for positioning, orientation or alignment

Industry

CPC
H01L21/68

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/68for positioning, orientation or alignment

Industries

Patents Grantslast 30 patents

Information Patent Grant
Substrate processing device and etching liquid
- Patent number 12,203,021
- Issue date Jan 21, 2025
- Tokyo Electron Limited
- Koukichi Hiroshiro
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Substrate processing apparatus
- Patent number 12,204,256
- Issue date Jan 21, 2025
- Tokyo Electron Limited
- Kouichi Mizunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for treating a substrate
- Patent number 12,205,837
- Issue date Jan 21, 2025
- Semes Co., Ltd.
- Seong Hyun Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ground electrode formed in an electrostatic chuck for a plasma proc...
- Patent number 12,205,843
- Issue date Jan 21, 2025
- Applied Materials, Inc.
- Michael R. Rice
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor processing chamber to accommodate parasitic plasma fo...
- Patent number 12,205,845
- Issue date Jan 21, 2025
- Applied Materials, Inc.
- Khokan Chandra Paul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate cleaning apparatus, substrate cleaning method, and non-tr...
- Patent number 12,202,016
- Issue date Jan 21, 2025
- Tokyo Electron Limited
- Yuki Ito
- B08 - CLEANING
Information Patent Grant
Rating substrate support assemblies based on impedance circuit elec...
- Patent number 12,205,791
- Issue date Jan 21, 2025
- Applied Materials, Inc.
- Arvind Shankar Raman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus for anisotropic pattern etching and treatment
- Patent number 12,205,793
- Issue date Jan 21, 2025
- Lam Research Corporation
- Seokmin Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma control method in semiconductor wafer fabrication
- Patent number 12,205,844
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Huang-Shao Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for treating transparent adhesive layer of protective film o...
- Patent number 12,207,490
- Issue date Jan 21, 2025
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Mingjiong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,205,903
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cleaning apparatus and polishing apparatus
- Patent number 12,205,831
- Issue date Jan 21, 2025
- Ebara Corporation
- Mitsuru Miyazaki
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate debonding apparatus
- Patent number 12,205,832
- Issue date Jan 21, 2025
- Samsung Electronics Co., Ltd.
- Jonghyeon Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck and substrate fixing device
- Patent number 12,205,841
- Issue date Jan 21, 2025
- Shinko Electric Industries Co., Ltd.
- Masahiro Sunohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer chuck for a laser beam wafer dicing equipment
- Patent number 12,205,842
- Issue date Jan 21, 2025
- Infineon Technologies AG
- Franz-Josef Pichler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vision-based wafer pre-alignment platform and alignment method
- Patent number 12,205,325
- Issue date Jan 21, 2025
- WUXI XIVI SCIENCE AND TECHNOLOGY CO., LTD.
- Minjie Lu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Substrate processing apparatus and method of fabricating same
- Patent number 12,205,802
- Issue date Jan 21, 2025
- Semes Co., Ltd.
- Dong Mok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cleaning apparatus for semiconductor wafer and method of cleaning s...
- Patent number 12,205,830
- Issue date Jan 21, 2025
- Sumco Corporation
- Kaito Noda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Calibration hardware for ion implanter
- Patent number 12,205,840
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Lung-Yin Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Batch curing chamber with gas distribution and individual pumping
- Patent number 12,203,171
- Issue date Jan 21, 2025
- Applied Materials, Inc.
- Adib Khan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electronic device with top side pin array and manufacturing method...
- Patent number 12,205,827
- Issue date Jan 21, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Devarajan Balaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sample holder
- Patent number 12,205,839
- Issue date Jan 21, 2025
- Kyocera Corporation
- Yoshinori Narazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and noise impact reducing method
- Patent number 12,200,826
- Issue date Jan 14, 2025
- Tokyo Electron Limited
- Kazuhito Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 12,199,060
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Changbo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon nitride films having reduced interfacial strain
- Patent number 12,198,926
- Issue date Jan 14, 2025
- PSIQUANTUM, CORP.
- Yong Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding system
- Patent number 12,198,963
- Issue date Jan 14, 2025
- Tokyo Electron Limited
- Yoshitaka Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus
- Patent number 12,198,971
- Issue date Jan 14, 2025
- Semes Co., Ltd.
- Jeongcheol Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion barrier collar for interconnects
- Patent number 12,198,981
- Issue date Jan 14, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus with an injector
- Patent number 12,195,852
- Issue date Jan 14, 2025
- ASM IP Holding B.V.
- Kornelius Haanstra
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multi-layer composite ceramic plate and manufacturing method thereof
- Patent number 12,195,402
- Issue date Jan 14, 2025
- RAYCER ADVANCED MATERIALS TECHNOLOGY CO., LTD
- Juxian Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE SUPPORT
- Publication number 20250022724
- Publication date Jan 16, 2025
- TOKYO ELECTRON LIMITED
- Masanori TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM FOR MONITORING PERFORMANCE OF ELECTROSTATIC CHUCKS IN SUBSTR...
- Publication number 20250022740
- Publication date Jan 16, 2025
- LAM RESEARCH CORPORATION
- Liwei AN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FIXING DEVICE
- Publication number 20250022741
- Publication date Jan 16, 2025
- Shinko Electric Industries Co., Ltd.
- Yuma Terashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH
- Publication number 20250022755
- Publication date Jan 16, 2025
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device and Methods of Manufacture
- Publication number 20250022763
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Han Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD OF THINNING WAFER SUBSTRATE
- Publication number 20250018486
- Publication date Jan 16, 2025
- COMPTAKE TECHNOLOGY INC.
- YAO-GUANG YANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER BALL ATTACHMENT SYSTEM AND METHOD FOR PREVENTING WARPAGE
- Publication number 20250022826
- Publication date Jan 16, 2025
- PEP INNOVATION PTE LTD.
- Hwee Seng CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC CHUCK DEVICE AND SUBSTRATE PROCESSING APPARATUS INCLU...
- Publication number 20250022692
- Publication date Jan 16, 2025
- ASM IP HOLDING B.V.
- Koji Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC CHUCK AND SUBSTRATE FIXING DEVICE
- Publication number 20250022738
- Publication date Jan 16, 2025
- Shinko Electric Industries Co., Ltd.
- Masahiro Sunohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLLET STRUCTURE AND SEMICONDUCTOR FABRICATING APPARATUS INCLUDING...
- Publication number 20250022743
- Publication date Jan 16, 2025
- SK HYNIX INC.
- Taek Sang NAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...
- Publication number 20250022703
- Publication date Jan 16, 2025
- Kokusai Electric Corporation
- Yukinori ABURATANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPORARY FIXATION SUBSTRATE, METHOD OF MANUFACTURING TEMPORARY FIX...
- Publication number 20250022742
- Publication date Jan 16, 2025
- NGK Insulators, Ltd.
- Yoshio KIKUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OVERHEAD CONVEYING VEHICLE
- Publication number 20250022735
- Publication date Jan 16, 2025
- MURATA MACHINERY, LTD.
- Makoto Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANSION RETAINING RING
- Publication number 20250022744
- Publication date Jan 16, 2025
- TOKYO SEIMITSU CO., LTD.
- Ryo HIRUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIDE-COVERAGE EDGE RING FOR ENHANCED SHIELDING IN SUBSTRATE PROCESS...
- Publication number 20250022691
- Publication date Jan 16, 2025
- LAM RESEARCH CORPORATION
- Shang-I CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RING OF AN EDGE RING ASSEMBLY FOR AN ETCHING SYSTEM
- Publication number 20250022690
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi Chiuan Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC CHUCKS AND SUBSTRATE PROCESSING APPARATUS INCLUDING T...
- Publication number 20250022693
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Iksu BYUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS SYSTEM, METHOD, AND SUBSTRATE CHUCK
- Publication number 20250022739
- Publication date Jan 16, 2025
- TOKYO ELECTRON LIMITED
- Matthew Charles Gwinn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Rotating Biasable Pedestal and Electrostatic Chuck in Semiconductor...
- Publication number 20250022745
- Publication date Jan 16, 2025
- Applied Materials, Inc.
- Qiwei LIANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20250022790
- Publication date Jan 16, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- George Scott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER CARRIER STRUCTURE AND METAL-ORGANIC CHEMICAL VA...
- Publication number 20250019829
- Publication date Jan 16, 2025
- PlayNitride Display Co., Ltd.
- Yen-Lin LAI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE TRANSPORT SYSTEM AND TRANSFER ROBOT
- Publication number 20250018578
- Publication date Jan 16, 2025
- Hirata Corporation
- Keiji KANAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND MONITORING METHOD
- Publication number 20250024155
- Publication date Jan 16, 2025
- SCREEN Holdings Co., Ltd.
- Shinji SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC CHUCK AND PLASMA PROCESSING APPARATUS
- Publication number 20250014874
- Publication date Jan 9, 2025
- TOKYO ELECTRON LIMITED
- Takahiko SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESSING DEVICE, SEMICONDUCTOR PROCESSING SYSTEM, A...
- Publication number 20250014932
- Publication date Jan 9, 2025
- HUAYING RESEARCH CO., LTD
- Sophia Ziying WEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDGE RINGS FOR IMPROVED EDGED UNIFORMITY IN SEMICONDUCTOR PROCESSIN...
- Publication number 20250014938
- Publication date Jan 9, 2025
- LAM RESEARCH CORPORATION
- Anand Chandrashekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESSING DEVICE AND SEMICONDUCTOR PROCESSING SYSTEM
- Publication number 20250014919
- Publication date Jan 9, 2025
- HUAYING RESEARCH CO., LTD
- Sophia Ziying WEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIPOLAR ELECTROSTATIC CHUCK TO LIMIT DC DISCHARGE
- Publication number 20250014934
- Publication date Jan 9, 2025
- Applied Materials, Inc.
- Jian Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250014937
- Publication date Jan 9, 2025
- Resonac Corporation
- Motoo AOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR STACKING INTEGRATED CIRCUIT WAFERS AND DIES
- Publication number 20250015045
- Publication date Jan 9, 2025
- TOKYO ELECTRON LIMITED
- H. Jim Fulford
- H01 - BASIC ELECTRIC ELEMENTS

for positioning, orientation or alignment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Substrate processing device and etching liquid

Substrate processing apparatus

Apparatus for treating a substrate

Ground electrode formed in an electrostatic chuck for a plasma proc...

Semiconductor processing chamber to accommodate parasitic plasma fo...

Substrate cleaning apparatus, substrate cleaning method, and non-tr...

Rating substrate support assemblies based on impedance circuit elec...

Method and apparatus for anisotropic pattern etching and treatment

Plasma control method in semiconductor wafer fabrication

Method for treating transparent adhesive layer of protective film o...

Semiconductor package and manufacturing method thereof

Cleaning apparatus and polishing apparatus

Substrate debonding apparatus

Electrostatic chuck and substrate fixing device

Wafer chuck for a laser beam wafer dicing equipment

Vision-based wafer pre-alignment platform and alignment method

Substrate processing apparatus and method of fabricating same

Cleaning apparatus for semiconductor wafer and method of cleaning s...

Calibration hardware for ion implanter

Batch curing chamber with gas distribution and individual pumping

Electronic device with top side pin array and manufacturing method...

Sample holder

Substrate processing apparatus and noise impact reducing method

Semiconductor device and method of fabricating the same

Silicon nitride films having reduced interfacial strain

Bonding system

Substrate processing apparatus

Diffusion barrier collar for interconnects

Substrate processing apparatus with an injector

Multi-layer composite ceramic plate and manufacturing method thereof

Patents Applicationslast 30 patents

SUBSTRATE SUPPORT

SYSTEM FOR MONITORING PERFORMANCE OF ELECTROSTATIC CHUCKS IN SUBSTR...

SUBSTRATE FIXING DEVICE

WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH

Semiconductor Device and Methods of Manufacture

SYSTEM AND METHOD OF THINNING WAFER SUBSTRATE

SOLDER BALL ATTACHMENT SYSTEM AND METHOD FOR PREVENTING WARPAGE

ELECTROSTATIC CHUCK DEVICE AND SUBSTRATE PROCESSING APPARATUS INCLU...

ELECTROSTATIC CHUCK AND SUBSTRATE FIXING DEVICE

COLLET STRUCTURE AND SEMICONDUCTOR FABRICATING APPARATUS INCLUDING...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...

TEMPORARY FIXATION SUBSTRATE, METHOD OF MANUFACTURING TEMPORARY FIX...

OVERHEAD CONVEYING VEHICLE

EXPANSION RETAINING RING

WIDE-COVERAGE EDGE RING FOR ENHANCED SHIELDING IN SUBSTRATE PROCESS...

RING OF AN EDGE RING ASSEMBLY FOR AN ETCHING SYSTEM

ELECTROSTATIC CHUCKS AND SUBSTRATE PROCESSING APPARATUS INCLUDING T...

PROCESS SYSTEM, METHOD, AND SUBSTRATE CHUCK

Rotating Biasable Pedestal and Electrostatic Chuck in Semiconductor...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

SEMICONDUCTOR WAFER CARRIER STRUCTURE AND METAL-ORGANIC CHEMICAL VA...

SUBSTRATE TRANSPORT SYSTEM AND TRANSFER ROBOT

SUBSTRATE PROCESSING APPARATUS AND MONITORING METHOD

ELECTROSTATIC CHUCK AND PLASMA PROCESSING APPARATUS

SEMICONDUCTOR PROCESSING DEVICE, SEMICONDUCTOR PROCESSING SYSTEM, A...

EDGE RINGS FOR IMPROVED EDGED UNIFORMITY IN SEMICONDUCTOR PROCESSIN...

SEMICONDUCTOR PROCESSING DEVICE AND SEMICONDUCTOR PROCESSING SYSTEM

BIPOLAR ELECTROSTATIC CHUCK TO LIMIT DC DISCHARGE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

METHOD FOR STACKING INTEGRATED CIRCUIT WAFERS AND DIES