for positioning, orientation or alignment

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CPC
H01L21/68

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/68for positioning, orientation or alignment

Industries

Patents Grantslast 30 patents

Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 12,362,202
- Issue date Jul 15, 2025
- Tokyo Electron Limited
- Fumihiro Kamimura
- B08 - CLEANING
Information Patent Grant
Electrostatic chuck and semiconductor processing apparatus
- Patent number 12,362,217
- Issue date Jul 15, 2025
- BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.
- Jian Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of packaging semiconductor devices and packaged semiconduct...
- Patent number 12,362,260
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a semiconductor device bonded to a cir...
- Patent number 12,362,276
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic sintered body comprising magnesium aluminate spinel
- Patent number 12,358,806
- Issue date Jul 15, 2025
- Heraeus Covantics North America LLC
- Luke Walker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device using stationary laser...
- Patent number 12,362,204
- Issue date Jul 15, 2025
- Samsung Electronics Co., Ltd.
- Ji Hoon Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pick and placement of semiconductor chips based on nozzleless self-...
- Patent number 12,362,205
- Issue date Jul 15, 2025
- University of Southern California
- Eun Sok Kim
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
OHT vehicle and method of controlling operation of same
- Patent number 12,362,214
- Issue date Jul 15, 2025
- Semes Co., Ltd.
- Sung Hyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus and semiconductor fabrication method us...
- Patent number 12,362,216
- Issue date Jul 15, 2025
- Samsung Electronics Co., Ltd.
- Daehyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate holder and methods of use
- Patent number 12,362,218
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Chi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing display device, and transfer substrate for...
- Patent number 12,362,220
- Issue date Jul 15, 2025
- LG Electronics Inc.
- Jungsub Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etching apparatus and method
- Patent number 12,362,152
- Issue date Jul 15, 2025
- SPTS Technologies Limited
- Maxime Varvara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ion beam etching chamber with etching by-product redistributor
- Patent number 12,362,154
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Te-Hsien Hsieh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Monolithic chip stacking using a die with double-sided interconnect...
- Patent number 12,362,325
- Issue date Jul 15, 2025
- Intel Corporation
- Anup Pancholi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
- Patent number 12,362,326
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device using micro LED and method of manufacturing same
- Patent number 12,362,335
- Issue date Jul 15, 2025
- LG Electronics Inc.
- Chilkeun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a chip package
- Patent number 12,362,178
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for coating photo resist over a substrate
- Patent number 12,362,179
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tung-Hung Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor memory device and structure
- Patent number 12,362,219
- Issue date Jul 15, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronic device
- Patent number 12,362,221
- Issue date Jul 15, 2025
- MITSUI CHEMICALS ICT MATERIA, INC.
- Toru Miura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Film stress control for plasma enhanced chemical vapor deposition
- Patent number 12,362,149
- Issue date Jul 15, 2025
- Applied Materials, Inc.
- Chien-Teh Kao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for laser drilling blind vias
- Patent number 12,358,073
- Issue date Jul 15, 2025
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer transfer robot apparatus based on direct drive motor
- Patent number 12,358,734
- Issue date Jul 15, 2025
- RAONTEC INC.
- Jin Ho Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pedestal setup using camera wafer
- Patent number 12,362,153
- Issue date Jul 15, 2025
- Lam Research Corporation
- Prasanna Kulkarni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for low temperature silicon nitride films
- Patent number 12,362,169
- Issue date Jul 15, 2025
- Applied Materials, Inc.
- Wenbo Yan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor devices and methods of manufacturing
- Patent number 12,362,341
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chang-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Computer-readable recording medium, substrate bonding system, and s...
- Patent number 12,362,212
- Issue date Jul 15, 2025
- Tokyo Electron Limited
- Keiichi Saiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package assembly, electronic device, and preparation method of...
- Patent number 12,354,967
- Issue date Jul 8, 2025
- Huawei Technologies Co., Ltd.
- Zhaozheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stage, testing apparatus, and stage operating method
- Patent number 12,354,898
- Issue date Jul 8, 2025
- Tokyo Electron Limited
- Masahito Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stage and manufacturing method thereof
- Patent number 12,354,901
- Issue date Jul 8, 2025
- NHK Spring Co., Ltd.
- Hibiki Yokoyama
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
IMPLANTATION PROCESS TO MITIGATE BOWING OF WAFERS INTRODUCED BY SPL...
- Publication number 20250232977
- Publication date Jul 17, 2025
- II-VI Delaware, Inc.
