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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/683for supporting or gripping

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Edge seal for lower electrode assembly
- Patent number 12,368,025
- Issue date Jul 22, 2025
- Lam Research Corporation
- David Schaefer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer taping apparatus and method
- Patent number 12,368,063
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Yi Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method, apparatus, and system for dynamically controlling an electr...
- Patent number 12,368,067
- Issue date Jul 22, 2025
- ASML Netherlands B.V.
- Yixiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape affixing apparatus
- Patent number 12,368,064
- Issue date Jul 22, 2025
- Tokyo Seimitsu Co., Ltd.
- Kiyotaka Kizaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 12,368,068
- Issue date Jul 22, 2025
- Fuji Electric Co., Ltd.
- Yuya Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor packages
- Patent number 12,368,149
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of selectively transferring semiconductor device
- Patent number 12,369,431
- Issue date Jul 22, 2025
- Epistar Corporation
- Hao-Min Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,368,084
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus and manufacturing method thereof
- Patent number 12,368,145
- Issue date Jul 22, 2025
- Seoul Semiconductor Co., Ltd.
- Motonobu Takeya
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Supporting InFO packages to reduce warpage
- Patent number 12,368,115
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of packaging semiconductor devices and packaged semiconduct...
- Patent number 12,362,260
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a semiconductor device bonded to a cir...
- Patent number 12,362,276
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck and semiconductor processing apparatus
- Patent number 12,362,217
- Issue date Jul 15, 2025
- BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.
- Jian Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus and semiconductor fabrication method us...
- Patent number 12,362,216
- Issue date Jul 15, 2025
- Samsung Electronics Co., Ltd.
- Daehyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate holder and methods of use
- Patent number 12,362,218
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Chi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing display device, and transfer substrate for...
- Patent number 12,362,220
- Issue date Jul 15, 2025
- LG Electronics Inc.
- Jungsub Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etching apparatus and method
- Patent number 12,362,152
- Issue date Jul 15, 2025
- SPTS Technologies Limited
- Maxime Varvara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic chip stacking using a die with double-sided interconnect...
- Patent number 12,362,325
- Issue date Jul 15, 2025
- Intel Corporation
- Anup Pancholi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
- Patent number 12,362,326
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device using micro LED and method of manufacturing same
- Patent number 12,362,335
- Issue date Jul 15, 2025
- LG Electronics Inc.
- Chilkeun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a chip package
- Patent number 12,362,178
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor memory device and structure
- Patent number 12,362,219
- Issue date Jul 15, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronic device
- Patent number 12,362,221
- Issue date Jul 15, 2025
- MITSUI CHEMICALS ICT MATERIA, INC.
- Toru Miura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Film stress control for plasma enhanced chemical vapor deposition
- Patent number 12,362,149
- Issue date Jul 15, 2025
- Applied Materials, Inc.
- Chien-Teh Kao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor devices and methods of manufacturing
- Patent number 12,362,341
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chang-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Computer-readable recording medium, substrate bonding system, and s...
- Patent number 12,362,212
- Issue date Jul 15, 2025
- Tokyo Electron Limited
- Keiichi Saiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stage and manufacturing method thereof
- Patent number 12,354,901
- Issue date Jul 8, 2025
- NHK Spring Co., Ltd.
- Hibiki Yokoyama
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Deposition apparatus and display panel manufacturing apparatus incl...
- Patent number 12,354,903
- Issue date Jul 8, 2025
- Samsung Display Co., Ltd.
- Gyungmin Baek
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Chip package assembly, electronic device, and preparation method of...
- Patent number 12,354,967
- Issue date Jul 8, 2025
- Huawei Technologies Co., Ltd.
- Zhaozheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment apparatus, deposition apparatus, electronic device manufa...
- Patent number 12,354,894
- Issue date Jul 8, 2025
- CANON TOKKI CORPORATION
- Toshiaki Himeji
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
LIGHT-EMITTING ELEMENT ARRAY SUBSTRATE AND METHOD FOR MANUFACTURING...
- Publication number 20250239477
- Publication date Jul 24, 2025
- AUO Corporation
- Kuan-Yi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-THIN PACKAGED COMPONENT
- Publication number 20250239499
- Publication date Jul 24, 2025
- PANJIT INTERNATIONAL INC.
- CHUNG-HSIUNG HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONVEYANCE APPARATUS, TRANSFER METHOD, CONVEYANCE METHOD, AND SEMIC...
- Publication number 20250239475
- Publication date Jul 24, 2025
- JSW Aktina System Co., Ltd.
- Takahiro FUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING MICRO DEVICE PANEL
- Publication number 20250239470
- Publication date Jul 24, 2025
- PlayNitride Display Co., Ltd.
- Yun-Li Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD, PRECOAT METHOD, AND ETCHING APPARATUS
- Publication number 20250239476
- Publication date Jul 24, 2025
- TOKYO ELECTRON LIMITED
- Takamitsu TAKAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...
- Publication number 20250239478
- Publication date Jul 24, 2025
- Mitsubishi Electric Corporation
- Kota HASHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE CHIP MANUFACTURING METHOD AND WORKPIECE PROCESSING APPARATUS
- Publication number 20250239493
- Publication date Jul 24, 2025
- Disco Corporation
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250239501
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPLANTATION PROCESS TO MITIGATE BOWING OF WAFERS INTRODUCED BY SPL...
- Publication number 20250232977
- Publication date Jul 17, 2025
- II-VI Delaware, Inc.
- Jeremy Andre Turcaud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS AND MOUNTING TABLE THEREOF
- Publication number 20250233008
- Publication date Jul 17, 2025
- TOKYO ELECTRON LIMITED
- Yohei UCHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATERIAL FOR POSITIONAL ERROR COMPENSATION IN ASSEMBLY OF DISCRETE...
- Publication number 20250233002
- Publication date Jul 17, 2025
- KULICKE & SOFFA NETHERLANDS B.V.
- Matthew R. Semler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE CLEANING SYSTEMS AND RELATED METHODS
- Publication number 20250233021
- Publication date Jul 17, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROSTATIC CHUCK
- Publication number 20250233001
- Publication date Jul 17, 2025
- TOTO LTD.
- Yuki SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JIG AND DIE ATTACH APPARATUS FOR INCLUDING THE SAME
- Publication number 20250233003
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Sangyoung JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BASE, ELECTROSTATIC CHUCK DEVICE, AND MANUFACTURING METHOD OF BASE
- Publication number 20250233010
- Publication date Jul 17, 2025
- Sumitomo Osaka Cement Co., Ltd.
- Yuya Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING APPARATUS AND WAFER PROCESSING METHOD
- Publication number 20250233011
- Publication date Jul 17, 2025
- ZEUS CO., LTD.
- Woon KONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLURALITY OF ADVANCED MULTILEVEL CIRCUIT ATTACHMENTS
- Publication number 20250233108
- Publication date Jul 17, 2025
- TOKYO ELECTRON LIMITED
- Mark L. Gardner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER HOLDER DEVICE HAVING HEATING FUNCTION
- Publication number 20250232989
- Publication date Jul 17, 2025
- SKY TECH INC.
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER SENSOR AND WAFER ALIGNMENT SYSTEM INCLUDING THE SAME
- Publication number 20250232998
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Junghyun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS, BONDING METHOD, AND ARTICLE MANUFACTURING METHOD
- Publication number 20250233004
- Publication date Jul 17, 2025
- Canon Kabushiki Kaisha
- MASAHIRO KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA IN PACKAGE HAVING ANTENNA ON PACKAGE SUBSTRATE
- Publication number 20250233301
- Publication date Jul 17, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Workpiece Processing Method
- Publication number 20250226229
- Publication date Jul 10, 2025
- LINTEC CORPORATION
- Hayato Nakanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC CHUCK
- Publication number 20250226256
- Publication date Jul 10, 2025
- Tomoegawa Corporation
- Ryouji Shikata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA ETCHER WITH EDGE RING AND METHOD OF PROCESSING SEMICONDUCTOR...
- Publication number 20250226188
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE FILM FOR SEMICONDUCTORS, DICING DIE BONDING FILM, AND METH...
- Publication number 20250226347
- Publication date Jul 10, 2025
- Resonac Corporation
- Takaaki NIWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE FILM FOR SEMICONDUCTORS, DICING/DIE-BONDING FILM, AND METH...
- Publication number 20250226348
- Publication date Jul 10, 2025
- Resonac Corporation
- Takahiro KURODA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR PRODUCING A STRUCTURE COMPRISING AT LEAST TWO CHIPS ON A...
- Publication number 20250226225
- Publication date Jul 10, 2025
- SOITEC
- Bruno Ghyselen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Susceptor For High Temperature Semiconductor Process
- Publication number 20250226257
- Publication date Jul 10, 2025
- MICO CERAMICS LTD.
- Mina Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL FOIL WITH CARRIER
- Publication number 20250227855
- Publication date Jul 10, 2025
- Mitsui Mining and Smelting Co., Ltd.
- Toshimi NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAGE AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20250226190
- Publication date Jul 10, 2025
- TOKYO ELECTRON LIMITED
- Takayuki ISHII
- H01 - BASIC ELECTRIC ELEMENTS

for supporting or gripping

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Edge seal for lower electrode assembly

Wafer taping apparatus and method

Method, apparatus, and system for dynamically controlling an electr...

