for surface acoustic wave [SAW] devices

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CPC
H03H9/1064

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Parent Industries

HELECTRICITY H03Electronic circuits H03HIMPEDANCE NETWORKS H03H9/00Networks comprising electromechanical or electro-acoustic devices Electromechanical resonators

Current Industry

H03H9/1064for surface acoustic wave [SAW] devices

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Over temperature protection for acoustic wave filter
- Patent number 11,973,491
- Issue date Apr 30, 2024
- Skyworks Solutions, Inc.
- Joshua James Caron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and method for manufacturing the same
- Patent number 11,973,486
- Issue date Apr 30, 2024
- Kyocera Corporation
- Sinichiro Kitanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging surface acoustic wave devices with conductive terminals
- Patent number 11,923,817
- Issue date Mar 5, 2024
- Skyworks Solutions, Inc.
- Li Ann Koo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser-marked packaged surface acoustic wave devices
- Patent number 11,894,824
- Issue date Feb 6, 2024
- Skyworks Solutions, Inc.
- Li Ann Koo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface acoustic wave device
- Patent number 11,876,502
- Issue date Jan 16, 2024
- Murata Manufacturing Co., Ltd.
- Yasuhiko Hirano
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Laser-marked packaged surface acoustic wave devices
- Patent number 11,784,622
- Issue date Oct 10, 2023
- Skyworks Solutions, Inc.
- Li Ann Koo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged surface acoustic wave devices
- Patent number 11,777,465
- Issue date Oct 3, 2023
- Skyworks Solutions, Inc.
- Li Ann Koo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-frequency module
- Patent number 11,658,641
- Issue date May 23, 2023
- Murata Manufacturing Co., Ltd.
- Yukiteru Sugaya
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Wafer level surface acoustic wave filter and package method
- Patent number 11,632,095
- Issue date Apr 18, 2023
- Spreadtrum Communications (Shanghai) Co., Ltd.
- Jing Chen
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Elastic wave device and method for producing the same
- Patent number 11,539,344
- Issue date Dec 27, 2022
- Murata Manufacturing Co., Ltd.
- Tetsuya Kimura
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Surface acoustic wave device
- Patent number 11,476,831
- Issue date Oct 18, 2022
- Murata Manufacturing Co., Ltd.
- Yasuhiko Hirano
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Apparatus for automatic sampling of biological species employing an...
- Patent number 11,358,140
- Issue date Jun 14, 2022
- Autonomous Medical Devices Inc.
- Josh Yehoshua Shachar
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Wafer level chip scale filter packaging using semiconductor wafers...
- Patent number 11,335,669
- Issue date May 17, 2022
- Skyworks Solutions, Inc.
- Jiro Yota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component with improved heat dissipation
- Patent number 11,303,263
- Issue date Apr 12, 2022
- QUALCOMM Incorporated
- Tomasz Jewula
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Component with a thin-layer covering and method for its production
- Patent number 11,296,673
- Issue date Apr 5, 2022
- Snaptrack, Inc.
- Thomas Metzger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods for packaging surface acoustic wave devices
- Patent number 11,159,137
- Issue date Oct 26, 2021
- Skyworks Solutions, Inc.
- Li Ann Koo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Acoustic wave filter with temperature sensor
- Patent number 11,088,675
- Issue date Aug 10, 2021
- Skyworks Solutions, Inc.
- Joshua James Caron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Acoustic wave device, module, and multiplexer
- Patent number 10,886,891
- Issue date Jan 5, 2021
- TAIYO YODEN CO., LTD.
- Takuma Kuroyanagi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Electronic component and method of manufacturing the same
- Patent number 10,855,248
- Issue date Dec 1, 2020
- Taiyo Yuden Co., Ltd.
- Yasuyuki Oda
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
High-frequency module
- Patent number 10,848,129
- Issue date Nov 24, 2020
- Murata Manufacturing Co., Ltd.
- Yukiteru Sugaya
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Multiplexer
- Patent number 10,826,460
- Issue date Nov 3, 2020
- Taiyo Yuden Co., Ltd.
- Daiki Itou
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Acoustic wave device
- Patent number 10,804,881
- Issue date Oct 13, 2020
- Kyocera Corporation
- Tomonori Urata
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Composite electronic component
- Patent number 10,778,185
- Issue date Sep 15, 2020
- Murata Manufacturing Co., Ltd.
- Katsuya Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wideband filter including an acoustic resonator chip integrated wit...
- Patent number 10,749,499
- Issue date Aug 18, 2020
- QUALCOMM Incorporated
- Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filter device
- Patent number 10,715,102
- Issue date Jul 14, 2020
- Murata Manufacturing Co., Ltd.
- Toru Takeshita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elastic wave device, radio-frequency front-end circuit, and communi...
- Patent number 10,637,433
- Issue date Apr 28, 2020
- Murata Manufacturing Co., Ltd.
- Yuji Fukuda
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Elastic wave device
- Patent number 10,637,432
- Issue date Apr 28, 2020
- Murata Manufacturing Co., Ltd.
- Seiji Kai
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Acoustic wave filters with thermally conductive sheet
- Patent number 10,574,208
- Issue date Feb 25, 2020
- Skyworks Solutions, Inc.
- Rei Goto
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Surface acoustic wave device with thermally conductive layer
- Patent number 10,536,131
- Issue date Jan 14, 2020
- Skyworks Solutions, Inc.
- Rei Goto
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Wafer level chip scale filter packaging using semiconductor wafers...
- Patent number 10,483,248
- Issue date Nov 19, 2019
- Skyworks Solutions, Inc.
- Jiro Yota
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
Circuit Device And Oscillator
- Publication number 20240333215
- Publication date Oct 3, 2024
- SEIKO EPSON CORPORATION
- Teppei HIGUCHI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
LASER-MARKED PACKAGED SURFACE ACOUSTIC WAVE DEVICES
- Publication number 20240243716
- Publication date Jul 18, 2024
- Skyworks Solutions, Inc.
- Li Ann Koo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE FILTER DEVICE
- Publication number 20240097653
- Publication date Mar 21, 2024
- Murata Manufacturing Co., Ltd.
- Yasuhiro SHIMIZU
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ACOUSTIC WAVE DEVICE AND METHOD FOR PRODUCING SAME
- Publication number 20230223911
- Publication date Jul 13, 2023
- Sanan Japan Technology Corporation
- Kanehisa Kimbara
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ELECTRONIC COMPONENT, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURI...
- Publication number 20230143137
- Publication date May 11, 2023
- KYOCERA CORPORATION
- Akira OIKAWA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
MULTILAYER PIEZOELECTRIC SUBSTRATE DEVICE WITH NEGATIVE TEMPERATURE...
- Publication number 20230119788
- Publication date Apr 20, 2023
- Skyworks Solutions, Inc.
- Rei Goto
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ACOUSTIC WAVE DEVICE WITH MULTILAYER PIEZOELECTRIC SUBSTRATE FOR RE...
- Publication number 20230104405
- Publication date Apr 6, 2023
- Skyworks Solutions, Inc.
- Yuya Hiramatsu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
MULTILAYER PIEZOELECTRIC SUBSTRATE SURFACE ACOUSTIC WAVE DEVICE WIT...
- Publication number 20230109106
- Publication date Apr 6, 2023
- Skyworks Solutions, Inc.
- Yuya Hiramatsu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SURFACE ACOUSTIC WAVE DEVICE HAVING ENHANCED POWER DURABILITY
- Publication number 20230026465
- Publication date Jan 26, 2023
- Skyworks Solutions, Inc.
- Yulin Huang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SURFACE ACOUSTIC WAVE DEVICE
- Publication number 20230006639
- Publication date Jan 5, 2023
