for protecting parts during the process

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H01L2224/03019

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/03019for protecting parts during the process

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and manufacturing method of semiconductor pac...
- Patent number 12,080,636
- Issue date Sep 3, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Koichi Igarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor structure and method
- Patent number 12,068,287
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device with electroplated pillars
- Patent number 12,027,483
- Issue date Jul 2, 2024
- Texas Instruments Incorporated
- Arvin Cedric Quiambao Mallari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with edge-protecting spacers over bonding pad
- Patent number 12,027,479
- Issue date Jul 2, 2024
- NANYA TECHNOLOGY CORPORATION
- Jung-Hsing Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 12,009,323
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures with via openings and methods of making th...
- Patent number 11,990,431
- Issue date May 21, 2024
- Pep Innovation PTE Ltd.
- Hwee Seng Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer, method for fabricating the same, and semiconductor pack...
- Patent number 11,984,415
- Issue date May 14, 2024
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a wafer level chip scale package (WLCSP)
- Patent number 11,908,831
- Issue date Feb 20, 2024
- STMicroelectronics Pte Ltd
- Chun Yi Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus including integrated segments and methods of manufacturin...
- Patent number 11,894,327
- Issue date Feb 6, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with edge-protecting spacers over bonding pad
- Patent number 11,894,328
- Issue date Feb 6, 2024
- NANYA TECHNOLOGY CORPORATION
- Jung-Hsing Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip including a passivation nitride layer in co...
- Patent number 11,887,948
- Issue date Jan 30, 2024
- STMicroelectronics S.r.l.
- Simone Dario Mariani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure containing pre-polymerized protective layer...
- Patent number 11,776,922
- Issue date Oct 3, 2023
- SanDisk Technologies LLC
- Hajime Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder joints on nickel surface finishes without gold plating
- Patent number 11,676,926
- Issue date Jun 13, 2023
- Schlumberger Technology Corporation
- Mark Alex Kostinovsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with spacer over bonding pad
- Patent number 11,605,606
- Issue date Mar 14, 2023
- NANYA TECHNOLOGY CORPORATION
- Chun-Chi Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor structure and method
- Patent number 11,587,910
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel, manufacturing method of display panel, and display d...
- Patent number 11,562,973
- Issue date Jan 24, 2023
- BOE Technology Group Co., Ltd.
- Dawei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure containing pre-polymerized protective layer...
- Patent number 11,538,777
- Issue date Dec 27, 2022
- SanDisk Technologies LLC
- Hajime Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with spacer over bonding pad
- Patent number 11,521,945
- Issue date Dec 6, 2022
- NANYA TECHNOLOGY CORPORATION
- Chun-Chi Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 11,456,263
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film structure for bond pad
- Patent number 11,322,464
- Issue date May 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Julie Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dry etch process landing on metal oxide etch stop layer over metal...
- Patent number 11,195,725
- Issue date Dec 7, 2021
- Texas Instruments Incorporated
- Sebastian Meier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device with electroplated pillars
- Patent number 11,094,656
- Issue date Aug 17, 2021
- Texas Instruments Incorporated
- Arvin Cedric Quiambao Mallari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the semiconductor...
- Patent number 11,075,180
- Issue date Jul 27, 2021
- AOI Electronics Co., Ltd.
- Katsuhiro Takao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor structure and method
- Patent number 11,037,909
- Issue date Jun 15, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
- Patent number 10,978,414
- Issue date Apr 13, 2021
- ABLIC INC.
- Shinjiro Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad reliability of semiconductor devices
- Patent number 10,892,239
- Issue date Jan 12, 2021
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Ramasamy Chockalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor structure
- Patent number 10,872,870
- Issue date Dec 22, 2020
- Siliconware Precision Industries Co., Ltd.
- Yi-Cheih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming solder bumps
- Patent number 10,840,202
- Issue date Nov 17, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming solder bumps
- Patent number 10,833,035
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming solder bumps
- Patent number 10,797,011
- Issue date Oct 6, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND APPARATUS FOR IMPROVED WAFER COATING
- Publication number 20240395742
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Feng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM STRUCTURE FOR BOND PAD
- Publication number 20240387424
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Julie Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMOOTH COPPER ON PACKAGING SUBSTRATE OUTER LAYERS
- Publication number 20240321791
- Publication date Sep 26, 2024
- Skyworks Solutions, Inc.
- Ki Wook LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER, METHOD FOR FABRICATING THE SAME, AND SEMICONDUCTOR PACK...
- Publication number 20240274553
- Publication date Aug 15, 2024
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAP LAYER FOR PAD OXIDATION PREVENTION
- Publication number 20240243080
- Publication date Jul 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Haklay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS INCLUDING INTEGRATED SEGMENTS AND METHODS OF MANUFACTURIN...
- Publication number 20240136310
- Publication date Apr 25, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP INCLUDING A PASSIVATION NITRIDE LAYER IN CO...
- Publication number 20240120301
- Publication date Apr 11, 2024
- STMicroelectronics S.r.l
- Simone Dario MARIANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR HYBRID BOND CRACKSTOP WITH AIRGAPS
- Publication number 20240113055
- Publication date Apr 4, 2024
- International Business Machines Corporation
- Nicholas Alexander Polomoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adding Sealing Material to Wafer edge for Wafer Bonding
- Publication number 20240096830
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Yi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE, METHOD OF MANUFACTURING THE SAME AND TILED DISPLAY...
- Publication number 20230307462
- Publication date Sep 28, 2023
- SAMSUNG DISPLAY CO., LTD.
- Yong Hoon KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20230253412
- Publication date Aug 10, 2023
- SAMSUNG DISPLAY CO., LTD.
- Jeong Su PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THICK BONDING PAD STRUCTURE FOR WIRE BOND STRESS REDUCTION
- Publication number 20230238341
- Publication date Jul 27, 2023
- STMicroelectronics Pte Ltd
- Churn Weng YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20230207392
- Publication date Jun 29, 2023
- Rohm Co., Ltd.
- Shingo OTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Semiconductor Structure and Method
- Publication number 20230207530
- Publication date Jun 29, 2023
- Taiwan Semiconductor Manufacturing Co, LTD.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20230154807
- Publication date May 18, 2023
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Guoliang YE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHODS FOR MANUFA...
- Publication number 20230109650
- Publication date Apr 6, 2023
- Rohm Co., Ltd.
- Yuki NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS INCLUDING INTEGRATED SEGMENTS AND METHODS OF MANUFACTURIN...
- Publication number 20230054514
- Publication date Feb 23, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP INCLUDING A PASSIVATION NITRIDE LAYER IN CO...
- Publication number 20230032635
- Publication date Feb 2, 2023
- STMicroelectronics S.r.l
- Simone Dario MARIANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A REDISTRIBUTION LAYER, REDISTRIBUTION LAYE...
- Publication number 20220384371
- Publication date Dec 1, 2022
- STMicroelectronics S.r.l
- Samuele SCIARRILLO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20220367391
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Yu WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR IMPROVED WAFER COATING
- Publication number 20220367390
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Feng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM STRUCTURE FOR BOND PAD
- Publication number 20220254744
- Publication date Aug 11, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Julie Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES WITH VIA OPENINGS AND METHODS OF MAKING TH...
- Publication number 20220157750
- Publication date May 19, 2022
- PEP INNOVATION PTE LTD.
- Hwee Seng CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A WAFER LEVEL CHIP SCALE PACKAGE (WLCSP)
- Publication number 20220122941
- Publication date Apr 21, 2022
- STMicroelectronics Pte Ltd
- Chun Yi TENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR PAC...
- Publication number 20220084921
- Publication date Mar 17, 2022
- Sony Semiconductor Solutions Corporation
- KOICHI IGARASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER JOINTS ON NICKEL SURFACE FINISHES WITHOUT GOLD PLATING
- Publication number 20220059489
- Publication date Feb 24, 2022
- SCHLUMBERGER TECHNOLOGY CORPORATION
- Mark Alex Kostinovsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE CONTAINING PRE-POLYMERIZED PROTECTIVE LAYER...
- Publication number 20220005773
- Publication date Jan 6, 2022
- SANDISK TECHNOLOGIES LLC
- Hajime ARAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE CONTAINING PRE-POLYMERIZED PROTECTIVE LAYER...
- Publication number 20220005772
- Publication date Jan 6, 2022
- SANDISK TECHNOLOGIES LLC
- Hajime ARAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE WITH ELECTROPLATED PILLARS
- Publication number 20210375808
- Publication date Dec 2, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Arvin Cedric Quiambao Mallari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Display Panel, Manufacturing Method of Display Panel, and Display D...
- Publication number 20210366850
- Publication date Nov 25, 2021
- BOE TECHNOLOGY GROUP CO., LTD.
- Dawei Wang
- H01 - BASIC ELECTRIC ELEMENTS

for protecting parts during the process

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package and manufacturing method of semiconductor pac...

Stacked semiconductor structure and method

Packaged semiconductor device with electroplated pillars

Semiconductor device with edge-protecting spacers over bonding pad

Semiconductor structure

Semiconductor structures with via openings and methods of making th...

Interposer, method for fabricating the same, and semiconductor pack...

Method for manufacturing a wafer level chip scale package (WLCSP)

Apparatus including integrated segments and methods of manufacturin...

Semiconductor device with edge-protecting spacers over bonding pad

Integrated circuit chip including a passivation nitride layer in co...

Semiconductor structure containing pre-polymerized protective layer...

Solder joints on nickel surface finishes without gold plating

Semiconductor device with spacer over bonding pad

Stacked semiconductor structure and method

Display panel, manufacturing method of display panel, and display d...

Semiconductor structure containing pre-polymerized protective layer...

Semiconductor device with spacer over bonding pad

Semiconductor structure and method for forming the same

Film structure for bond pad

Dry etch process landing on metal oxide etch stop layer over metal...

Packaged semiconductor device with electroplated pillars

Semiconductor device and method of manufacturing the semiconductor...

Stacked semiconductor structure and method

Semiconductor device and method of manufacturing a semiconductor de...

Bond pad reliability of semiconductor devices

Fabrication method of semiconductor structure

Method of forming solder bumps

Method of forming solder bumps

Method of forming solder bumps

Patents Applicationslast 30 patents

METHOD AND APPARATUS FOR IMPROVED WAFER COATING

FILM STRUCTURE FOR BOND PAD

SMOOTH COPPER ON PACKAGING SUBSTRATE OUTER LAYERS

INTERPOSER, METHOD FOR FABRICATING THE SAME, AND SEMICONDUCTOR PACK...

CAP LAYER FOR PAD OXIDATION PREVENTION

APPARATUS INCLUDING INTEGRATED SEGMENTS AND METHODS OF MANUFACTURIN...

INTEGRATED CIRCUIT CHIP INCLUDING A PASSIVATION NITRIDE LAYER IN CO...

STRUCTURE FOR HYBRID BOND CRACKSTOP WITH AIRGAPS

Adding Sealing Material to Wafer edge for Wafer Bonding

DISPLAY DEVICE, METHOD OF MANUFACTURING THE SAME AND TILED DISPLAY...

DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME

THICK BONDING PAD STRUCTURE FOR WIRE BOND STRESS REDUCTION

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Stacked Semiconductor Structure and Method

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHODS FOR MANUFA...

APPARATUS INCLUDING INTEGRATED SEGMENTS AND METHODS OF MANUFACTURIN...

INTEGRATED CIRCUIT CHIP INCLUDING A PASSIVATION NITRIDE LAYER IN CO...

METHOD OF MANUFACTURING A REDISTRIBUTION LAYER, REDISTRIBUTION LAYE...

SEMICONDUCTOR STRUCTURE

METHOD AND APPARATUS FOR IMPROVED WAFER COATING

FILM STRUCTURE FOR BOND PAD

SEMICONDUCTOR STRUCTURES WITH VIA OPENINGS AND METHODS OF MAKING TH...

METHOD FOR MANUFACTURING A WAFER LEVEL CHIP SCALE PACKAGE (WLCSP)

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR PAC...

SOLDER JOINTS ON NICKEL SURFACE FINISHES WITHOUT GOLD PLATING

SEMICONDUCTOR STRUCTURE CONTAINING PRE-POLYMERIZED PROTECTIVE LAYER...

SEMICONDUCTOR STRUCTURE CONTAINING PRE-POLYMERIZED PROTECTIVE LAYER...

PACKAGED SEMICONDUCTOR DEVICE WITH ELECTROPLATED PILLARS

Display Panel, Manufacturing Method of Display Panel, and Display D...