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for protecting parts during the process

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  • CPC
  • H01L2224/27019
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/27019for protecting parts during the process
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    ELECTROCONDUCTIVE ADHESIVE
    • Publication number 20200172767
    • Publication date Jun 4, 2020
    • Takamichi MORI
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    • Publication number 20180114766
    • Publication date Apr 26, 2018
    • Mitsubishi Electric Corporation
    • Yosuke NAKATA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Process for Forming Package-on-Package Structures
    • Publication number 20150179624
    • Publication date Jun 25, 2015
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chih-Wei Lin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Process for Forming Package-on-Package Structures
    • Publication number 20130093078
    • Publication date Apr 18, 2013
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chih-Wei Lin
    • H01 - BASIC ELECTRIC ELEMENTS