- Murata Manufacturing Co., Ltd.
- Yasuhiko HIRANO
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHOD OF MAKING A PACKAGED ACOUSTIC WAVE DEVICES WITH MULTI-LAYER...
- Publication number 20220158610
- Publication date May 19, 2022
- Skyworks Solutions, Inc.
- Rei Goto
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220123713
- Publication date Apr 21, 2022
- KYOCERA CORPORATION
- Sinichiro KITANISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL SURFACE ACOUSTIC WAVE FILTER AND PACKAGE METHOD
- Publication number 20220094328
- Publication date Mar 24, 2022
- Spreadtrum Communications (Shanghai) CO., Ltd.
- Jing Chen
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SUBSTRATE COMPRISING ACOUSTIC RESONATORS CONFIGURED AS AT LEAST ONE...
- Publication number 20220069797
- Publication date Mar 3, 2022
- QUALCOMM Incorporated
- Jonghae KIM
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
PACKAGING SURFACE ACOUSTIC WAVE DEVICES WITH CONDUCTIVE TERMINALS
- Publication number 20220006439
- Publication date Jan 6, 2022
- Skyworks Solutions, Inc.
- Li Ann Koo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT MODULE AND ELECTRONIC...
- Publication number 20210297057
- Publication date Sep 23, 2021
- Murata Manufacturing Co., Ltd.
- Takashi IWAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY MODULE
- Publication number 20210028767
- Publication date Jan 28, 2021
- Murata Manufacturing Co., Ltd.
- Yukiteru SUGAYA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
WAFER LEVEL CHIP SCALE FILTER PACKAGING USING SEMICONDUCTOR WAFERS...
- Publication number 20200083202
- Publication date Mar 12, 2020
- SKYWORKS SOLUTIONS, INC.
- Jiro Yota
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
WIDEBAND FILTER INCLUDING AN ACOUSTIC RESONATOR CHIP INTEGRATED WIT...
- Publication number 20200076405
- Publication date Mar 5, 2020
- QUALCOMM Incorporated
- Kai LIU
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHODS FOR PACKAGING SURFACE ACOUSTIC WAVE DEVICES
- Publication number 20200076402
- Publication date Mar 5, 2020
- SKYWORKS SOLUTIONS, INC.
- Li Ann Koo
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ACOUSTIC WAVE FILTER WITH TEMPERATURE SENSOR
- Publication number 20190267971
- Publication date Aug 29, 2019
- SKYWORKS SOLUTIONS, INC.
- Joshua James Caron
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MULTIPLEXER
- Publication number 20190260351
- Publication date Aug 22, 2019
- Taiyo Yuden Co., Ltd.
- Daiki ITOU
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ELASTIC WAVE DEVICE, RADIO-FREQUENCY FRONT-END CIRCUIT, AND COMMUNI...
- Publication number 20190238112
- Publication date Aug 1, 2019
- Murata Manufacturing Co., Ltd.
- Yuji FUKUDA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
COMPONENT WITH A THIN-LAYER COVERING AND METHOD FOR ITS PRODUCTION
- Publication number 20190238113
- Publication date Aug 1, 2019
- SnapTrack, Inc.
- Roland ROSEZIN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SURFACE ACOUSTIC WAVE DEVICE
- Publication number 20190052242
- Publication date Feb 14, 2019
- Murata Manufacturing Co., Ltd.
- Yasuhiko HIRANO
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ACOUSTIC WAVE FILTERS WITH THERMALLY CONDUCTIVE SHEET
- Publication number 20180367116
- Publication date Dec 20, 2018
- SKYWORKS SOLUTIONS, INC.
- Rei Goto
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SURFACE ACOUSTIC WAVE DEVICE WITH THERMALLY CONDUCTIVE LAYER
- Publication number 20180367117
- Publication date Dec 20, 2018
- SKYWORKS SOLUTIONS, INC.
- Rei Goto
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
HIGH-FREQUENCY MODULE
- Publication number 20180302061
- Publication date Oct 18, 2018
- Murata Manufacturing Co., Ltd.
- Yukiteru SUGAYA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
HIGH-FREQUENCY MODULE
- Publication number 20180302062
- Publication date Oct 18, 2018
- Murata Manufacturing Co., Ltd.
- Yukiteru SUGAYA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
FILTER DEVICE
- Publication number 20180287588
- Publication date Oct 4, 2018
- Murata Manufacturing Co., Ltd.
- Toru TAKESHITA
- H03 - BASIC ELECTRONIC CIRCUITRY

for surface acoustic wave [SAW] devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Over temperature protection for acoustic wave filter

Electronic component and method for manufacturing the same

Packaging surface acoustic wave devices with conductive terminals

Laser-marked packaged surface acoustic wave devices

Surface acoustic wave device

Laser-marked packaged surface acoustic wave devices

Packaged surface acoustic wave devices

High-frequency module

Wafer level surface acoustic wave filter and package method

Elastic wave device and method for producing the same

Surface acoustic wave device

Apparatus for automatic sampling of biological species employing an...

Wafer level chip scale filter packaging using semiconductor wafers...

Component with improved heat dissipation

Component with a thin-layer covering and method for its production

Methods for packaging surface acoustic wave devices

Acoustic wave filter with temperature sensor

Acoustic wave device, module, and multiplexer

Electronic component and method of manufacturing the same

High-frequency module

Multiplexer

Acoustic wave device

Composite electronic component

Wideband filter including an acoustic resonator chip integrated wit...

Filter device

Elastic wave device, radio-frequency front-end circuit, and communi...

Elastic wave device

Acoustic wave filters with thermally conductive sheet

Surface acoustic wave device with thermally conductive layer

Wafer level chip scale filter packaging using semiconductor wafers...

Patents Applicationslast 30 patents

Circuit Device And Oscillator

LASER-MARKED PACKAGED SURFACE ACOUSTIC WAVE DEVICES

COMPOSITE FILTER DEVICE

ACOUSTIC WAVE DEVICE AND METHOD FOR PRODUCING SAME

ELECTRONIC COMPONENT, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURI...

MULTILAYER PIEZOELECTRIC SUBSTRATE DEVICE WITH NEGATIVE TEMPERATURE...

ACOUSTIC WAVE DEVICE WITH MULTILAYER PIEZOELECTRIC SUBSTRATE FOR RE...

MULTILAYER PIEZOELECTRIC SUBSTRATE SURFACE ACOUSTIC WAVE DEVICE WIT...

SURFACE ACOUSTIC WAVE DEVICE HAVING ENHANCED POWER DURABILITY

SURFACE ACOUSTIC WAVE DEVICE

METHOD OF MAKING A PACKAGED ACOUSTIC WAVE DEVICES WITH MULTI-LAYER...

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

WAFER LEVEL SURFACE ACOUSTIC WAVE FILTER AND PACKAGE METHOD

SUBSTRATE COMPRISING ACOUSTIC RESONATORS CONFIGURED AS AT LEAST ONE...

PACKAGING SURFACE ACOUSTIC WAVE DEVICES WITH CONDUCTIVE TERMINALS

METHOD FOR MANUFACTURING ELECTRONIC COMPONENT MODULE AND ELECTRONIC...

HIGH-FREQUENCY MODULE

WAFER LEVEL CHIP SCALE FILTER PACKAGING USING SEMICONDUCTOR WAFERS...

WIDEBAND FILTER INCLUDING AN ACOUSTIC RESONATOR CHIP INTEGRATED WIT...

METHODS FOR PACKAGING SURFACE ACOUSTIC WAVE DEVICES

ACOUSTIC WAVE FILTER WITH TEMPERATURE SENSOR

MULTIPLEXER

ELASTIC WAVE DEVICE, RADIO-FREQUENCY FRONT-END CIRCUIT, AND COMMUNI...

COMPONENT WITH A THIN-LAYER COVERING AND METHOD FOR ITS PRODUCTION

SURFACE ACOUSTIC WAVE DEVICE

ACOUSTIC WAVE FILTERS WITH THERMALLY CONDUCTIVE SHEET

SURFACE ACOUSTIC WAVE DEVICE WITH THERMALLY CONDUCTIVE LAYER

HIGH-FREQUENCY MODULE

HIGH-FREQUENCY MODULE

FILTER DEVICE