for positioning, orientation or alignment

Industry

CPC
H01L21/68

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/68for positioning, orientation or alignment

Industries

Patents Grantslast 30 patents

Information Patent Grant
Substrate processing apparatus, film formation unit, substrate proc...
- Patent number 11,986,853
- Issue date May 21, 2024
- SCREEN Holdings Co., Ltd.
- Yuji Tanaka
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Wafer support pin lifting device
- Patent number 11,990,363
- Issue date May 21, 2024
- PIOTECH INC.
- Dezan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine pitch BVA using reconstituted wafer with area array accessible...
- Patent number 11,990,382
- Issue date May 21, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package and method of manufacture
- Patent number 11,990,443
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite sintered body, electrostatic chuck member, electrostatic...
- Patent number 11,990,362
- Issue date May 21, 2024
- Sumitomo Osaka Cement Co., Ltd.
- Nobuhiro Hidaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fast response pedestal assembly for selective preclean
- Patent number 11,990,321
- Issue date May 21, 2024
- Applied Materials, Inc.
- Lara Hawrylchak
- B08 - CLEANING
Information Patent Grant
Ceramic susceptor
- Patent number 11,990,322
- Issue date May 21, 2024
- MiCo Ceramics Ltd.
- Haneum Bae
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Package structure and method of forming the same
- Patent number 11,990,454
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass and wafer inspection system and a method of use thereof
- Patent number 11,987,884
- Issue date May 21, 2024
- JNK TECH
- Youngjin Choi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electrostatic chuck, etching apparatus, and method of manufacturing...
- Patent number 11,990,361
- Issue date May 21, 2024
- Samsung Display Co., Ltd.
- Hee Sun Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck (ESC) pedestal voltage isolation
- Patent number 11,990,360
- Issue date May 21, 2024
- Lam Research Corporation
- Miguel Benjamin Vasquez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing optoelectronic semiconductor devices and optoe...
- Patent number 11,990,574
- Issue date May 21, 2024
- Osram Opto Semiconductors GmbH
- Choo Kean Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate transport apparatus, substrate transport method, and subs...
- Patent number 11,990,357
- Issue date May 21, 2024
- Tokyo Electron Limited
- Tatsuo Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate pedestal for improved substrate processing
- Patent number 11,984,305
- Issue date May 14, 2024
- Applied Materials, Inc.
- Viren Kalsekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and driving method thereof
- Patent number 11,984,345
- Issue date May 14, 2024
- Samsung Electronics Co., Ltd.
- Ilyoung Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Measurement device and method for semiconductor structure
- Patent number 11,984,366
- Issue date May 14, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Xin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming same
- Patent number 11,984,422
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge ring, substrate support, substrate processing apparatus and me...
- Patent number 11,984,301
- Issue date May 14, 2024
- Tokyo Electron Limited
- Takashi Taira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Info structure with copper pillar having reversed profile
- Patent number 11,984,342
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for semiconductor processing
- Patent number 11,984,343
- Issue date May 14, 2024
- Applied Materials, Inc.
- Joseph Yudovsky
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Lift apparatus and substrate processing apparatus including the same
- Patent number 11,984,344
- Issue date May 14, 2024
- Samsung Electronics Co., Ltd.
- Byeongsang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus and semiconductor manufacturi...
- Patent number 11,984,328
- Issue date May 14, 2024
- Kioxia Corporation
- Sho Kawadahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Teaching method
- Patent number 11,984,340
- Issue date May 14, 2024
- Tokyo Electron Limited
- Takehiro Shindo
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Component-manufacturing tool and component-manufacturing method
- Patent number 11,984,341
- Issue date May 14, 2024
- Mitsui Chemicals Tohcello, Inc.
- Eiji Hayashishita
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Susceptor, epitaxial growth apparatus, method of producing epitaxia...
- Patent number 11,984,346
- Issue date May 14, 2024
- Sumco Corporation
- Kazuhiro Narahara
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method for depositing an epitaxial layer on a front side of a semic...
- Patent number 11,982,015
- Issue date May 14, 2024
- Siltronic AG
- Joerg Haberecht
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate support with improved process uniformity
- Patent number 11,984,296
- Issue date May 14, 2024
- Lam Research Corporation
- Fangli Hao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EFEM robot auto teaching methodology
- Patent number 11,984,331
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Fa Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Purge ring for pedestal assembly
- Patent number 11,976,363
- Issue date May 7, 2024
- Applied Materials, Inc.
- Muhannad Mustafa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing system and substrate processing method, and de...
- Patent number 11,977,339
- Issue date May 7, 2024
- Nikon Corporation
- Yuichi Shibazaki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM
- Publication number 20240162054
- Publication date May 16, 2024
- SCREEN Holdings Co., Ltd.
- Noritake SUMI
- B08 - CLEANING
Information Patent Application
SEMICONDUCTOR CHIP SPLITTING METHOD USING A LASER AND SEMICONDUCTOR...
- Publication number 20240157481
- Publication date May 16, 2024
- Samsung Electronics Co., Ltd.
- YEONGKWON KO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING DEVICE, BONDING SYSTEM, AND BONDING METHOD
- Publication number 20240162063
- Publication date May 16, 2024
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TRANSFER UNIT AND SUBSTRATE TREATMENT APPARATUS INCLUDING...
- Publication number 20240162070
- Publication date May 16, 2024
- SEMES CO., LTD.
- Nam Ki HONG
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
SYSTEMS AND APPARATUS FOR SEMICONDUCTOR EQUIPMENT
- Publication number 20240162077
- Publication date May 16, 2024
- ASM IP HOLDING B.V.
- Rajmohan Muthaiah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240162187
- Publication date May 16, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Ronald Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOOLS AND METHODS FOR SUBTRACTIVE METAL PATTERNING
- Publication number 20240162058
- Publication date May 16, 2024
- Intel Corporation
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING APPARATUS, MOUNTING METHOD, AND RECORDING MEDIUM
- Publication number 20240162073
- Publication date May 16, 2024
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE SUPPORTING PLATE, THIN FILM DEPOSITION APPARATUS INCLUDIN...
- Publication number 20240158942
- Publication date May 16, 2024
- ASM IP HOLDING B.V.
- Yong Min Yoo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Methods And Systems For Measurement Of Semiconductor Structures Wit...
- Publication number 20240162074
- Publication date May 16, 2024
- KLA Corporation
- Phalguna Rachinayani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240162159
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR ACHIEVING PEAK ION ENERGY ENHANCEMENT WITH...
- Publication number 20240162005
- Publication date May 16, 2024
- LAM RESEARCH CORPORATION
- Juline Shoeb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD
- Publication number 20240162034
- Publication date May 16, 2024
- SCREEN Holdings Co., Ltd.
- Noritake SUMI
- B08 - CLEANING
Information Patent Application
APPARATUS FOR TREATING SUBSTRATE AND RELATED MANUFACTURING METHOD
- Publication number 20240162055
- Publication date May 16, 2024
- SEMES CO., LTD.
- Young Jun SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POROUS CHAMBER COMPONENT COATING AUGMENTED WITH COLLOIDS
- Publication number 20240158944
- Publication date May 16, 2024
- Applied Materials, Inc.
- Joseph Frederick Behnke
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT APPARATUS
- Publication number 20240162032
- Publication date May 16, 2024
- SEMES CO., LTD.
- Si Nae SONG
- B08 - CLEANING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND SU...
- Publication number 20240162052
- Publication date May 16, 2024
- TOKYO ELECTRON LIMITED
- Takanori OBARU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOWED SUBSTRATE CLAMPING METHOD, APPARATUS, AND SYSTEM
- Publication number 20240162066
- Publication date May 16, 2024
- Arvinder S. CHADHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE CARRYING CONTAINER WITH SUPPORT WALL FORMED...
- Publication number 20240162068
- Publication date May 16, 2024
- Entegris, Inc.
- Jack Dunlope
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE SUPPORT AND SUBSTRATE PROCESSING DEVICE
- Publication number 20240162075
- Publication date May 16, 2024
- TOKYO ELECTRON LIMITED
- Akira NAGAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VACUUM PROCESSING APPARATUS AND TILT ADJUSTMENT METHOD
- Publication number 20240162076
- Publication date May 16, 2024
- Tokyo Electron Limited
- Kiyoshi MORI
- G05 - CONTROLLING REGULATING
Information Patent Application
METHOD FOR FABRICATING A CHIP PACKAGE
- Publication number 20240153769
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING MATERIAL APPLICATION APPARATUS AND BONDING MATERIAL APPLICA...
- Publication number 20240153907
- Publication date May 9, 2024
- Fuji Electric Co., Ltd.
- Narumi SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYMER FILM RELEASING METHOD, METHOD FOR MANUFACTURING ELECTRONIC...
- Publication number 20240153785
- Publication date May 9, 2024
- Toyobo Co., Ltd.
- Tetsuo OKUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS INCLUDING ARRAYS OF PICK-UP HEADS AND BONDING HEADS AND A...
- Publication number 20240153798
- Publication date May 9, 2024
- Canon Kabushiki Kaisha
- Byung-Jin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TRANSFER METHOD
- Publication number 20240153807
- Publication date May 9, 2024
- TOKYO ELECTRON LIMITED
- Nanako SHINODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP CHUCK AND A METHOD OF USING THE SAME
- Publication number 20240153808
- Publication date May 9, 2024
- Canon Kabushiki Kaisha
- Byung-Jin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VACUUM WAFER CHUCK FOR MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20240153810
- Publication date May 9, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Chung-Hsien LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESS EQUIPMENT
- Publication number 20240150888
- Publication date May 9, 2024
- Applied Materials, Inc.
- Bhaskar PRASAD
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MODULAR MICROWAVE SOURCE WITH INTEGRATED OPTICAL SENSORS
- Publication number 20240153795
- Publication date May 9, 2024
- Applied Materials, Inc.
- Adam Fischbach
- H01 - BASIC ELECTRIC ELEMENTS

