for TAB IC's

Industry

CPC
G01R1/0475

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

GPHYSICS G01Measuring instruments G01RMEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00

Current Industry

G01R1/0475for TAB IC's

Industries

Patents Grantslast 30 patents

Information Patent Grant
Multi-socket guide and test device comprising the same
- Patent number 8,029,292
- Issue date Oct 4, 2011
- Samsung Electronics Co., Ltd.
- Hong-jun Jin
- G01 - MEASURING TESTING
Information Patent Grant
Method for testing a tape carrier package
- Patent number 6,127,196
- Issue date Oct 3, 2000
- Intel Corporation
- Richard R. Butera
- G01 - MEASURING TESTING
Information Patent Grant
Tab tape-based bare chip test and burn-in carrier
- Patent number 5,656,941
- Issue date Aug 12, 1997
- Thomas Alan Bishop
- G01 - MEASURING TESTING
Information Patent Grant
Burn-in socket used in a burn-in test for semiconductor chips
- Patent number 5,523,586
- Issue date Jun 4, 1996
- Kabushiki Kaisha Toshiba
- Masahiko Sakurai
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device burn-in apparatus
- Patent number 5,502,398
- Issue date Mar 26, 1996
- Kabushiki Kaisha Toshiba
- Shinobu Wada
- G01 - MEASURING TESTING
Information Patent Grant
Socket for tab testing
- Patent number 5,427,536
- Issue date Jun 27, 1995
- Minnesota Mining and Manufacturing Company
- Kurt H. Petersen
- G01 - MEASURING TESTING
Information Patent Grant
Testing socket for tab tape
- Patent number 5,171,290
- Issue date Dec 15, 1992
- Microelectronics and Computer Technology Corporation
- Michael A. Olla
- G01 - MEASURING TESTING
Information Patent Grant
Directly bonded simm module
- Patent number 4,992,850
- Issue date Feb 12, 1991
- Micron Technology, Inc.
- Tim J. Corbett
- G01 - MEASURING TESTING
Information Patent Grant
Socket for tab burn-in and test
- Patent number 4,986,760
- Issue date Jan 22, 1991
- Minnesota Mining and Manufacturing Company
- Kurt H. Petersen
- G01 - MEASURING TESTING
Information Patent Grant
Electrical socket for TAB IC's
- Patent number 4,969,828
- Issue date Nov 13, 1990
- AMP Incorporated
- Edward J. Bright
- G01 - MEASURING TESTING
Information Patent Grant
Discrete die burn-in for nonpackaged die
- Patent number 4,899,107
- Issue date Feb 6, 1990
- Micron Technology, Inc.
- Tim J. Corbett
- G01 - MEASURING TESTING
Information Patent Grant
Multipurpose socket
- Patent number 4,859,189
- Issue date Aug 22, 1989
- Minnesota Mining and Manufacturing Company
- Kurt H. Petersen
- G01 - MEASURING TESTING
Information Patent Grant
Carrier for tape automated bonded semiconductor device
- Patent number 4,696,526
- Issue date Sep 29, 1987
- Intel Corporation
- Edward L. Newton
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
MULTI-SOCKET GUIDE AND TEST DEVICE COMPRISING THE SAME
- Publication number 20100068914
- Publication date Mar 18, 2010
- Hong-jun Jin
- G01 - MEASURING TESTING

for TAB IC's

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multi-socket guide and test device comprising the same

Method for testing a tape carrier package

Tab tape-based bare chip test and burn-in carrier

Burn-in socket used in a burn-in test for semiconductor chips

Semiconductor device burn-in apparatus

Socket for tab testing

Testing socket for tab tape

Directly bonded simm module

Socket for tab burn-in and test

Electrical socket for TAB IC's

Discrete die burn-in for nonpackaged die

Multipurpose socket

Carrier for tape automated bonded semiconductor device

Patents Applicationslast 30 patents

MULTI-SOCKET GUIDE AND TEST DEVICE COMPRISING THE SAME