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ELECTROSTATIC CHUCK ASSEMBLY
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Publication number 20240145220
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Publication date May 2, 2024
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Applied Materials, Inc.
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Jaeyong CHO
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20240145397
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Publication date May 2, 2024
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Samsung Electronics Co., Ltd.
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Jeongho LEE
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H01 - BASIC ELECTRIC ELEMENTS
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SUBSTRATE PROCESSING APPARATUS
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Publication number 20240145288
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Publication date May 2, 2024
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Samsung Electronics Co., Ltd.
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Youngbok LEE
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C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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WAFER PROCESSING APPARATUS
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Publication number 20240136216
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Publication date Apr 25, 2024
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Samsung Electronics Co., Ltd.
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Youngho Hwang
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H01 - BASIC ELECTRIC ELEMENTS
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NANOSECOND PULSER ADC SYSTEM
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Publication number 20240136152
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Publication date Apr 25, 2024
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Eagle Harbor Technologies, Inc.
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Kenneth Miller
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H01 - BASIC ELECTRIC ELEMENTS
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TRANSFER OF MICRO DEVICES
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Publication number 20240136215
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Publication date Apr 25, 2024
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VueReal Inc.
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Gholamreza CHAJI
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H01 - BASIC ELECTRIC ELEMENTS
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SUBSTRATE RESTRAINING SYSTEM
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Publication number 20240136218
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Publication date Apr 25, 2024
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ASML NETHERLANDS B.V.
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Marinus Augustinus Christiaan VERSCHUREN
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H01 - BASIC ELECTRIC ELEMENTS
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DEPOSITION APPARATUS
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Publication number 20240131555
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Publication date Apr 25, 2024
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SAMSUNG DISPLAY CO., LTD.
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MINCHUL SONG
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B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
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SUBSTRATE HOLDING MEMBER
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Publication number 20240128117
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Publication date Apr 18, 2024
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Niterra Co., Ltd.
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Kazuaki OOYACHI
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H01 - BASIC ELECTRIC ELEMENTS
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METHOD OF PROCESSING WAFER
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Publication number 20240128086
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Publication date Apr 18, 2024
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Disco Corporation
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Hiroshi MORIKAZU
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H01 - BASIC ELECTRIC ELEMENTS