- Jeremy Andre Turcaud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD INCL...
- Publication number 20250232987
- Publication date Jul 17, 2025
- TOKYO ELECTRON LIMITED
- Boi IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS AND MOUNTING TABLE THEREOF
- Publication number 20250233008
- Publication date Jul 17, 2025
- TOKYO ELECTRON LIMITED
- Yohei UCHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONVEYANCE APPARATUS, CONVEYANCE METHOD, AND SEMICONDUCTOR APPARATU...
- Publication number 20250232996
- Publication date Jul 17, 2025
- JSW Aktina System Co., Ltd.
- Teruaki SHIMOJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACH SYSTEMS, AND METHODS FOR INTEGRATED ACCURACY VERIFICATIO...
- Publication number 20250233000
- Publication date Jul 17, 2025
- Assembleon B.V.
- Alain De Bock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATERIAL FOR POSITIONAL ERROR COMPENSATION IN ASSEMBLY OF DISCRETE...
- Publication number 20250233002
- Publication date Jul 17, 2025
- KULICKE & SOFFA NETHERLANDS B.V.
- Matthew R. Semler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANAGING SEMICONDUCTOR WAFER AND DIE HANDLING
- Publication number 20250233005
- Publication date Jul 17, 2025
- CIENA CORPORATION
- Martin Caron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLACEMENT MEMBER
- Publication number 20250233009
- Publication date Jul 17, 2025
- KYOCERA CORPORATION
- Koji AKASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE CLEANING SYSTEMS AND RELATED METHODS
- Publication number 20250233021
- Publication date Jul 17, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER POSITIONING AND CORRECTION METHOD, SYSTEM, AND DEVICE
- Publication number 20250232999
- Publication date Jul 17, 2025
- Hito Robotic System Inc.
- RONGSHENG LYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC CHUCK
- Publication number 20250233001
- Publication date Jul 17, 2025
- TOTO LTD.
- Yuki SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARTUS FOR DETECTING POSITION OF WAFER AND OPERATING METHOD THEREOF
- Publication number 20250233006
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Kyungrim Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JIG AND DIE ATTACH APPARATUS FOR INCLUDING THE SAME
- Publication number 20250233003
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Sangyoung JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BASE, ELECTROSTATIC CHUCK DEVICE, AND MANUFACTURING METHOD OF BASE
- Publication number 20250233010
- Publication date Jul 17, 2025
- Sumitomo Osaka Cement Co., Ltd.
- Yuya Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING APPARATUS AND WAFER PROCESSING METHOD
- Publication number 20250233011
- Publication date Jul 17, 2025
- ZEUS CO., LTD.
- Woon KONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLURALITY OF ADVANCED MULTILEVEL CIRCUIT ATTACHMENTS
- Publication number 20250233108
- Publication date Jul 17, 2025
- TOKYO ELECTRON LIMITED
- Mark L. Gardner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING SYSTEM AND PROCESSING METHOD
- Publication number 20250232967
- Publication date Jul 17, 2025
- TOKYO ELECTRON LIMITED
- Norihiko AMIKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER HOLDER DEVICE HAVING HEATING FUNCTION
- Publication number 20250232989
- Publication date Jul 17, 2025
- SKY TECH INC.
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADAPTIVE POSITIONING SYSTEMS AND ROUTINES USING AN AUTOCALIBRATION...
- Publication number 20250232997
- Publication date Jul 17, 2025
- LAM RESEARCH CORPORATION
- Peter S. Thaulad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER SENSOR AND WAFER ALIGNMENT SYSTEM INCLUDING THE SAME
- Publication number 20250232998
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Junghyun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS, BONDING METHOD, AND ARTICLE MANUFACTURING METHOD
- Publication number 20250233004
- Publication date Jul 17, 2025
- Canon Kabushiki Kaisha
- MASAHIRO KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE LIFT ASSEMBLY, SYSTEM INCLUDING THE ASSEMBLY, AND METHODS...
- Publication number 20250233007
- Publication date Jul 17, 2025
- ASM IP HOLDING B.V.
- Tilakraj Durgadahalli Shankaregowda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ANTENNA IN PACKAGE HAVING ANTENNA ON PACKAGE SUBSTRATE
- Publication number 20250233301
- Publication date Jul 17, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TREATMENT DEVICE
- Publication number 20250226240
- Publication date Jul 10, 2025
- SHIBAURA MECHATRONICS CORPORATION
- Minami NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING SYSTEM
- Publication number 20250226245
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Tae Kun KIM
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Workpiece Processing Method
- Publication number 20250226229
- Publication date Jul 10, 2025
- LINTEC CORPORATION
- Hayato Nakanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING DISPLAY DEVICE AND APPARATUS FOR MANUFACTU...
- Publication number 20250226243
- Publication date Jul 10, 2025
- SAMSUNG DISPLAY CO., LTD.
- Dong Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Semiconductor Fabrication
- Publication number 20250226250
- Publication date Jul 10, 2025
- Nanoverse Technologies Inc.
- Jeffrey Albelo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC CHUCK
- Publication number 20250226256
- Publication date Jul 10, 2025
- Tomoegawa Corporation
- Ryouji Shikata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA ETCHER WITH EDGE RING AND METHOD OF PROCESSING SEMICONDUCTOR...
- Publication number 20250226188
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS

for positioning, orientation or alignment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Substrate processing method and substrate processing apparatus

Electrostatic chuck and semiconductor processing apparatus

Methods of packaging semiconductor devices and packaged semiconduct...

Semiconductor package having a semiconductor device bonded to a cir...

Ceramic sintered body comprising magnesium aluminate spinel

Method of manufacturing semiconductor device using stationary laser...

Pick and placement of semiconductor chips based on nozzleless self-...

OHT vehicle and method of controlling operation of same

Plasma processing apparatus and semiconductor fabrication method us...

Substrate holder and methods of use

Method for manufacturing display device, and transfer substrate for...

Plasma etching apparatus and method

Ion beam etching chamber with etching by-product redistributor

Monolithic chip stacking using a die with double-sided interconnect...

Semiconductor package and method of manufacturing semiconductor pac...

Display device using micro LED and method of manufacturing same

Method for fabricating a chip package

Method and apparatus for coating photo resist over a substrate

3D semiconductor memory device and structure

Method for manufacturing electronic device

Film stress control for plasma enhanced chemical vapor deposition

Method and apparatus for laser drilling blind vias

Wafer transfer robot apparatus based on direct drive motor

Pedestal setup using camera wafer

Methods and apparatus for low temperature silicon nitride films

Semiconductor devices and methods of manufacturing

Computer-readable recording medium, substrate bonding system, and s...

Chip package assembly, electronic device, and preparation method of...

Stage, testing apparatus, and stage operating method

Stage and manufacturing method thereof

Patents Applicationslast 30 patents

IMPLANTATION PROCESS TO MITIGATE BOWING OF WAFERS INTRODUCED BY SPL...

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD INCL...

PLASMA PROCESSING APPARATUS AND MOUNTING TABLE THEREOF

CONVEYANCE APPARATUS, CONVEYANCE METHOD, AND SEMICONDUCTOR APPARATU...

DIE ATTACH SYSTEMS, AND METHODS FOR INTEGRATED ACCURACY VERIFICATIO...

MATERIAL FOR POSITIONAL ERROR COMPENSATION IN ASSEMBLY OF DISCRETE...

MANAGING SEMICONDUCTOR WAFER AND DIE HANDLING

PLACEMENT MEMBER

DIE CLEANING SYSTEMS AND RELATED METHODS

WAFER POSITIONING AND CORRECTION METHOD, SYSTEM, AND DEVICE

ELECTROSTATIC CHUCK

APPARTUS FOR DETECTING POSITION OF WAFER AND OPERATING METHOD THEREOF

JIG AND DIE ATTACH APPARATUS FOR INCLUDING THE SAME

BASE, ELECTROSTATIC CHUCK DEVICE, AND MANUFACTURING METHOD OF BASE

WAFER PROCESSING APPARATUS AND WAFER PROCESSING METHOD

PLURALITY OF ADVANCED MULTILEVEL CIRCUIT ATTACHMENTS

PROCESSING SYSTEM AND PROCESSING METHOD

WAFER HOLDER DEVICE HAVING HEATING FUNCTION

ADAPTIVE POSITIONING SYSTEMS AND ROUTINES USING AN AUTOCALIBRATION...

WAFER SENSOR AND WAFER ALIGNMENT SYSTEM INCLUDING THE SAME

BONDING APPARATUS, BONDING METHOD, AND ARTICLE MANUFACTURING METHOD

SUBSTRATE LIFT ASSEMBLY, SYSTEM INCLUDING THE ASSEMBLY, AND METHODS...

ANTENNA IN PACKAGE HAVING ANTENNA ON PACKAGE SUBSTRATE

SUBSTRATE TREATMENT DEVICE

SUBSTRATE PROCESSING SYSTEM

Workpiece Processing Method

METHOD FOR MANUFACTURING DISPLAY DEVICE AND APPARATUS FOR MANUFACTU...

Method of Semiconductor Fabrication

ELECTROSTATIC CHUCK

PLASMA ETCHER WITH EDGE RING AND METHOD OF PROCESSING SEMICONDUCTOR...