for stacked arrangements of a plurality of semiconductor devices

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H01L23/4012

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/4012for stacked arrangements of a plurality of semiconductor devices

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Patents Grantslast 30 patents

Information Patent Grant
Data processing device
- Patent number 12,094,802
- Issue date Sep 17, 2024
- Delta Electronics (Shanghai) Co., Ltd.
- Pengkai Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mitigating thermal impacts on adjacent stacked semiconductor devices
- Patent number 11,984,427
- Issue date May 14, 2024
- Sui Chi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for protecting a stack of electronic components and metho...
- Patent number 11,942,395
- Issue date Mar 26, 2024
- Ciena Corporation
- Raphael Beaupré-Laflamme
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a carrier, semiconductor chip packages...
- Patent number 11,915,999
- Issue date Feb 27, 2024
- Infineon Technologies AG
- Tomasz Naeve
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded semiconductor package having a negative standoff
- Patent number 11,862,541
- Issue date Jan 2, 2024
- Infineon Technologies AG
- Thomas Stoek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chamfered die of semiconductor package and method for forming the same
- Patent number 11,854,986
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits and methods for forming integrated circuits
- Patent number 11,830,788
- Issue date Nov 28, 2023
- Intel Corporation
- Carl Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IPD modules with flexible connection scheme in packaging
- Patent number 11,798,925
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,764,126
- Issue date Sep 19, 2023
- Mitsubishi Electric Corporation
- Hideo Komo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device
- Patent number 11,735,491
- Issue date Aug 22, 2023
- Samsung Electronics Co., Ltd.
- Hyunggyun Noh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 11,705,378
- Issue date Jul 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chamfered die of semiconductor package and method for forming the same
- Patent number 11,682,626
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a spring plate
- Patent number 11,621,213
- Issue date Apr 4, 2023
- Mitsubishi Electric Corporation
- Hideo Komo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power conversion device and manufacturing method thereof
- Patent number 11,562,944
- Issue date Jan 24, 2023
- Denso Corporation
- Tomoyuki Maeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mitigating thermal impacts on adjacent stacked semiconductor devices
- Patent number 11,469,207
- Issue date Oct 11, 2022
- Micron Technology, Inc.
- Sui Chi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,195,817
- Issue date Dec 7, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Ya Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits and methods for forming integrated circuits
- Patent number 11,164,809
- Issue date Nov 2, 2021
- Intel Corporation
- Carl Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 11,121,056
- Issue date Sep 14, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chien-Mao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IPD modules with flexible connection scheme in packaging
- Patent number 11,088,125
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of changing a switching module using pressure-applying device
- Patent number 11,026,341
- Issue date Jun 1, 2021
- LSIS Co., Ltd.
- Teagsun Jung
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Integrated circuits and methods for forming integrated circuits
- Patent number 11,018,075
- Issue date May 25, 2021
- Intel Corporation
- Carl Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Current sensor device
- Patent number 10,962,573
- Issue date Mar 30, 2021
- Denso Corporation
- Kohsuke Nomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat exchanger for cooling multiple layers of electronic modules
- Patent number 10,928,141
- Issue date Feb 23, 2021
- Dana Canada Corporation
- Benjamin A. Kenney
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor device having switching element suppressing potential...
- Patent number 10,879,782
- Issue date Dec 29, 2020
- Denso Corporation
- Yuu Yamahira
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor packaging structure and process
- Patent number 10,867,835
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of assembling a switching module
- Patent number 10,790,644
- Issue date Sep 29, 2020
- LSIS Co., Ltd.
- Teagsun Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module having power device connected between heat sink and dr...
- Patent number 10,763,244
- Issue date Sep 1, 2020
- Siemens Aktiengesellschaft
- Karl Weidner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical power conversion apparatus
- Patent number 10,757,842
- Issue date Aug 25, 2020
- Denso Corporation
- Kazuya Takeuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with heat transfer structure formed f...
- Patent number 10,748,878
- Issue date Aug 18, 2020
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switch assembly of reactive power compensation apparatus
- Patent number 10,749,018
- Issue date Aug 18, 2020
- LSIS Co., Ltd.
- Teagsun Jung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
IPD MODULES WITH FLEXIBLE CONNECTION SCHEME IN PACKAGING
- Publication number 20240405005
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DATA PROCESSING DEVICE
- Publication number 20240404915
- Publication date Dec 5, 2024
- DELTA ELECTRONICS (SHANGHAI) CO., LTD.
- Pengkai JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MITIGATING THERMAL IMPACTS ON ADJACENT STACKED SEMICONDUCTOR DEVICES
- Publication number 20240347505
- Publication date Oct 17, 2024
- Lodestar Licensing Group LLC
- Sui Chi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20240113071
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chamfered Die of Semiconductor Package and Method for Forming the Same
- Publication number 20240088050
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER BLOCK BASED ON TOP-SIDE COOL SURFACE-MOUNT DISCRETE DEVICES W...
- Publication number 20240030096
- Publication date Jan 25, 2024
- Qorvo US, Inc.
- Ke Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IPD Modules with Flexible Connection Scheme in Packaging
- Publication number 20230369303
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20230307305
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die, Heat Spreader, Semiconductor Package, Semiconduc...
- Publication number 20230197566
- Publication date Jun 22, 2023
- Intel Corporation
- Bernd WAIDHAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VARIABLE GAP COMPENSATION MOUNTING SOLUTION FOR THERMAL MANAGEMENT...
- Publication number 20230163046
- Publication date May 25, 2023
- CIENA CORPORATION
- Raphael Beaupré-Laflamme
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED STRUCTURE WITH INTERPOSER
- Publication number 20230069183
- Publication date Mar 2, 2023
- Invensas LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MITIGATING THERMAL IMPACTS ON ADJACENT STACKED SEMICONDUCTOR DEVICES
- Publication number 20230033685
- Publication date Feb 2, 2023
- Micron Technology, Inc.
- Sui Chi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY ON PACKAGE (MOP) WITH REVERSE CAMM (COMPRESSION ATTACHED MEM...
- Publication number 20230005882
- Publication date Jan 5, 2023
- Intel Corporation
- George VERGIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chamfered Die of Semiconductor Package and Method for Forming the Same
- Publication number 20220336361
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE
- Publication number 20220301969
- Publication date Sep 22, 2022
- Samsung Electronics Co., Ltd.
- Hyunggyun NOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20220020655
- Publication date Jan 20, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jung-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IPD Modules with Flexible Connection Scheme in Packaging
- Publication number 20210375840
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS AND METHODS FOR FORMING INTEGRATED CIRCUITS
- Publication number 20210351105
- Publication date Nov 11, 2021
- Intel Corporation
- Carl Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210343623
- Publication date Nov 4, 2021
- Mitsubishi Electric Corporation
- Hideo KOMO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DATA PROCESSING DEVICE
- Publication number 20210335692
- Publication date Oct 28, 2021
- DELTA ELECTRONICS (SHANGHAI) CO., LTD.
- Pengkai JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method
- Publication number 20210233852
- Publication date Jul 29, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210125960
- Publication date Apr 29, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Ya Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IPD Modules with Flexible Connection Scheme in Packaging
- Publication number 20210082888
- Publication date Mar 18, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20200286811
- Publication date Sep 10, 2020
- Mitsubishi Electric Corporation
- Hideo KOMO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20200243416
- Publication date Jul 30, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIEN-MAO CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuits and methods for forming integrated circuits
- Publication number 20200194338
- Publication date Jun 18, 2020
- Intel Corporation
- Carl NAYLOR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH HEAT TRANSFER STRUCTURE FORMED F...
- Publication number 20190348401
- Publication date Nov 14, 2019
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190252293
- Publication date Aug 15, 2019
- Toyota Jidosha Kabushiki Kaisha
- Masataka DEGUCHI
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH HEAT TRANSFER STRUCTURE FORMED F...
- Publication number 20190229096
- Publication date Jul 25, 2019
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20190139908
- Publication date May 9, 2019
- Toshiba Memory Corporation
- Masaya SHIMA
- H01 - BASIC ELECTRIC ELEMENTS