for positioning, orientation or alignment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Substrate processing apparatus, film formation unit, substrate proc...

Wafer support pin lifting device

Fine pitch BVA using reconstituted wafer with area array accessible...

Semiconductor die package and method of manufacture

Composite sintered body, electrostatic chuck member, electrostatic...

Fast response pedestal assembly for selective preclean

Ceramic susceptor

Package structure and method of forming the same

Glass and wafer inspection system and a method of use thereof

Electrostatic chuck, etching apparatus, and method of manufacturing...

Electrostatic chuck (ESC) pedestal voltage isolation

Method for producing optoelectronic semiconductor devices and optoe...

Substrate transport apparatus, substrate transport method, and subs...

Substrate pedestal for improved substrate processing

Substrate processing apparatus and driving method thereof

Measurement device and method for semiconductor structure

Semiconductor package and method of forming same

Edge ring, substrate support, substrate processing apparatus and me...

Info structure with copper pillar having reversed profile

Apparatus and methods for semiconductor processing

Lift apparatus and substrate processing apparatus including the same

Semiconductor manufacturing apparatus and semiconductor manufacturi...

Teaching method

Component-manufacturing tool and component-manufacturing method

Susceptor, epitaxial growth apparatus, method of producing epitaxia...

Method for depositing an epitaxial layer on a front side of a semic...

Substrate support with improved process uniformity

EFEM robot auto teaching methodology

Purge ring for pedestal assembly

Substrate processing system and substrate processing method, and de...

Patents Applicationslast 30 patents

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM

SEMICONDUCTOR CHIP SPLITTING METHOD USING A LASER AND SEMICONDUCTOR...

BONDING DEVICE, BONDING SYSTEM, AND BONDING METHOD

SUBSTRATE TRANSFER UNIT AND SUBSTRATE TREATMENT APPARATUS INCLUDING...

SYSTEMS AND APPARATUS FOR SEMICONDUCTOR EQUIPMENT

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

TOOLS AND METHODS FOR SUBTRACTIVE METAL PATTERNING

MOUNTING APPARATUS, MOUNTING METHOD, AND RECORDING MEDIUM

SUBSTRATE SUPPORTING PLATE, THIN FILM DEPOSITION APPARATUS INCLUDIN...

Methods And Systems For Measurement Of Semiconductor Structures Wit...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SYSTEMS AND METHODS FOR ACHIEVING PEAK ION ENERGY ENHANCEMENT WITH...

SUBSTRATE PROCESSING METHOD

APPARATUS FOR TREATING SUBSTRATE AND RELATED MANUFACTURING METHOD

POROUS CHAMBER COMPONENT COATING AUGMENTED WITH COLLOIDS

SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT APPARATUS

SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND SU...

BOWED SUBSTRATE CLAMPING METHOD, APPARATUS, AND SYSTEM

SEMICONDUCTOR SUBSTRATE CARRYING CONTAINER WITH SUPPORT WALL FORMED...

SUBSTRATE SUPPORT AND SUBSTRATE PROCESSING DEVICE

VACUUM PROCESSING APPARATUS AND TILT ADJUSTMENT METHOD

METHOD FOR FABRICATING A CHIP PACKAGE

BONDING MATERIAL APPLICATION APPARATUS AND BONDING MATERIAL APPLICA...

POLYMER FILM RELEASING METHOD, METHOD FOR MANUFACTURING ELECTRONIC...

APPARATUS INCLUDING ARRAYS OF PICK-UP HEADS AND BONDING HEADS AND A...

SUBSTRATE TRANSFER METHOD

CHIP CHUCK AND A METHOD OF USING THE SAME

VACUUM WAFER CHUCK FOR MANUFACTURING SEMICONDUCTOR DEVICES

SEMICONDUCTOR PROCESS EQUIPMENT

MODULAR MICROWAVE SOURCE WITH INTEGRATED OPTICAL SENSORS