Tape affixing apparatus

Method of manufacturing semiconductor device

Methods of forming semiconductor packages

Method of selectively transferring semiconductor device

Package structure and manufacturing method thereof

Display apparatus and manufacturing method thereof

Supporting InFO packages to reduce warpage

Methods of packaging semiconductor devices and packaged semiconduct...

Semiconductor package having a semiconductor device bonded to a cir...

Electrostatic chuck and semiconductor processing apparatus

Plasma processing apparatus and semiconductor fabrication method us...

Substrate holder and methods of use

Method for manufacturing display device, and transfer substrate for...

Plasma etching apparatus and method

Monolithic chip stacking using a die with double-sided interconnect...

Semiconductor package and method of manufacturing semiconductor pac...

Display device using micro LED and method of manufacturing same

Method for fabricating a chip package

3D semiconductor memory device and structure

Method for manufacturing electronic device

Film stress control for plasma enhanced chemical vapor deposition

Semiconductor devices and methods of manufacturing

Computer-readable recording medium, substrate bonding system, and s...

Stage and manufacturing method thereof

Deposition apparatus and display panel manufacturing apparatus incl...

Chip package assembly, electronic device, and preparation method of...

Alignment apparatus, deposition apparatus, electronic device manufa...

Patents Applicationslast 30 patents

LIGHT-EMITTING ELEMENT ARRAY SUBSTRATE AND METHOD FOR MANUFACTURING...

ULTRA-THIN PACKAGED COMPONENT

CONVEYANCE APPARATUS, TRANSFER METHOD, CONVEYANCE METHOD, AND SEMIC...

METHOD OF FABRICATING MICRO DEVICE PANEL

ETCHING METHOD, PRECOAT METHOD, AND ETCHING APPARATUS

SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...

DEVICE CHIP MANUFACTURING METHOD AND WORKPIECE PROCESSING APPARATUS

SEMICONDUCTOR PACKAGE

IMPLANTATION PROCESS TO MITIGATE BOWING OF WAFERS INTRODUCED BY SPL...

PLASMA PROCESSING APPARATUS AND MOUNTING TABLE THEREOF

MATERIAL FOR POSITIONAL ERROR COMPENSATION IN ASSEMBLY OF DISCRETE...

DIE CLEANING SYSTEMS AND RELATED METHODS

ELECTROSTATIC CHUCK

JIG AND DIE ATTACH APPARATUS FOR INCLUDING THE SAME

BASE, ELECTROSTATIC CHUCK DEVICE, AND MANUFACTURING METHOD OF BASE

WAFER PROCESSING APPARATUS AND WAFER PROCESSING METHOD

PLURALITY OF ADVANCED MULTILEVEL CIRCUIT ATTACHMENTS

WAFER HOLDER DEVICE HAVING HEATING FUNCTION

WAFER SENSOR AND WAFER ALIGNMENT SYSTEM INCLUDING THE SAME

BONDING APPARATUS, BONDING METHOD, AND ARTICLE MANUFACTURING METHOD

ANTENNA IN PACKAGE HAVING ANTENNA ON PACKAGE SUBSTRATE

Workpiece Processing Method

ELECTROSTATIC CHUCK

PLASMA ETCHER WITH EDGE RING AND METHOD OF PROCESSING SEMICONDUCTOR...

ADHESIVE FILM FOR SEMICONDUCTORS, DICING DIE BONDING FILM, AND METH...

ADHESIVE FILM FOR SEMICONDUCTORS, DICING/DIE-BONDING FILM, AND METH...

METHOD FOR PRODUCING A STRUCTURE COMPRISING AT LEAST TWO CHIPS ON A...

Susceptor For High Temperature Semiconductor Process

METAL FOIL WITH CARRIER

STAGE AND SUBSTRATE PROCESSING APPARATUS