for stacked arrangements of a plurality of semiconductor devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Data processing device

Mitigating thermal impacts on adjacent stacked semiconductor devices

Apparatus for protecting a stack of electronic components and metho...

Semiconductor device having a carrier, semiconductor chip packages...

Molded semiconductor package having a negative standoff

Chamfered die of semiconductor package and method for forming the same

Integrated circuits and methods for forming integrated circuits

IPD modules with flexible connection scheme in packaging

Semiconductor device and method of manufacturing semiconductor device

Semiconductor package device

Semiconductor packages and methods of forming the same

Chamfered die of semiconductor package and method for forming the same

Semiconductor device including a spring plate

Power conversion device and manufacturing method thereof

Mitigating thermal impacts on adjacent stacked semiconductor devices

Semiconductor package and manufacturing method thereof

Integrated circuits and methods for forming integrated circuits

Semiconductor device and manufacturing method of the same

IPD modules with flexible connection scheme in packaging

Method of changing a switching module using pressure-applying device

Integrated circuits and methods for forming integrated circuits

Current sensor device

Heat exchanger for cooling multiple layers of electronic modules

Semiconductor device having switching element suppressing potential...

Semiconductor packaging structure and process

Method of assembling a switching module

Power module having power device connected between heat sink and dr...

Electrical power conversion apparatus

Semiconductor device assembly with heat transfer structure formed f...

Switch assembly of reactive power compensation apparatus

Patents Applicationslast 30 patents

IPD MODULES WITH FLEXIBLE CONNECTION SCHEME IN PACKAGING

DATA PROCESSING DEVICE

MITIGATING THERMAL IMPACTS ON ADJACENT STACKED SEMICONDUCTOR DEVICES

Integrated Circuit Package and Method

Chamfered Die of Semiconductor Package and Method for Forming the Same

POWER BLOCK BASED ON TOP-SIDE COOL SURFACE-MOUNT DISCRETE DEVICES W...

IPD Modules with Flexible Connection Scheme in Packaging

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME

Semiconductor Die, Heat Spreader, Semiconductor Package, Semiconduc...

VARIABLE GAP COMPENSATION MOUNTING SOLUTION FOR THERMAL MANAGEMENT...

STACKED STRUCTURE WITH INTERPOSER

MITIGATING THERMAL IMPACTS ON ADJACENT STACKED SEMICONDUCTOR DEVICES

MEMORY ON PACKAGE (MOP) WITH REVERSE CAMM (COMPRESSION ATTACHED MEM...

Chamfered Die of Semiconductor Package and Method for Forming the Same

SEMICONDUCTOR PACKAGE DEVICE

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME

IPD Modules with Flexible Connection Scheme in Packaging

INTEGRATED CIRCUITS AND METHODS FOR FORMING INTEGRATED CIRCUITS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

DATA PROCESSING DEVICE

Semiconductor Package and Method

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

IPD Modules with Flexible Connection Scheme in Packaging

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Integrated circuits and methods for forming integrated circuits

SEMICONDUCTOR DEVICE ASSEMBLY WITH HEAT TRANSFER STRUCTURE FORMED F...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE ASSEMBLY WITH HEAT TRANSFER STRUCTURE FORMED F...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE