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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 12,368,068
- Issue date Jul 22, 2025
- Fuji Electric Co., Ltd.
- Yuya Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor packages
- Patent number 12,368,149
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of selectively transferring semiconductor device
- Patent number 12,369,431
- Issue date Jul 22, 2025
- Epistar Corporation
- Hao-Min Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,368,084
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus and manufacturing method thereof
- Patent number 12,368,145
- Issue date Jul 22, 2025
- Seoul Semiconductor Co., Ltd.
- Motonobu Takeya
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Supporting InFO packages to reduce warpage
- Patent number 12,368,115
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of packaging semiconductor devices and packaged semiconduct...
- Patent number 12,362,260
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a semiconductor device bonded to a cir...
- Patent number 12,362,276
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing display device, and transfer substrate for...
- Patent number 12,362,220
- Issue date Jul 15, 2025
- LG Electronics Inc.
- Jungsub Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic chip stacking using a die with double-sided interconnect...
- Patent number 12,362,325
- Issue date Jul 15, 2025
- Intel Corporation
- Anup Pancholi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
- Patent number 12,362,326
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device using micro LED and method of manufacturing same
- Patent number 12,362,335
- Issue date Jul 15, 2025
- LG Electronics Inc.
- Chilkeun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a chip package
- Patent number 12,362,178
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor memory device and structure
- Patent number 12,362,219
- Issue date Jul 15, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronic device
- Patent number 12,362,221
- Issue date Jul 15, 2025
- MITSUI CHEMICALS ICT MATERIA, INC.
- Toru Miura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor devices and methods of manufacturing
- Patent number 12,362,341
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chang-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package assembly, electronic device, and preparation method of...
- Patent number 12,354,967
- Issue date Jul 8, 2025
- Huawei Technologies Co., Ltd.
- Zhaozheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing method
- Patent number 12,354,902
- Issue date Jul 8, 2025
- Disco Corporation
- Jinyan Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Singulation systems and related methods
- Patent number 12,354,917
- Issue date Jul 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for splitting semiconductor wafers
- Patent number 12,356,700
- Issue date Jul 8, 2025
- Infineon Technologies AG
- Christian Beyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display projector systems and devices for augmented-reality
- Patent number 12,355,022
- Issue date Jul 8, 2025
- Meta Platforms Technologies, LLC
- Rajendra D. Pendse
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package including photo imageable dielectric
- Patent number 12,354,974
- Issue date Jul 8, 2025
- Samsung Electronics Co., Ltd.
- Yuseon Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Debonding structures for wafer bonding
- Patent number 12,347,717
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Ting Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,347,749
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor components having conductive vias with aligned back s...
- Patent number 12,347,731
- Issue date Jul 1, 2025
- Micron Technology, Inc.
- Jin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microdevice integration into system substrate
- Patent number 12,349,527
- Issue date Jul 1, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing chips
- Patent number 12,341,068
- Issue date Jun 24, 2025
- Disco Corporation
- Hideyuki Sandoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer cleaning apparatus
- Patent number 12,341,052
- Issue date Jun 24, 2025
- ZEUS CO., LTD.
- Seung Dae Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and manufacturing method of electronic device
- Patent number 12,341,142
- Issue date Jun 24, 2025
- INNOLUX CORPORATION
- Shun-Yuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device including resin layers
- Patent number 12,341,024
- Issue date Jun 24, 2025
- Kioxia Corporation
- Eiji Takano
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LIGHT-EMITTING ELEMENT ARRAY SUBSTRATE AND METHOD FOR MANUFACTURING...
- Publication number 20250239477
- Publication date Jul 24, 2025
- AUO Corporation
- Kuan-Yi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING MICRO DEVICE PANEL
- Publication number 20250239470
- Publication date Jul 24, 2025
- PlayNitride Display Co., Ltd.
- Yun-Li Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250239501
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPLANTATION PROCESS TO MITIGATE BOWING OF WAFERS INTRODUCED BY SPL...
- Publication number 20250232977
- Publication date Jul 17, 2025
- II-VI Delaware, Inc.
- Jeremy Andre Turcaud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATERIAL FOR POSITIONAL ERROR COMPENSATION IN ASSEMBLY OF DISCRETE...
- Publication number 20250233002
- Publication date Jul 17, 2025
- KULICKE & SOFFA NETHERLANDS B.V.
- Matthew R. Semler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA IN PACKAGE HAVING ANTENNA ON PACKAGE SUBSTRATE
- Publication number 20250233301
- Publication date Jul 17, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Workpiece Processing Method
- Publication number 20250226229
- Publication date Jul 10, 2025
- LINTEC CORPORATION
- Hayato Nakanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A STRUCTURE COMPRISING AT LEAST TWO CHIPS ON A...
- Publication number 20250226225
- Publication date Jul 10, 2025
- SOITEC
- Bruno Ghyselen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ARRANGEMENT
- Publication number 20250218850
- Publication date Jul 3, 2025
- EPISTAR CORPORATION
- Chang-Tai HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION FOR TEMPORARY FIXATION
- Publication number 20250215289
- Publication date Jul 3, 2025
- DENKA COMPANY LIMITED
- Takako HOSHINO TANIGAWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
COMPONENT PROCESSING APPARATUS
- Publication number 20250218830
- Publication date Jul 3, 2025
- PlayNitride Display Co., Ltd.
- Yen-Mu Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE BY USING CARRIER SUBS...
- Publication number 20250219020
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Junho CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages And Methods Of Forming The Same
- Publication number 20250219024
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING DISPLAY DEVICE
- Publication number 20250218848
- Publication date Jul 3, 2025
- SAMSUNG DISPLAY CO., LTD.
- Jae Gwang UM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFIGURABLE CARRIER FOR TRANSFER AND SELF-ASSEMBLY OF MULTIPLE INT...
- Publication number 20250218847
- Publication date Jul 3, 2025
- Intel Corporation
- Veronica A. Strong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING APPARATUS
- Publication number 20250218849
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Sangjun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE SHEET FOR SEMICONDUCTOR DEVICE
- Publication number 20250218851
- Publication date Jul 3, 2025
- INNOX ADVANCED MATERIALS CO., LTD.
- Keun-Young Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20250210401
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-TRANSFER PRINTING METHODS
- Publication number 20250210399
- Publication date Jun 26, 2025
- X-CELEPRINT LIMITED
- Ronald S. Cok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE TAPES FOR RECEIVING DISCRETE COMPONENTS
- Publication number 20250210404
- Publication date Jun 26, 2025
- KULICKE & SOFFA NETHERLANDS B.V.
- Val Marinov
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CARRIER SUBSTRATE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE...
- Publication number 20250210400
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Taehoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES
- Publication number 20250201762
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Sungmin MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFO STRUCTURE WITH COPPER PILLAR HAVING REVERSED PROFILE
- Publication number 20250201617
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING/DIE-BONDING FILM AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20250201618
- Publication date Jun 19, 2025
- Resonac Corporation
- Tsuyoshi TAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHEET FOR WORKPIECE PROCESSING AND MANUFACTURING METHOD OF PROCESSE...
- Publication number 20250201619
- Publication date Jun 19, 2025
- LINTEC CORPORATION
- Akio FUKUMOTO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PARALLEL ASSEMBLY OF DISCRETE COMPONENTS ONTO A SUBSTRATE
- Publication number 20250201620
- Publication date Jun 19, 2025
- KULICKE & SOFFA NETHERLANDS B.V.
- Val Marinov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MANUFACTURING DEVICE AND SEMICONDUCTOR DEVICE MANUFAC...
- Publication number 20250201616
- Publication date Jun 19, 2025
- KIOXIA Corporation
- Yuusuke TAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATING DEVICE AND METHOD OF FABRICATING SEMICONDUCTOR CHIP USIN...
- Publication number 20250201597
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- YEONG JUN JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250201632
- Publication date Jun 19, 2025
- DENSO CORPORATION
- Yuji NAGUMO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
- Publication number 20250201753
- Publication date Jun 19, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS

for supporting or gripping

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing semiconductor device

Methods of forming semiconductor packages

Method of selectively transferring semiconductor device

Package structure and manufacturing method thereof

Display apparatus and manufacturing method thereof

Supporting InFO packages to reduce warpage

Methods of packaging semiconductor devices and packaged semiconduct...

Semiconductor package having a semiconductor device bonded to a cir...

Method for manufacturing display device, and transfer substrate for...

Monolithic chip stacking using a die with double-sided interconnect...

Semiconductor package and method of manufacturing semiconductor pac...

Display device using micro LED and method of manufacturing same

Method for fabricating a chip package

3D semiconductor memory device and structure

Method for manufacturing electronic device

Semiconductor devices and methods of manufacturing

Chip package assembly, electronic device, and preparation method of...

Wafer processing method

Singulation systems and related methods

Method for splitting semiconductor wafers

Display projector systems and devices for augmented-reality

Semiconductor package including photo imageable dielectric

Debonding structures for wafer bonding

Semiconductor packages

Semiconductor components having conductive vias with aligned back s...

Microdevice integration into system substrate

Method of manufacturing chips

Wafer cleaning apparatus

Electronic device and manufacturing method of electronic device

Method for manufacturing semiconductor device including resin layers

Patents Applicationslast 30 patents

LIGHT-EMITTING ELEMENT ARRAY SUBSTRATE AND METHOD FOR MANUFACTURING...

METHOD OF FABRICATING MICRO DEVICE PANEL

SEMICONDUCTOR PACKAGE

IMPLANTATION PROCESS TO MITIGATE BOWING OF WAFERS INTRODUCED BY SPL...

MATERIAL FOR POSITIONAL ERROR COMPENSATION IN ASSEMBLY OF DISCRETE...

ANTENNA IN PACKAGE HAVING ANTENNA ON PACKAGE SUBSTRATE

Workpiece Processing Method

METHOD FOR PRODUCING A STRUCTURE COMPRISING AT LEAST TWO CHIPS ON A...

SEMICONDUCTOR DEVICE ARRANGEMENT

COMPOSITION FOR TEMPORARY FIXATION

COMPONENT PROCESSING APPARATUS

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE BY USING CARRIER SUBS...

Semiconductor Packages And Methods Of Forming The Same

METHOD OF MANUFACTURING DISPLAY DEVICE

CONFIGURABLE CARRIER FOR TRANSFER AND SELF-ASSEMBLY OF MULTIPLE INT...

WAFER BONDING APPARATUS

ADHESIVE SHEET FOR SEMICONDUCTOR DEVICE

METHOD FOR FORMING SEMICONDUCTOR STRUCTURE

MICRO-TRANSFER PRINTING METHODS

ADHESIVE TAPES FOR RECEIVING DISCRETE COMPONENTS

CARRIER SUBSTRATE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE...

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES

INFO STRUCTURE WITH COPPER PILLAR HAVING REVERSED PROFILE

DICING/DIE-BONDING FILM AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

SHEET FOR WORKPIECE PROCESSING AND MANUFACTURING METHOD OF PROCESSE...

PARALLEL ASSEMBLY OF DISCRETE COMPONENTS ONTO A SUBSTRATE

SEMICONDUCTOR MANUFACTURING DEVICE AND SEMICONDUCTOR DEVICE MANUFAC...

LAMINATING DEVICE AND METHOD OF FABRICATING SEMICONDUCTOR CHIP USIN...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER