for protecting parts during manufacture

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CPC
H01L2224/27009

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/27009for protecting parts during manufacture

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method
- Patent number 11,855,014
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Manufacturing method of device chip
- Patent number 11,024,542
- Issue date Jun 1, 2021
- Disco Corporation
- Heidi Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 10,867,941
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of forming thereof
- Patent number 10,262,959
- Issue date Apr 16, 2019
- Infineon Technologies AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 10,177,109
- Issue date Jan 8, 2019
- Mitsubishi Electric Corporation
- Yosuke Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer arrangement, a method for testing a wafer, and a method for p...
- Patent number 9,627,341
- Issue date Apr 18, 2017
- Infineon Technologies Dresden GmbH
- Peter Brockhaus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of repellent material to protect fabrication regions in semi co...
- Patent number 9,607,896
- Issue date Mar 28, 2017
- Henkel IP & Holding GmbH
- Raj Peddi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of forming thereof
- Patent number 9,484,316
- Issue date Nov 1, 2016
- Infineon Technologies AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-wafer bonding method and bonding device, and structure comp...
- Patent number 9,142,532
- Issue date Sep 22, 2015
- BONDTECH CO., LTD.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20180114766
- Publication date Apr 26, 2018
- Mitsubishi Electric Corporation
- Yosuke NAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER ARRANGEMENT, A METHOD FOR TESTING A WAFER, AND A METHOD FOR P...
- Publication number 20150115444
- Publication date Apr 30, 2015
- INFINEON TECHNOLOGIES DRESDEN GMBH
- Peter Brockhaus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
USE OF REPELLENT MATERIAL TO PROTECT FABRICATION REGIONS IN SEMI CO...
- Publication number 20140113435
- Publication date Apr 24, 2014
- HENKEL US IP LLC
- Raj Peddi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR CHIP PACKAGE
- Publication number 20120315726
- Publication date Dec 13, 2012
- HAK-KYOON BYUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PREPARING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DIE FOR...
- Publication number 20120181686
- Publication date Jul 19, 2012
- Samsung Electronics Co., Ltd.
- Joon Yong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR COATING A BUMPED SEMICONDUCTOR WAFER
- Publication number 20100007018
- Publication date Jan 14, 2010
- DEREK WYATT
- H01 - BASIC ELECTRIC ELEMENTS

for protecting parts during manufacture

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method

Sintering materials and attachment methods using same

Manufacturing method of device chip

Semiconductor device and method

Semiconductor devices and methods of forming thereof

Method of manufacturing semiconductor device

Wafer arrangement, a method for testing a wafer, and a method for p...

Use of repellent material to protect fabrication regions in semi co...

Semiconductor devices and methods of forming thereof

Chip-on-wafer bonding method and bonding device, and structure comp...

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

WAFER ARRANGEMENT, A METHOD FOR TESTING A WAFER, AND A METHOD FOR P...

USE OF REPELLENT MATERIAL TO PROTECT FABRICATION REGIONS IN SEMI CO...

METHOD OF MANUFACTURING A SEMICONDUCTOR CHIP PACKAGE

METHOD OF PREPARING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DIE FOR...

PROCESS FOR COATING A BUMPED SEMICONDUCTOR WAFER