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H01L21/683

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/683for supporting or gripping

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Inspection apparatus
- Patent number 12,270,790
- Issue date Apr 8, 2025
- Disco Corporation
- Naoki Murazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer chuck structure with holes in upper surface to improve temper...
- Patent number 12,272,585
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Jung Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wafer clamping method and semiconductor manufacturing apparatus
- Patent number 12,272,588
- Issue date Apr 8, 2025
- NISSIN ION EQUIPMENT CO., LTD.
- Takayuki Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ejector pin device for chip packaging
- Patent number 12,272,589
- Issue date Apr 8, 2025
- CHIPMORE TECHNOLOGY CORPORATION LIMITED
- Chaochao Jin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated fan-out package with 3D magnetic core inductor
- Patent number 12,272,637
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacking structure, package structure and method of fabricating the...
- Patent number 12,272,674
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature control system with circulating fluid
- Patent number 12,271,157
- Issue date Apr 8, 2025
- Kelk Ltd.
- Kazuhiro Mimura
- G05 - CONTROLLING REGULATING
Information Patent Grant
Process control enabled VDC sensor for plasma process
- Patent number 12,272,520
- Issue date Apr 8, 2025
- Tokyo Electron Limited
- Merritt Funk
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of forming semiconductor devices in a layer of epitaxial si...
- Patent number 12,272,738
- Issue date Apr 8, 2025
- Infineon Technologies AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stage and plasma processing apparatus
- Patent number 12,272,528
- Issue date Apr 8, 2025
- Tokyo Electron Limited
- Yasuharu Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor memory device and structure with memory and metal...
- Patent number 12,272,586
- Issue date Apr 8, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Holding device and method of manufacturing holding device
- Patent number 12,273,965
- Issue date Apr 8, 2025
- NITERRA CO., LTD.
- Ryunosuke Sakamaki
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Reduced footprint wafer handling platform
- Patent number 12,272,583
- Issue date Apr 8, 2025
- Lam Research Corporation
- Christopher W. Burkhart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked dies and methods for forming bonded structures
- Patent number 12,266,650
- Issue date Apr 1, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive tapes for receiving discrete components
- Patent number 12,266,558
- Issue date Apr 1, 2025
- KULICKE & SOFFA NETHERLANDS B.V.
- Val Marinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer placement table
- Patent number 12,266,557
- Issue date Apr 1, 2025
- NGK Insulators, Ltd.
- Tatsuya Kuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated devices in semiconductor packages and methods of forming...
- Patent number 12,266,619
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic heater and method of manufacturing the same
- Patent number 12,267,919
- Issue date Apr 1, 2025
- NGK Insulators, Ltd.
- Kazuhiro Nobori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer placement table
- Patent number 12,266,515
- Issue date Apr 1, 2025
- NGK Insulators, Ltd.
- Tatsuya Kuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system, and method for non-contact temperature monitorin...
- Patent number 12,266,551
- Issue date Apr 1, 2025
- Applied Materials, Inc.
- Bhaskar Prasad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of adjusting a tilt between a bonding tool assembly and a s...
- Patent number 12,266,556
- Issue date Apr 1, 2025
- Kulicke and Soffa Industries, Inc.
- Matthew Tarabulski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor package, method of handling w...
- Patent number 12,266,559
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Shiuan Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package unit and associated packaging method
- Patent number 12,266,583
- Issue date Apr 1, 2025
- Chengdu Monolithic Power Systems Co., Ltd.
- Yingjiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor device including forming a first...
- Patent number 12,266,612
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package process and package structure
- Patent number 12,266,632
- Issue date Apr 1, 2025
- Advanced Semiconductor Engineering, Inc.
- Chi-Chih Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding system and bonding method
- Patent number 12,261,147
- Issue date Mar 25, 2025
- BONDTECH CO., LTD.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate test apparatus and method for measuring dechucking force...
- Patent number 12,261,072
- Issue date Mar 25, 2025
- Semes Co., Ltd.
- Jong Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing apparatus and wafer processing method
- Patent number 12,261,076
- Issue date Mar 25, 2025
- ZEUS CO., LTD.
- Seung Dae Baek
- B08 - CLEANING
Information Patent Grant
Work stage and exposure apparatus
- Patent number 12,261,077
- Issue date Mar 25, 2025
- Ushio Denki Kabushiki Kaisha
- Shunta Sugisaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for mass transfer of mini light-emitting diodes (...
- Patent number 12,261,239
- Issue date Mar 25, 2025
- GUANGDONG UNIVERSITY OF TECHNOLOGY
- Yun Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS AND METHODS FOR MAINTAINING VACUUM CHECKING FORCE ON SEMI...
- Publication number 20250118590
- Publication date Apr 10, 2025
- Axcelis Technologies, Inc.
- Michael F. Leahy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF TUNING SYSTEMS INCLUDING TUNING CIRCUITS HAVING IMPEDANCES FOR S...
- Publication number 20250118535
- Publication date Apr 10, 2025
- LAM RESEARCH CORPORATION
- David French
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE SUPPORT ASSEMBLY WITH DIELETRIC COOLING PLATE
- Publication number 20250119076
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Arvinder Manmohan Singh Chadha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250118678
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATICALLY SECURED SUBSTRATE SUPPORT ASSEMBLY
- Publication number 20250118586
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Arvinder Manmohan Singh Chadha
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR DIVIDING WAFER
- Publication number 20250118601
- Publication date Apr 10, 2025
- Disco Corporation
- Shinya ARUGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20250118642
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hsuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PEDESTAL HEATER WITH SUBSTRATE TEMPERATURE MEASUREMENT SYSTEM
- Publication number 20250118578
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Ajith Karonnan Ramapurath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CALIBRATION HARDWARE FOR ION IMPLANTER
- Publication number 20250118585
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lung-Yin Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIMULTANEOUS BONDING APPROACH FOR HIGH QUALITY WAFER STACKING APPLI...
- Publication number 20250118587
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE TRANSFER METHOD AND APPARATUS FOR MULTI-CHIP MODULE
- Publication number 20250118589
- Publication date Apr 10, 2025
- Silicon Box, Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE PROCESSING METHOD
- Publication number 20250118561
- Publication date Apr 10, 2025
- Disco Corporation
- Younsuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEALING RING
- Publication number 20250116332
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Jihwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR CHIP
- Publication number 20250118565
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Hyunho Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES
- Publication number 20250118574
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Jeonggi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE, MANUFACTURING EQUIPMENT OF DISPLAY DEVICE, AND MANU...
- Publication number 20250118588
- Publication date Apr 10, 2025
- SAMSUNG DISPLAY CO., LTD.
- Dong Jun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHODS FOR A MULTI-STACK ARCHITECTURE
- Publication number 20250118677
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Jin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARCHITECTURES FOR FACILITATING BONDING IN WAFER-LEVEL SELECTIVE TRA...
- Publication number 20250112077
- Publication date Apr 3, 2025
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VACUUM WAFER CHUCK FOR MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20250112081
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Chien-Fa LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-MATERIAL CHUCK
- Publication number 20250112083
- Publication date Apr 3, 2025
- TOKYO ELECTRON LIMITED
- Christopher NETZBAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE-GRAIN INTEGRATION OF RADIO FREQUENCY ANTENNAS, INTERCONNECTS,...
- Publication number 20250112188
- Publication date Apr 3, 2025
- Intel Corporation
- Georgios C. Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVAL OF DEFECTIVE DIES ON DONOR WAFERS FOR SELECTIVE LAYER TRANSFER
- Publication number 20250112067
- Publication date Apr 3, 2025
- Intel Corporation
- Thomas L. Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANISM FOR FINE ADJUSTING AN ANGLE OF A SEMICONDUCTOR WAFER FIXTURE
- Publication number 20250112084
- Publication date Apr 3, 2025
- CHENG MEI INSTRUMENT TECHNOLOGY CO., LTD.
- Te-Chun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE-GRAIN INTEGRATION OF GROUP III-V DEVICES
- Publication number 20250112210
- Publication date Apr 3, 2025
- Intel Corporation
- Han Wui Then
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20250112080
- Publication date Apr 3, 2025
- ROHM CO., LTD.
- Takaaki YAMANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURAL SUPPORT LAYER TO PROTECT SELECTIVE TRANSFER LAYER DURING...
- Publication number 20250112092
- Publication date Apr 3, 2025
- Intel Corportation
- Thomas L. Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE-GRAIN INTEGRATION OF RADIO FREQUENCY AND HIGH-VOLTAGE DEVICES
- Publication number 20250112216
- Publication date Apr 3, 2025
- Intel Corporation
- Qiang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-WAFER FACE-TO-BACK HYBRID BONDING WITHOUT SUPPORT CARRIER
- Publication number 20250112047
- Publication date Apr 3, 2025
- ADVANCED MICRO DEVICES, INC.
- Chandra Sekhar Mandalapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER THINNING TAPE AND PREPARATION METHOD THEREOF, AND WAFER GRIND...
- Publication number 20250112079
- Publication date Apr 3, 2025
- WUHAN CHOICE TECHNOLOGY CO., LTD.
- De WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUND ELECTRODE FORMED IN AN ELECTROSTATIC CHUCK FOR A PLASMA PROC...
- Publication number 20250112076
- Publication date Apr 3, 2025
- Applied Materials, Inc.
- Michael R. RICE
- H01 - BASIC ELECTRIC ELEMENTS

for supporting or gripping

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Inspection apparatus

Wafer chuck structure with holes in upper surface to improve temper...

