for surface mounting

Industry

CPC
H01G2/065

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Parent Industries

HELECTRICITY H01Electric elements H01GCAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE H01G2/00Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00

Current Industry

H01G2/065for surface mounting

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Thin film capacitor and electronic circuit substrate having the same
- Patent number 12,369,337
- Issue date Jul 22, 2025
- TDK Corporation
- Daiki Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 12,368,001
- Issue date Jul 22, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Younghun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing multilayer ceramic capacitor
- Patent number 12,362,101
- Issue date Jul 15, 2025
- Murata Manufacturing Co., Ltd.
- Satoshi Yokomizo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component
- Patent number 12,354,806
- Issue date Jul 8, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jeong Bong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film capacitor, its manufacturing method, and electronic circu...
- Patent number 12,336,203
- Issue date Jun 17, 2025
- TDK Corporation
- Daiki Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic electronic component and circuit board
- Patent number 12,327,690
- Issue date Jun 10, 2025
- Taiyo Yuden Co., Ltd.
- Eriko Numata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer ceramic electronic component and board for mounting the...
- Patent number 12,300,440
- Issue date May 13, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Byeong Chan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor and method of manufacturing multilayer...
- Patent number 12,283,427
- Issue date Apr 22, 2025
- Murata Manufacturing Co., Ltd.
- Shinobu Chikuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip electronic component
- Patent number 12,266,473
- Issue date Apr 1, 2025
- Murata Manufacturing Co., Ltd.
- Yukihiro Fujita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor and mounting structure of multilayer c...
- Patent number 12,266,477
- Issue date Apr 1, 2025
- Murata Manufacturing Co., Ltd.
- Kazuhiro Nishibayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component
- Patent number 12,255,025
- Issue date Mar 18, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- YoonA Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component
- Patent number 12,249,466
- Issue date Mar 11, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Young Ghyu Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor
- Patent number 12,237,111
- Issue date Feb 25, 2025
- Murata Manufacturing Co., Ltd.
- Masato Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film capacitor and electronic circuit substrate having the same
- Patent number 12,237,366
- Issue date Feb 25, 2025
- TDK Corporation
- Daiki Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component
- Patent number 12,230,449
- Issue date Feb 18, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Sung Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film capacitor and electronic circuit substrate having the same
- Patent number 12,218,185
- Issue date Feb 4, 2025
- TDK Corporation
- Daiki Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power system for high temperature applications with rechargeable en...
- Patent number 12,215,572
- Issue date Feb 4, 2025
- FASTCAP ULTRACAPACITORS LLC
- John J. Cooley
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Multilayer electronic component
- Patent number 12,217,915
- Issue date Feb 4, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hwi Dae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component, bonding portion regions thereon, mounted on a...
- Patent number 12,198,856
- Issue date Jan 14, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Sang Yeop Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-terminal multilayer ceramic capacitor
- Patent number 12,183,516
- Issue date Dec 31, 2024
- Murata Manufacturing Co., Ltd.
- Yuichiro Morimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component
- Patent number 12,176,153
- Issue date Dec 24, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Ha Jeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor
- Patent number 12,170,173
- Issue date Dec 17, 2024
- Murata Manufacturing Co., Ltd.
- Shinichi Kokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mutilayer electronic component
- Patent number 12,148,571
- Issue date Nov 19, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- SoEun Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer capacitor and board having the same mounted thereon
- Patent number 12,148,574
- Issue date Nov 19, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- San Kyeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer ceramic electronic component and circuit board
- Patent number 12,142,436
- Issue date Nov 12, 2024
- Taiyo Yuden Co., Ltd.
- Tomohiko Zaima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and electronic component device
- Patent number 12,142,438
- Issue date Nov 12, 2024
- TDK Corporation
- Shinya Onodera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer ceramic electronic component, and circuit board
- Patent number 12,131,870
- Issue date Oct 29, 2024
- Taiyo Yuden Co., Ltd.
- Tomoki Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer ceramic electronic component and circuit board
- Patent number 12,131,869
- Issue date Oct 29, 2024
- Taiyo Yuden Co., Ltd.
- Kiyoshiro Yatagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film capacitor and electronic circuit substrate having the same
- Patent number 12,132,078
- Issue date Oct 29, 2024
- TDK Corporation
- Yoshihiko Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component
- Patent number 12,125,643
- Issue date Oct 22, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jeong Bong Park
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20250239411
- Publication date Jul 24, 2025
- TDK Corporation
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC CAPACITOR AND MANUFACTURING METHOD THEREFOR
- Publication number 20250232926
- Publication date Jul 17, 2025
- AMOTECH CO., LTD.
- Byungguk LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING MULTILAYER...
- Publication number 20250218658
- Publication date Jul 3, 2025
- Murata Manufacturing Co., Ltd.
- Shinobu CHIKUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20250218685
- Publication date Jul 3, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Young Eun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20250218687
- Publication date Jul 3, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Seung Yeon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT, PACKAGE BODY, AND CIRCUIT...
- Publication number 20250201476
- Publication date Jun 19, 2025
- Taiyo Yuden Co., Ltd.
- Hiroaki SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR EMBEDDED SUBSTRATE
- Publication number 20250201486
- Publication date Jun 19, 2025
- Murata Manufacturing Co., Ltd.
- Akitomo TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR AND MULTILAYER CERAMIC CAPACITOR MOUNT...
- Publication number 20250191840
- Publication date Jun 12, 2025
- KYOCERA CORPORATION
- Tomohiro YANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SYSTEM FOR HIGH TEMPERATURE APPLICATIONS WITH RECHARGEABLE EN...
- Publication number 20250179894
- Publication date Jun 5, 2025
- FASTCAP ULTRACAPACITORS LLC
- John J. Cooley
- B82 - NANO-TECHNOLOGY
Information Patent Application
ELECTRONIC COMPONENT, CIRCUIT BOARD ARRANGEMENT, ELECTRONIC DEVICE,...
- Publication number 20250182971
- Publication date Jun 5, 2025
- Taiyo Yuden Co., Ltd.
- Ryosuke HOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer Electronic Component Including at Least One Via Connecte...
- Publication number 20250174404
- Publication date May 29, 2025
- KYOCERA AVX Components Corporation
- Jonathan Herr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT AND BOARD HAVING MULTILAYER ELECTRO...
- Publication number 20250166896
- Publication date May 22, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Jeong Pil JHUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20250166923
- Publication date May 22, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Sung Been IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR, METHOD OF MANUFACTURING THEREOF AND USE THEREOF
- Publication number 20250157740
- Publication date May 15, 2025
- TDK Electronics AG
- Tim LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR, PACKAGE, AND CIRCUIT BOARD
- Publication number 20250125090
- Publication date Apr 17, 2025
- Taiyo Yuden Co., Ltd.
- Ayumi SHIROTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface Mount Multilayer Ceramic Capacitor
- Publication number 20250111993
- Publication date Apr 3, 2025
- KYOCERA AVX Components Corporation
- Marianne Berolini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC CAPACITOR
- Publication number 20250104916
- Publication date Mar 27, 2025
- AMOTECH CO., LTD.
- Byungguk LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED ELECTRICAL DEVICES AND RELATED METHODS
- Publication number 20250070814
- Publication date Feb 27, 2025
- Skyworks Solutions, Inc.
- Andrew Martin KAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM CAPACITOR, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC...
- Publication number 20250069814
- Publication date Feb 27, 2025
- TDK Corporation
- Miyu HASEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING MEMBER OF CAPACITOR, CAPACITOR, ELECTRICAL...
- Publication number 20250069817
- Publication date Feb 27, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- Manabu KANOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM CAPACITOR AND CAPACITOR MODULE
- Publication number 20250054699
- Publication date Feb 13, 2025
- LG Innotek Co., Ltd.
- Hyun Sung GUK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MOUNTING STRUCTURE OF M...
- Publication number 20250054704
- Publication date Feb 13, 2025
- Murata Manufacturing Co., Ltd.
- Kazunori USUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-TYPE MULTILAYER CERAMIC CAPACITOR
- Publication number 20250054703
- Publication date Feb 13, 2025
- Murata Manufacturing Co., Ltd.
- Takashi SAWADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capacitor Carrier Ring And Stiffener For Integrated Circuit Package...
- Publication number 20250046516
- Publication date Feb 6, 2025
- Google LLC
- Scott Lee Kirkman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT DEVICE
- Publication number 20250029788
- Publication date Jan 23, 2025
- TDK Corporation
- Shinya ONODERA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER CERAMIC ELECTRONIC COMPONENT, AND CIRCUIT BOARD
- Publication number 20250014832
- Publication date Jan 9, 2025
- Taiyo Yuden Co., Ltd.
- Tomoki SAKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICALLY MOUNTABLE SNAP FIT BRACKET FOR ELECTROLYTIC CAPACITORS
- Publication number 20240413573
- Publication date Dec 12, 2024
- Western Digital Technologies, Inc.
- Shiqiang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR
- Publication number 20240395464
- Publication date Nov 28, 2024
- Murata Manufacturing Co., Ltd.
- Ryo NISHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND MOUNTING STRUCTURE FOR ELECTRONIC COMPONENT
- Publication number 20240387105
- Publication date Nov 21, 2024
- Murata Manufacturing Co., Ltd.
- Motonori TAKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR
- Publication number 20240355546
- Publication date Oct 24, 2024
- Murata Manufacturing Co., Ltd.
- Shinobu CHIKUMA
- H01 - BASIC ELECTRIC ELEMENTS

for surface mounting

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Thin film capacitor and electronic circuit substrate having the same

Electronic component

Method of manufacturing multilayer ceramic capacitor

Multilayer electronic component

Thin film capacitor, its manufacturing method, and electronic circu...

Ceramic electronic component and circuit board

Multi-layer ceramic electronic component and board for mounting the...

Multilayer ceramic capacitor and method of manufacturing multilayer...

Chip electronic component

Multilayer ceramic capacitor and mounting structure of multilayer c...

Multilayer electronic component

Multilayer electronic component

Multilayer ceramic capacitor

Thin film capacitor and electronic circuit substrate having the same

Multilayer electronic component

Thin film capacitor and electronic circuit substrate having the same

Power system for high temperature applications with rechargeable en...

Multilayer electronic component

Electronic component, bonding portion regions thereon, mounted on a...

Three-terminal multilayer ceramic capacitor

Multilayer electronic component

Multilayer ceramic capacitor

Mutilayer electronic component

Multilayer capacitor and board having the same mounted thereon

Multi-layer ceramic electronic component and circuit board

Electronic component and electronic component device

Multi-layer ceramic electronic component, and circuit board

Multi-layer ceramic electronic component and circuit board

Thin film capacitor and electronic circuit substrate having the same

Multilayer electronic component

Patents Applicationslast 30 patents

ELECTRONIC COMPONENT

CERAMIC CAPACITOR AND MANUFACTURING METHOD THEREFOR

MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING MULTILAYER...

MULTILAYER ELECTRONIC COMPONENT

MULTILAYER ELECTRONIC COMPONENT

MULTILAYER CERAMIC ELECTRONIC COMPONENT, PACKAGE BODY, AND CIRCUIT...

CAPACITOR EMBEDDED SUBSTRATE

MULTILAYER CERAMIC CAPACITOR AND MULTILAYER CERAMIC CAPACITOR MOUNT...

POWER SYSTEM FOR HIGH TEMPERATURE APPLICATIONS WITH RECHARGEABLE EN...

ELECTRONIC COMPONENT, CIRCUIT BOARD ARRANGEMENT, ELECTRONIC DEVICE,...

Multilayer Electronic Component Including at Least One Via Connecte...

MULTILAYER ELECTRONIC COMPONENT AND BOARD HAVING MULTILAYER ELECTRO...

MULTILAYER ELECTRONIC COMPONENT

CAPACITOR, METHOD OF MANUFACTURING THEREOF AND USE THEREOF

MULTILAYER CERAMIC CAPACITOR, PACKAGE, AND CIRCUIT BOARD

Surface Mount Multilayer Ceramic Capacitor

CERAMIC CAPACITOR

PACKAGED ELECTRICAL DEVICES AND RELATED METHODS

THIN FILM CAPACITOR, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC...

METHOD FOR MANUFACTURING MEMBER OF CAPACITOR, CAPACITOR, ELECTRICAL...

FILM CAPACITOR AND CAPACITOR MODULE

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MOUNTING STRUCTURE OF M...

THROUGH-TYPE MULTILAYER CERAMIC CAPACITOR

Capacitor Carrier Ring And Stiffener For Integrated Circuit Package...

ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT DEVICE

MULTI-LAYER CERAMIC ELECTRONIC COMPONENT, AND CIRCUIT BOARD

VERTICALLY MOUNTABLE SNAP FIT BRACKET FOR ELECTROLYTIC CAPACITORS

MULTILAYER CERAMIC CAPACITOR

ELECTRONIC COMPONENT AND MOUNTING STRUCTURE FOR ELECTRONIC COMPONENT

MULTILAYER CERAMIC CAPACITOR