for supporting or gripping

Industry

CPC
H01L21/683

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/683for supporting or gripping

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package including interposer
- Patent number 12,170,249
- Issue date Dec 17, 2024
- Samsung Electronics Co., Ltd.
- Jong-youn Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and abnormality detection method
- Patent number 12,170,217
- Issue date Dec 17, 2024
- Tokyo Electron Limited
- Hiroaki Chihaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating active-bridge-coupled GPU chiplets
- Patent number 12,170,263
- Issue date Dec 17, 2024
- Advanced Micro Devices, Inc.
- Skyler J. Saleh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electrostatic chuck
- Patent number 12,170,219
- Issue date Dec 17, 2024
- Kyocera Corporation
- Naoki Furukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for separating dies from a semiconductor substrate
- Patent number 12,170,226
- Issue date Dec 17, 2024
- Infineon Technologies AG
- Franz-Josef Pichler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma treatment apparatus, a method of monitoring a process of man...
- Patent number 12,170,233
- Issue date Dec 17, 2024
- Samsung Electronics Co., Ltd.
- Meehyun Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,170,274
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer support table and RF rod
- Patent number 12,170,190
- Issue date Dec 17, 2024
- NGK Insulators, Ltd.
- Yutaka Unno
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate supporting apparatus and substrate treating apparatus inc...
- Patent number 12,170,191
- Issue date Dec 17, 2024
- Semes Co., Ltd.
- Jong Gun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,170,251
- Issue date Dec 17, 2024
- Samsung Electronics Co., Ltd.
- Kyoung Lim Suk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages and methods of forming the same
- Patent number 12,170,264
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for cleaning electrostatic chuck
- Patent number 12,170,218
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yueh-Lin Yang
- B08 - CLEANING
Information Patent Grant
Semiconductor devices and methods of manufacturing
- Patent number 12,166,025
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chang-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 12,165,978
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate support and substrate processing apparatus
- Patent number 12,165,854
- Issue date Dec 10, 2024
- Tokyo Electron Limited
- Nobutaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for ring frame cleaning and inspection
- Patent number 12,165,901
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Fa Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for bonding
- Patent number 12,165,888
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Workpiece holding tool
- Patent number 12,165,897
- Issue date Dec 10, 2024
- Kyocera Corporation
- Naoki Furukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mechanical separation for a double layer transfer
- Patent number 12,165,900
- Issue date Dec 10, 2024
- Soitec
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus and substrate bonding method
- Patent number 12,165,902
- Issue date Dec 10, 2024
- Nikon Corporation
- Hajime Mitsuishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chuck assembly, planarization process, apparatus and method of manu...
- Patent number 12,165,903
- Issue date Dec 10, 2024
- Canon Kabushiki Kaisha
- Seth J. Bamesberger
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor substrate processing apparatus and semiconductor subs...
- Patent number 12,165,933
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Inkeun Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sample holder
- Patent number 12,162,110
- Issue date Dec 10, 2024
- Kyocera Corporation
- Hiromasa Takemori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of package
- Patent number 12,166,014
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems of forming metal interconnect layers using engi...
- Patent number 12,165,881
- Issue date Dec 10, 2024
- Rashid Mavliev
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Adjustable wafer chuck
- Patent number 12,165,898
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Hsi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method for manufacturing display device
- Patent number 12,167,665
- Issue date Dec 10, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electrostatic chuck with porous plug
- Patent number 12,162,111
- Issue date Dec 10, 2024
- Applied Materials, Inc.
- Arvinder Chadha
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatuses for executing a direct transfer of a semiconductor devi...
- Patent number 12,165,895
- Issue date Dec 10, 2024
- Cowles Semi, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate support and substrate processing apparatus
- Patent number 12,165,896
- Issue date Dec 10, 2024
- Tokyo Electron Limited
- Akira Nagayama
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CRYOGENIC SUSCEPTOR AND ELECTRIC CONNECTOR ASSEMBLY USED THEREIN
- Publication number 20240420985
- Publication date Dec 19, 2024
- MiCo Ceramics Ltd.
- Hyekyong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ARRANGEMENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240420988