Wafer clamping method and semiconductor manufacturing apparatus

Ejector pin device for chip packaging

Integrated fan-out package with 3D magnetic core inductor

Stacking structure, package structure and method of fabricating the...

Temperature control system with circulating fluid

Process control enabled VDC sensor for plasma process

Methods of forming semiconductor devices in a layer of epitaxial si...

Stage and plasma processing apparatus

3D semiconductor memory device and structure with memory and metal...

Holding device and method of manufacturing holding device

Reduced footprint wafer handling platform

Stacked dies and methods for forming bonded structures

Adhesive tapes for receiving discrete components

Wafer placement table

Integrated devices in semiconductor packages and methods of forming...

Ceramic heater and method of manufacturing the same

Wafer placement table

Apparatus, system, and method for non-contact temperature monitorin...

Methods of adjusting a tilt between a bonding tool assembly and a s...

Method of manufacturing semiconductor package, method of handling w...

Flip chip package unit and associated packaging method

Method for forming a semiconductor device including forming a first...

Package process and package structure

Bonding system and bonding method

Substrate test apparatus and method for measuring dechucking force...

Wafer processing apparatus and wafer processing method

Work stage and exposure apparatus

Device and method for mass transfer of mini light-emitting diodes (...

Patents Applicationslast 30 patents

APPARATUS AND METHODS FOR MAINTAINING VACUUM CHECKING FORCE ON SEMI...

RF TUNING SYSTEMS INCLUDING TUNING CIRCUITS HAVING IMPEDANCES FOR S...

SUBSTRATE SUPPORT ASSEMBLY WITH DIELETRIC COOLING PLATE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTROSTATICALLY SECURED SUBSTRATE SUPPORT ASSEMBLY

METHOD AND APPARATUS FOR DIVIDING WAFER

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME

PEDESTAL HEATER WITH SUBSTRATE TEMPERATURE MEASUREMENT SYSTEM

CALIBRATION HARDWARE FOR ION IMPLANTER

SIMULTANEOUS BONDING APPROACH FOR HIGH QUALITY WAFER STACKING APPLI...

DIE TRANSFER METHOD AND APPARATUS FOR MULTI-CHIP MODULE

WORKPIECE PROCESSING METHOD

SEALING RING

METHOD OF MANUFACTURING SEMICONDUCTOR CHIP

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES

DISPLAY DEVICE, MANUFACTURING EQUIPMENT OF DISPLAY DEVICE, AND MANU...

SYSTEM AND METHODS FOR A MULTI-STACK ARCHITECTURE

ARCHITECTURES FOR FACILITATING BONDING IN WAFER-LEVEL SELECTIVE TRA...

VACUUM WAFER CHUCK FOR MANUFACTURING SEMICONDUCTOR DEVICES

MULTI-MATERIAL CHUCK

FINE-GRAIN INTEGRATION OF RADIO FREQUENCY ANTENNAS, INTERCONNECTS,...

REMOVAL OF DEFECTIVE DIES ON DONOR WAFERS FOR SELECTIVE LAYER TRANSFER

MECHANISM FOR FINE ADJUSTING AN ANGLE OF A SEMICONDUCTOR WAFER FIXTURE

FINE-GRAIN INTEGRATION OF GROUP III-V DEVICES

WAFER STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES

STRUCTURAL SUPPORT LAYER TO PROTECT SELECTIVE TRANSFER LAYER DURING...

FINE-GRAIN INTEGRATION OF RADIO FREQUENCY AND HIGH-VOLTAGE DEVICES

CHIP-ON-WAFER FACE-TO-BACK HYBRID BONDING WITHOUT SUPPORT CARRIER

WAFER THINNING TAPE AND PREPARATION METHOD THEREOF, AND WAFER GRIND...

GROUND ELECTRODE FORMED IN AN ELECTROSTATIC CHUCK FOR A PLASMA PROC...