-
Electronics tester
-
Patent number 12,169,217
-
Issue date Dec 17, 2024
-
AEHR Test Systems
-
Jovan Jovanovic
-
H01 - BASIC ELECTRIC ELEMENTS
-
Post-CMP cleaning and apparatus
-
Patent number 12,170,195
-
Issue date Dec 17, 2024
-
Taiwan Semiconductor Manufacturing Company, Ltd.
-
Fu-Ming Huang
-
B08 - CLEANING
-
-
-
Apparatus for processing substrate
-
Patent number 12,170,221
-
Issue date Dec 17, 2024
-
Jusung Engineering Co., Ltd.
-
Won Woo Jung
-
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
-
-
-
-
Electrostatic chuck
-
Patent number 12,170,219
-
Issue date Dec 17, 2024
-
Kyocera Corporation
-
Naoki Furukawa
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
-
-
Wafer support table and RF rod
-
Patent number 12,170,190
-
Issue date Dec 17, 2024
-
NGK Insulators, Ltd.
-
Yutaka Unno
-
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
-
-
-
Semiconductor package
-
Patent number 12,170,251
-
Issue date Dec 17, 2024
-
Samsung Electronics Co., Ltd.
-
Kyoung Lim Suk
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
Laser processing apparatus
-
Patent number 12,170,211
-
Issue date Dec 17, 2024
-
Disco Corporation
-
Yuta Yoshida
-
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
-
-
-
-
-
-
-
-
Substrate transport apparatus
-
Patent number 12,162,698
-
Issue date Dec 10, 2024
-
BROOKS AUTOMATION US, LLC
-
Daniel Babbs
-
H01 - BASIC ELECTRIC ELEMENTS
-
Sample holder
-
Patent number 12,162,110
-
Issue date Dec 10, 2024
-
Kyocera Corporation
-
Hiromasa Takemori
-
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
-
Method and system for bonding
-
Patent number 12,165,888
-
Issue date Dec 10, 2024
-
Taiwan Semiconductor Manufacturing Co., Ltd
-
Chieh Chang
-
H01 - BASIC ELECTRIC ELEMENTS
-
Workpiece holding tool
-
Patent number 12,165,897
-
Issue date Dec 10, 2024
-
Kyocera Corporation
-
Naoki Furukawa
-
H01 - BASIC ELECTRIC ELEMENTS
-