
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Chien-Fa LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-MATERIAL CHUCK
- Publication number 20250112083
- Publication date Apr 3, 2025
- TOKYO ELECTRON LIMITED
- Christopher NETZBAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE-GRAIN INTEGRATION OF RADIO FREQUENCY ANTENNAS, INTERCONNECTS,...
- Publication number 20250112188
- Publication date Apr 3, 2025
- Intel Corporation
- Georgios C. Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVAL OF DEFECTIVE DIES ON DONOR WAFERS FOR SELECTIVE LAYER TRANSFER
- Publication number 20250112067
- Publication date Apr 3, 2025
- Intel Corporation
- Thomas L. Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANISM FOR FINE ADJUSTING AN ANGLE OF A SEMICONDUCTOR WAFER FIXTURE
- Publication number 20250112084
- Publication date Apr 3, 2025
- CHENG MEI INSTRUMENT TECHNOLOGY CO., LTD.
- Te-Chun CHEN
- H01 - BASIC ELECTRIC ELEMENTS

for positioning, orientation or alignment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated fan-out package with 3D magnetic core inductor

Stacking structure, package structure and method of fabricating the...

Die-bonding machine

Wafer chuck structure with holes in upper surface to improve temper...

Wafer clamping method and semiconductor manufacturing apparatus

Ejector pin device for chip packaging

Inspection apparatus

Substrate supporting plate, thin film deposition apparatus includin...

Substrate retaining apparatus, system including the apparatus, and...

Temperature control system with circulating fluid

Process control enabled VDC sensor for plasma process

Substrate processing apparatus

Friction stir welding in semiconductor manufacturing applications

Etching method and etching apparatus

Apparatus, system and method for providing a fiber optic coupler

Methods of forming semiconductor devices in a layer of epitaxial si...

Assembly apparatus

Stage and plasma processing apparatus

Apparatus for treating substrate and method for treating substrate

3D semiconductor memory device and structure with memory and metal...

Holding device and method of manufacturing holding device

Apparatus for cleaning semiconductor silicon wafer and method for c...

Reduced footprint wafer handling platform

Stacked dies and methods for forming bonded structures

Manipulator

Adhesive tapes for receiving discrete components

Fluid supply nozzle for semiconductor substrate treatment and semic...

Wafer placement table

Apparatus for treating substrate and method of coupling support unit

Integrated devices in semiconductor packages and methods of forming...

Patents Applicationslast 30 patents

APPARATUS AND METHODS FOR MAINTAINING VACUUM CHECKING FORCE ON SEMI...

PROCESSING CHAMBER WITH RF RETURN PATH

RF TUNING SYSTEMS INCLUDING TUNING CIRCUITS HAVING IMPEDANCES FOR S...

SUBSTRATE TRANSFER DEVICE, NOTCH POSITION CORRECTION METHOD, SUBSTR...

ELECTROSTATICALLY SECURED SUBSTRATE SUPPORT ASSEMBLY

METHOD AND APPARATUS FOR DIVIDING WAFER

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SUBSTRATE SUPPORT ASSEMBLY WITH DIELETRIC COOLING PLATE

SEALING RING

WORKPIECE PROCESSING METHOD

PEDESTAL HEATER WITH SUBSTRATE TEMPERATURE MEASUREMENT SYSTEM

CALIBRATION HARDWARE FOR ION IMPLANTER

SIMULTANEOUS BONDING APPROACH FOR HIGH QUALITY WAFER STACKING APPLI...

DIE TRANSFER METHOD AND APPARATUS FOR MULTI-CHIP MODULE

COMPACT DYNAMIC LEVELING LIFT MECHANISM

SYSTEM AND METHODS FOR A MULTI-STACK ARCHITECTURE

METHOD OF MANUFACTURING SEMICONDUCTOR CHIP

ANNEAL CHAMBER

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES

CHAMBER KITS, PROCESSING CHAMBERS, AND METHODS FOR GAS ACTIVATION I...

DISPLAY DEVICE, MANUFACTURING EQUIPMENT OF DISPLAY DEVICE, AND MANU...

METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...

APPARATUSES FOR BACKSIDE WAFER PROCESSING WITH EDGE-ONLY WAFER CONTACT

ARCHITECTURES FOR FACILITATING BONDING IN WAFER-LEVEL SELECTIVE TRA...

VACUUM WAFER CHUCK FOR MANUFACTURING SEMICONDUCTOR DEVICES

MULTI-MATERIAL CHUCK

FINE-GRAIN INTEGRATION OF RADIO FREQUENCY ANTENNAS, INTERCONNECTS,...

REMOVAL OF DEFECTIVE DIES ON DONOR WAFERS FOR SELECTIVE LAYER TRANSFER

MECHANISM FOR FINE ADJUSTING AN ANGLE OF A SEMICONDUCTOR WAFER FIXTURE