- Publication date Dec 19, 2024
- EPISTAR CORPORATION
- Chien-Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER HEAD AND METHOD OF FORMING SAME
- Publication number 20240420983
- Publication date Dec 19, 2024
- Xerox Corporation
- Christopher L. Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEASUREMENT METHOD, PEELING METHOD, AND PEELING STRENGTH MEASURING...
- Publication number 20240421006
- Publication date Dec 19, 2024
- Yamaha Robotics Holdings Co., Ltd.
- HIROSHI KIKUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE SUPPORT
- Publication number 20240420932
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Yogananda Sarode Vishwanath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC SUBSTRATE SUPPORT
- Publication number 20240420984
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Andrew Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for the Pulsed Laser Ejection of Multiple Epitaxial Structu...
- Publication number 20240421001
- Publication date Dec 19, 2024
- Benjamin Reeves
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC SYSTEM
- Publication number 20240421266
- Publication date Dec 19, 2024
- EPISTAR CORPORATION
- Min-Hsun HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESISTIVITY-CONTROLLED DIELECTRIC MATERIALS FOR SUBSTRATE SUPPORTS...
- Publication number 20240420933
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Amir H. Tavakoli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING MESAS ON AN ELECTROSTATIC CHUCK
- Publication number 20240420986
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Wendell Glenn BOYD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Donor and Transfer Method of Light Emitting Diode Using the Same
- Publication number 20240420987
- Publication date Dec 19, 2024
- LG Display Co., Ltd.
- Suhun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240413121
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- CHIH-TING LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PLACEMENT TABLE
- Publication number 20240412998
- Publication date Dec 12, 2024
- NGK Insulators, Ltd.
- Taro USAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Aluminum Nitride Assemblage
- Publication number 20240413000
- Publication date Dec 12, 2024
- MORGAN ADVANCED CERAMICS, INC.
- Chengtsin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER SUBSTRATE AND LIGHT EMITTING DIODE TRANSFER METHOD USING T...
- Publication number 20240413129
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Wonsik CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240412982
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUSCEPTOR AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240412999
- Publication date Dec 12, 2024
- MICO CERAMICS LTD.
- Junghyun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS
- Publication number 20240411235
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Dae Geun YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALUMINA-BASED SINTERED BODY AND ELECTROSTATIC CHUCK
- Publication number 20240409468
- Publication date Dec 12, 2024
- Niterra Co., Ltd.
- Motoki HOTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR STACKING SUBSTRATES AND METHOD FOR THE SAME
- Publication number 20240413093
- Publication date Dec 12, 2024
- Nikon Corporation
- Isao Sugaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH TEMPERATURE BIASABLE HEATER WITH ADVANCED FAR EDGE ELECTRODE,...
- Publication number 20240412957
- Publication date Dec 12, 2024
- Applied Materials, Inc.
- Gautam PISHARODY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20240413028
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE BODY AND PREPARATION METHOD THEREFOR
- Publication number 20240404938
- Publication date Dec 5, 2024
- SKY CHIP INTERCONNECTION TECHNOLOGY CO., LTD.
- Shijie ZHONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MAKING
- Publication number 20240404965
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chen-Hsuan YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSED STACKED DIES
- Publication number 20240404990
- Publication date Dec 5, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECEPTOR SUBSTRATE, METHOD FOR MANUFACTURING RECEPTOR SUBSTRATE, TR...
- Publication number 20240404865
- Publication date Dec 5, 2024
- Shin-Etsu Chemical Co., Ltd.
- Hiroshi Yamaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS INCLUDING A BONDING HEAD AND A METHOD OF USING THE SAME
- Publication number 20240404867
- Publication date Dec 5, 2024
- Canon Kabushiki Kaisha
- Byung-Jin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE BONDING METHOD FOR THE MANUFACTURE OF SEMICONDUCTOR CHU...
- Publication number 20240404869
- Publication date Dec 5, 2024
- WATLOW ELECTRIC MANUFACTURING COMPANY
- Jason STEPHENS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDING COMPOSITION, SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATIN...
- Publication number 20240404898
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia Hao Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOLDING DEVICE
- Publication number 20240404796
- Publication date Dec 5, 2024
- Niterra Co., Ltd.
- Yasuaki KIMIKADO
- H01 - BASIC ELECTRIC ELEMENTS

for supporting or gripping

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package including interposer

Substrate processing apparatus and abnormality detection method

Fabricating active-bridge-coupled GPU chiplets

Electrostatic chuck

Method for separating dies from a semiconductor substrate

Plasma treatment apparatus, a method of monitoring a process of man...

Semiconductor packages and methods of forming same

Wafer support table and RF rod

Substrate supporting apparatus and substrate treating apparatus inc...

Semiconductor package

Integrated circuit packages and methods of forming the same

Method for cleaning electrostatic chuck

Semiconductor devices and methods of manufacturing

Package structure and method of manufacturing the same

Substrate support and substrate processing apparatus

System and method for ring frame cleaning and inspection

Method and system for bonding

Workpiece holding tool

Method of mechanical separation for a double layer transfer

Substrate bonding apparatus and substrate bonding method

Chuck assembly, planarization process, apparatus and method of manu...

Semiconductor substrate processing apparatus and semiconductor subs...

Sample holder

Manufacturing method of package

Methods and systems of forming metal interconnect layers using engi...

Adjustable wafer chuck

Display device and method for manufacturing display device

Electrostatic chuck with porous plug

Apparatuses for executing a direct transfer of a semiconductor devi...

Substrate support and substrate processing apparatus

Patents Applicationslast 30 patents

CRYOGENIC SUSCEPTOR AND ELECTRIC CONNECTOR ASSEMBLY USED THEREIN

SEMICONDUCTOR DEVICE ARRANGEMENT AND METHOD OF MANUFACTURING THE SAME

TRANSFER HEAD AND METHOD OF FORMING SAME

MEASUREMENT METHOD, PEELING METHOD, AND PEELING STRENGTH MEASURING...

SUBSTRATE SUPPORT

ELECTROSTATIC SUBSTRATE SUPPORT

Process for the Pulsed Laser Ejection of Multiple Epitaxial Structu...

OPTOELECTRONIC SYSTEM

RESISTIVITY-CONTROLLED DIELECTRIC MATERIALS FOR SUBSTRATE SUPPORTS...

FORMING MESAS ON AN ELECTROSTATIC CHUCK

Donor and Transfer Method of Light Emitting Diode Using the Same

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

WAFER PLACEMENT TABLE

Aluminum Nitride Assemblage

TRANSFER SUBSTRATE AND LIGHT EMITTING DIODE TRANSFER METHOD USING T...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

CERAMIC SUSCEPTOR AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR MANUFACTURING APPARATUS

ALUMINA-BASED SINTERED BODY AND ELECTROSTATIC CHUCK

APPARATUS FOR STACKING SUBSTRATES AND METHOD FOR THE SAME

HIGH TEMPERATURE BIASABLE HEATER WITH ADVANCED FAR EDGE ELECTRODE,...

DIE STRUCTURES AND METHODS OF FORMING THE SAME

PACKAGE BODY AND PREPARATION METHOD THEREFOR

SEMICONDUCTOR DEVICE AND METHOD OF MAKING

PROCESSED STACKED DIES

RECEPTOR SUBSTRATE, METHOD FOR MANUFACTURING RECEPTOR SUBSTRATE, TR...

APPARATUS INCLUDING A BONDING HEAD AND A METHOD OF USING THE SAME

SOLID-STATE BONDING METHOD FOR THE MANUFACTURE OF SEMICONDUCTOR CHU...

MOLDING COMPOSITION, SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATIN...

HOLDING DEVICE