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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00

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H01L2221/683for supporting or gripping

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Aligning bumps in fan-out packaging process
- Patent number 12,300,659
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ying-Jui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DBI to SI bonding for simplified handle wafer
- Patent number 12,300,662
- Issue date May 13, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Chandrasekhar Mandalapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for protecting an optoelectronic device against electrostati...
- Patent number 12,300,521
- Issue date May 13, 2025
- Aledia
- Frédéric Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Expanding method and expanding apparatus
- Patent number 12,300,544
- Issue date May 13, 2025
- Disco Corporation
- Jinyan Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 12,300,560
- Issue date May 13, 2025
- Advanced Semiconductor Engineering, Inc.
- Ming-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including heat sink with exposed side from enc...
- Patent number 12,300,584
- Issue date May 13, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Hyung Jun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus and manufacturing method thereof
- Patent number 12,300,685
- Issue date May 13, 2025
- Seoul Semiconductor Co., Ltd.
- Motonobu Takeya
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Infrared debond damage mitigation by copper fill pattern
- Patent number 12,300,615
- Issue date May 13, 2025
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,300,563
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonics integrated circuit package
- Patent number 12,293,974
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages and methods of forming the same
- Patent number 12,293,985
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive for processing a microelectronic substrate, and related me...
- Patent number 12,288,575
- Issue date Apr 29, 2025
- Seagate Technology LLC
- Zubair Ahmed Khan
- B24 - GRINDING POLISHING
Information Patent Grant
Light-emitting diode testing circuit, light-emitting diode testing...
- Patent number 12,288,831
- Issue date Apr 29, 2025
- Epistar Corporation
- Chia-Chen Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive sheet
- Patent number 12,286,569
- Issue date Apr 29, 2025
- Nitto Denko Corporation
- Shusaku Ueno
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
High density interconnection using fanout interposer chiplet
- Patent number 12,283,549
- Issue date Apr 22, 2025
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic device package and method of manufacturing the same
- Patent number 12,283,585
- Issue date Apr 22, 2025
- Advanced Semiconductor Engineering, Inc.
- Chi-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing a self-supporting substrate from a film base s...
- Patent number 12,281,408
- Issue date Apr 22, 2025
- Yiguan Information Technology (Shanghai) Co., Ltd.
- Tao Jiang
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method of fabricating semiconductor package including sub-interpose...
- Patent number 12,278,222
- Issue date Apr 15, 2025
- Samsung Electronics Co., Ltd.
- Yanggyoo Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive tape for semiconductor package manufacturing process and m...
- Patent number 12,275,867
- Issue date Apr 15, 2025
- MODU TECH CO., LTD.
- Byeong Yeon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing display device and display device manufact...
- Patent number 12,278,223
- Issue date Apr 15, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Yosuke Tsukamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package with 3D magnetic core inductor
- Patent number 12,272,637
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacking structure, package structure and method of fabricating the...
- Patent number 12,272,674
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor memory device and structure with memory and metal...
- Patent number 12,272,586
- Issue date Apr 8, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Adhesive tapes for receiving discrete components
- Patent number 12,266,558
- Issue date Apr 1, 2025
- KULICKE & SOFFA NETHERLANDS B.V.
- Val Marinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated devices in semiconductor packages and methods of forming...
- Patent number 12,266,619
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package unit and associated packaging method
- Patent number 12,266,583
- Issue date Apr 1, 2025
- Chengdu Monolithic Power Systems Co., Ltd.
- Yingjiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor device including forming a first...
- Patent number 12,266,612
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package process and package structure
- Patent number 12,266,632
- Issue date Apr 1, 2025
- Advanced Semiconductor Engineering, Inc.
- Chi-Chih Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Info structure with copper pillar having reversed profile
- Patent number 12,261,074
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing method and processing apparatus
- Patent number 12,261,078
- Issue date Mar 25, 2025
- Tokyo Electron Limited
- Takuya Umise
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250157949
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE
- Publication number 20250160096
- Publication date May 15, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET
- Publication number 20250157939
- Publication date May 15, 2025
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOLITHOGRAPHY ALIGNMENT PROCESS FOR BONDED WAFERS
- Publication number 20250157943
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yeong-Jyh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH
- Publication number 20250157985
- Publication date May 15, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE FOR HEAT DISSIPATION
- Publication number 20250157876
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE DEVICE
- Publication number 20250157904
- Publication date May 15, 2025
- InnoLux Corporation
- Hsueh-Hsuan Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE
- Publication number 20250159812
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MICRODEVICE INTEGRATION INTO SYSTEM SUBSTRATE
- Publication number 20250160095
- Publication date May 15, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS FORMED UTILIZING DU...
- Publication number 20250157956
- Publication date May 15, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Manufacturing Display Device and Display Device Manufact...
- Publication number 20250158000
- Publication date May 15, 2025
- SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Yosuke TSUKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES
- Publication number 20250157870
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC MICRODEVICE
- Publication number 20250160088
- Publication date May 15, 2025
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH WARPAGE-CONTROL ELEMENT
- Publication number 20250157974
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Jan PEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER DICING FOR SINGULATION
- Publication number 20250157858
- Publication date May 15, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Michael Todd Wyant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH REINFORCED ELEMENT
- Publication number 20250149469
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATE PEELING METHOD, LAMINATE, AND LAMINATE PRODUCTION METHOD
- Publication number 20250145863
- Publication date May 8, 2025
- NISSAN CHEMICAL CORPORATION
- Kazuhiro SAWADA
- B32 - LAYERED PRODUCTS
Information Patent Application
COMPOSITE COMPONENT DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250149423
- Publication date May 8, 2025
- Murata Manufacturing Co., Ltd.
- Tatsuya FUNAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149424
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS ANNEALING METHOD AND DEVICE
- Publication number 20250149510
- Publication date May 8, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149425
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING TO ALIGNMENT MARKS WITH DUMMY ALIGNMENT MARKS
- Publication number 20250149500
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DEVICE GRADED EMBEDDING PACKAGE SUBSTRATE AND MANUFACTURING M...
- Publication number 20250149461
- Publication date May 8, 2025
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO HEATER MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250149372
- Publication date May 8, 2025
- ASTI GLOBAL INC., TAIWAN
- Chien-Shou Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC DISCHARGE DEVICES WITH METALLIZED DIES
- Publication number 20250140620
- Publication date May 1, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Thomas KRONENBERG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING PRE-MOLDED LEAD FRAME FOR PACKAGING
- Publication number 20250140573
- Publication date May 1, 2025
- PANJIT INTERNATIONAL INC.
- Chung Hsiung HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING APPARATUS AND DIE BONDING METHOD USING THE SAME
- Publication number 20250140588
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Ilyoung HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING 3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH T...
- Publication number 20250133749
- Publication date Apr 24, 2025
- Monolithic 3D Inc.
- Deepak C. Sekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250132268
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Ming Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...
- Publication number 20250132187
- Publication date Apr 24, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE

for supporting or gripping

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Aligning bumps in fan-out packaging process

DBI to SI bonding for simplified handle wafer

Method for protecting an optoelectronic device against electrostati...

Expanding method and expanding apparatus

Semiconductor device package and method of manufacturing the same

Semiconductor device including heat sink with exposed side from enc...

Display apparatus and manufacturing method thereof

Infrared debond damage mitigation by copper fill pattern

Semiconductor package and method of fabricating the same

Photonics integrated circuit package

Integrated circuit packages and methods of forming the same

Adhesive for processing a microelectronic substrate, and related me...

Light-emitting diode testing circuit, light-emitting diode testing...

Adhesive sheet

High density interconnection using fanout interposer chiplet

Optoelectronic device package and method of manufacturing the same

Method for preparing a self-supporting substrate from a film base s...

Method of fabricating semiconductor package including sub-interpose...

Adhesive tape for semiconductor package manufacturing process and m...

Method for manufacturing display device and display device manufact...

Integrated fan-out package with 3D magnetic core inductor

Stacking structure, package structure and method of fabricating the...

3D semiconductor memory device and structure with memory and metal...

Adhesive tapes for receiving discrete components

Integrated devices in semiconductor packages and methods of forming...

Flip chip package unit and associated packaging method

Method for forming a semiconductor device including forming a first...

Package process and package structure

Info structure with copper pillar having reversed profile

Processing method and processing apparatus

Patents Applicationslast 30 patents

PACKAGE STRUCTURE

MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE

HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET

PHOTOLITHOGRAPHY ALIGNMENT PROCESS FOR BONDED WAFERS

SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH

PACKAGE STRUCTURE FOR HEAT DISSIPATION

MANUFACTURING METHOD OF PACKAGE DEVICE

INTEGRATED CIRCUIT STRUCTURE

MICRODEVICE INTEGRATION INTO SYSTEM SUBSTRATE

SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS FORMED UTILIZING DU...

Method For Manufacturing Display Device and Display Device Manufact...

PACKAGE STRUCTURES

OPTOELECTRONIC MICRODEVICE

PACKAGE STRUCTURE WITH WARPAGE-CONTROL ELEMENT

LASER DICING FOR SINGULATION

PACKAGE STRUCTURE WITH REINFORCED ELEMENT

LAMINATE PEELING METHOD, LAMINATE, AND LAMINATE PRODUCTION METHOD

COMPOSITE COMPONENT DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

HETEROGENEOUS ANNEALING METHOD AND DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

BONDING TO ALIGNMENT MARKS WITH DUMMY ALIGNMENT MARKS

MULTI-DEVICE GRADED EMBEDDING PACKAGE SUBSTRATE AND MANUFACTURING M...

MICRO HEATER MODULE AND METHOD OF MANUFACTURING THE SAME

ELECTROSTATIC DISCHARGE DEVICES WITH METALLIZED DIES

METHOD OF MANUFACTURING PRE-MOLDED LEAD FRAME FOR PACKAGING

DIE BONDING APPARATUS AND DIE BONDING METHOD USING THE SAME

METHOD FOR PRODUCING 3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH T...

PACKAGE STRUCTURE

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...