for via connections in inorganic insulating substrates

Industry

CPC
H05K3/4061

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/4061for via connections in inorganic insulating substrates

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Methods of manufacturing circuit board and circuit board assembly
- Patent number 12,063,752
- Issue date Aug 13, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Wen-Zhu Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of a multi-layer for a probe card
- Patent number 12,019,111
- Issue date Jun 25, 2024
- Technoprobe S.p.A.
- Roberto Crippa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a metal-ceramic substrate with electrically co...
- Patent number 11,804,383
- Issue date Oct 31, 2023
- Infineon Technologies AG
- Alexander Roth
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 11,678,440
- Issue date Jun 13, 2023
- Ibiden Co., Ltd.
- Yoji Sawada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a glass substrate with a plurality of vias
- Patent number 11,646,246
- Issue date May 9, 2023
- Samtec, Inc.
- Tim Mobley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a metal-ceramic substrate with at least one via
- Patent number 11,557,490
- Issue date Jan 17, 2023
- Infineon Technologies AG
- Alexander Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Current introduction terminal, and pressure holding apparatus and X...
- Patent number 11,470,722
- Issue date Oct 11, 2022
- Riken
- Yuji Matsuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayered ceramic substrate and method for manufacturing same
- Patent number 11,419,218
- Issue date Aug 16, 2022
- DIT CO., LTD.
- Tae Hyung Noh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic wiring board and method for producing the same
- Patent number 11,350,523
- Issue date May 31, 2022
- Murata Manufacturing Co., Ltd.
- Takahiro Sumi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming flexible substrate including via, and flexible s...
- Patent number 11,284,509
- Issue date Mar 22, 2022
- Seoul National University R&DB Foundation
- Yongtaek Hong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Filling materials and methods of filling through holes of a substrate
- Patent number 11,251,109
- Issue date Feb 15, 2022
- Samtec, Inc.
- Tim Mobley
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Laminated substrate
- Patent number 11,212,906
- Issue date Dec 28, 2021
- Murata Manufacturing Co., Ltd.
- Kosuke Sugiura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board manufacturing method and wiring board
- Patent number 11,026,335
- Issue date Jun 1, 2021
- Nichia Corporation
- Rie Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for providing hermetic electrical feedthrough
- Patent number 10,952,332
- Issue date Mar 16, 2021
- Second Sight Medical Products, Inc.
- Jerry Ok
- B32 - LAYERED PRODUCTS
Information Patent Grant
Circuit board, electronic circuit device, and production method of...
- Patent number 10,932,373
- Issue date Feb 23, 2021
- Stanley Electric Co., Ltd.
- Akihiko Hanya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming flexible substrate including via, and flexible s...
- Patent number 10,905,002
- Issue date Jan 26, 2021
- Seoul National University R&DB Foundation
- Yongtaek Hong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for through-plating a printed circuit board and such a print...
- Patent number 10,842,030
- Issue date Nov 17, 2020
- Vitesco Technologies GmbH
- Jürgen Zacherl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a metal-ceramic substrate with at least one via
- Patent number 10,796,929
- Issue date Oct 6, 2020
- Infineon Technologies AG
- Alexander Roth
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Extremely low profile electrical interconnect for printed wiring board
- Patent number 10,791,632
- Issue date Sep 29, 2020
- Raytheon Company
- Chad E. Patterson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and production method therefor
- Patent number 10,785,879
- Issue date Sep 22, 2020
- NGK Spark Plug Co., Ltd.
- Tatsuya Katoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board manufacturing method and wiring board
- Patent number 10,757,818
- Issue date Aug 25, 2020
- Nichia Corporation
- Rie Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic substrate
- Patent number 10,524,365
- Issue date Dec 31, 2019
- NGK Spark Plug Co., Ltd.
- Tatsuya Katoh
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Multilayer ceramic substrate and method for manufacturing same
- Patent number 10,455,699
- Issue date Oct 22, 2019
- Hitachi Metals, Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for providing hermetic electrical feedthrough
- Patent number 10,390,441
- Issue date Aug 20, 2019
- Second Sight Medical Products, Inc.
- Jerry Ok
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of manufacturing a ceramic substrate
- Patent number 10,375,837
- Issue date Aug 6, 2019
- NGK Spark Plug Co., Ltd.
- Tatsuya Katoh
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Connection substrate
- Patent number 10,278,286
- Issue date Apr 30, 2019
- NGK Insulators, Ltd.
- Akiyoshi Ide
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Connection substrate
- Patent number 10,257,941
- Issue date Apr 9, 2019
- NGK Insulators, Ltd.
- Sugio Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic circuit board, electronic circuit module, and method for ma...
- Patent number 10,249,549
- Issue date Apr 2, 2019
- MURATA MANUFACTURING CO., LTD.
- Hiromitsu Hongo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sensor element for detecting at least one property of a measured ga...
- Patent number 10,215,726
- Issue date Feb 26, 2019
- Robert Bosch GmbH
- Alexander Bischoff
- G01 - MEASURING TESTING
Information Patent Grant
Method of manufacturing printed circuit board
- Patent number 10,103,113
- Issue date Oct 16, 2018
- DAEDUCK ELECTRONICS CO., LTD.
- Young-Joo Ko
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Circuit board
- Publication number 20240422920
- Publication date Dec 19, 2024
- Avary Holding (Shenzhen) Co., Limited.
- WEN-ZHU WEI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing a Component Carrier by a Nano Imprint Lithography Pro...
- Publication number 20240381538
- Publication date Nov 14, 2024
- AT&S Austria Technologie & Systemtechnik
- Heinrich TRISCHLER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC SINTERED COMPACT SUBSTRATE, LIGHT-EMITTING DEVICE, AND METH...
- Publication number 20240213429
- Publication date Jun 27, 2024
- Nichia Corporation.
- Akiko NAGAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORE ARCHITECTURES WITH DIELECTRIC BUFFER LAYER BETWEEN GLASS...
- Publication number 20230395445
- Publication date Dec 7, 2023
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A VIA IN A CARRIER LAYER PRODUCED FROM A CERAM...
- Publication number 20230137460
- Publication date May 4, 2023
- Rogers Germany GmbH
- Karsten Schmidt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Producing a Metal-Ceramic Substrate with Electrically Co...
- Publication number 20230095753
- Publication date Mar 30, 2023
- Alexander Roth
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
FILLING MATERIALS AND METHODS OF FILLING THROUGH HOLES OF A SUBSTRATE
- Publication number 20220059436
- Publication date Feb 24, 2022
- SAMTEC, INC.
- Tim Mobley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD, AND METHOD...
- Publication number 20210410295
- Publication date Dec 30, 2021
- Avary Holding (Shenzhen) Co., Limited.
- WEN-ZHU WEI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CURRENT INTRODUCTION TERMINAL, AND PRESSURE HOLDING APPARATUS AND X...
- Publication number 20210168936
- Publication date Jun 3, 2021
- Riken
- Yuji Matsuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING FLEXIBLE SUBSTRATE INCLUDING VIA, AND FLEXIBLE S...
- Publication number 20210105895
- Publication date Apr 8, 2021
- Seoul National University R&DB Foundation
- YONGTAEK HONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GLASS WIRING SUBSTRATE AND COMPONENT-MOUNTED GLASS WIRING SUBSTRATE
- Publication number 20210068266
- Publication date Mar 4, 2021
- SONY CORPORATION
- Hiroshi ISOBE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Producing a Metal-Ceramic Substrate with at Least One Via
- Publication number 20200395225
- Publication date Dec 17, 2020
- Alexander Roth
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20200367368
- Publication date Nov 19, 2020
- IBIDEN CO., LTD.
- Yoji SAWADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATED SUBSTRATE
- Publication number 20200305272
- Publication date Sep 24, 2020
- Murata Manufacturing Co., Ltd.
- Kosuke Sugiura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC SUBSTRATE
- Publication number 20200296828
- Publication date Sep 17, 2020
- Hitachi Metals, Ltd.
- Hisashi TANIE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTING SCREEN FOR USE IN A METHOD FOR THROUGH-PLATING A PRINTED C...
- Publication number 20200187366
- Publication date Jun 11, 2020
- Vitesco Technologies GMBH
- Jürgen Zacherl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR THROUGH-PLATING A PRINTED CIRCUIT BOARD AND SUCH A PRINT...
- Publication number 20200170123
- Publication date May 28, 2020
- Vitesco Technologies GMBH
- Jürgen Zacherl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20200120798
- Publication date Apr 16, 2020
- Shinko Electric Industries Co., Ltd.
- Yuji Yukiiri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYERED CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING SAME
- Publication number 20200084894
- Publication date Mar 12, 2020
- DIT Co., Ltd.
- Tae Hyung NOH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF A MULTI-LAYER FOR A PROBE CARD
- Publication number 20200072873
- Publication date Mar 5, 2020
- Technoprobe S.p.A.
- Roberto CRIPPA
- G01 - MEASURING TESTING
Information Patent Application
WIRING BOARD MANUFACTURING METHOD AND WIRING BOARD
- Publication number 20200077526
- Publication date Mar 5, 2020
- Nichia Corporation.
- Rie MAEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Forming Flexible Substrate Including Via, and Flexible S...
- Publication number 20190380199
- Publication date Dec 12, 2019
- Seoul National University R&DB Foundation
- YONGTAEK HONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Providing Hermetic Electrical Feedthrough
- Publication number 20190313537
- Publication date Oct 10, 2019
- Second Sight Medical Products, Inc.
- Jerry Ok
- B32 - LAYERED PRODUCTS
Information Patent Application
CIRCUIT BOARD, ELECTRONIC CIRCUIT DEVICE, AND PRODUCTION METHOD OF...
- Publication number 20190281705
- Publication date Sep 12, 2019
- Stanley Electric Co., Ltd
- Akihiko HANYA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND PLANAR TRANSFORMER
- Publication number 20190029114
- Publication date Jan 24, 2019
- NGK SPARK PLUG CO., LTD.
- Masahito MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION SUBSTRATE
- Publication number 20190014663
- Publication date Jan 10, 2019
- NGK Insulators, Ltd.
- Akiyoshi IDE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION SUBSTRATE
- Publication number 20180359866
- Publication date Dec 13, 2018
- NGK Insulators, Ltd.
- Sugio MIYAZAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND PRODUCTION METHOD THEREFOR
- Publication number 20180324957
- Publication date Nov 8, 2018
- NGK SPARK PLUG CO., LTD.
- Tatsuya KATOH
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
WIRING BOARD AND MANUFACTURING METHOD OF WIRING BOARD
- Publication number 20180235089
- Publication date Aug 16, 2018
- OLYMPUS CORPORATION
- Kazuaki KOJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING SAME
- Publication number 20180220532
- Publication date Aug 2, 2018
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS

for via connections in inorganic insulating substrates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods of manufacturing circuit board and circuit board assembly

Manufacturing method of a multi-layer for a probe card

Method for producing a metal-ceramic substrate with electrically co...

Printed wiring board and method for manufacturing printed wiring board

Method of fabricating a glass substrate with a plurality of vias

Method for producing a metal-ceramic substrate with at least one via

Current introduction terminal, and pressure holding apparatus and X...

Multilayered ceramic substrate and method for manufacturing same

Ceramic wiring board and method for producing the same

Method for forming flexible substrate including via, and flexible s...

Filling materials and methods of filling through holes of a substrate

Laminated substrate

Wiring board manufacturing method and wiring board

Method for providing hermetic electrical feedthrough

Circuit board, electronic circuit device, and production method of...

Method for forming flexible substrate including via, and flexible s...

Method for through-plating a printed circuit board and such a print...

Method for producing a metal-ceramic substrate with at least one via

Extremely low profile electrical interconnect for printed wiring board

Circuit board and production method therefor

Wiring board manufacturing method and wiring board

Ceramic substrate

Multilayer ceramic substrate and method for manufacturing same

Method for providing hermetic electrical feedthrough

Method of manufacturing a ceramic substrate

Connection substrate

Connection substrate

Ceramic circuit board, electronic circuit module, and method for ma...

Sensor element for detecting at least one property of a measured ga...

Method of manufacturing printed circuit board

Patents Applicationslast 30 patents

Circuit board

Manufacturing a Component Carrier by a Nano Imprint Lithography Pro...

CERAMIC SINTERED COMPACT SUBSTRATE, LIGHT-EMITTING DEVICE, AND METH...

GLASS CORE ARCHITECTURES WITH DIELECTRIC BUFFER LAYER BETWEEN GLASS...

METHOD FOR PRODUCING A VIA IN A CARRIER LAYER PRODUCED FROM A CERAM...

Method for Producing a Metal-Ceramic Substrate with Electrically Co...

FILLING MATERIALS AND METHODS OF FILLING THROUGH HOLES OF A SUBSTRATE

CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD, AND METHOD...

CURRENT INTRODUCTION TERMINAL, AND PRESSURE HOLDING APPARATUS AND X...

METHOD FOR FORMING FLEXIBLE SUBSTRATE INCLUDING VIA, AND FLEXIBLE S...

GLASS WIRING SUBSTRATE AND COMPONENT-MOUNTED GLASS WIRING SUBSTRATE

Method for Producing a Metal-Ceramic Substrate with at Least One Via

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

LAMINATED SUBSTRATE

CERAMIC SUBSTRATE

PRINTING SCREEN FOR USE IN A METHOD FOR THROUGH-PLATING A PRINTED C...

METHOD FOR THROUGH-PLATING A PRINTED CIRCUIT BOARD AND SUCH A PRINT...

WIRING BOARD

MULTILAYERED CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING SAME

MANUFACTURING METHOD OF A MULTI-LAYER FOR A PROBE CARD

WIRING BOARD MANUFACTURING METHOD AND WIRING BOARD

Method for Forming Flexible Substrate Including Via, and Flexible S...

Method for Providing Hermetic Electrical Feedthrough

CIRCUIT BOARD, ELECTRONIC CIRCUIT DEVICE, AND PRODUCTION METHOD OF...

WIRING BOARD AND PLANAR TRANSFORMER

CONNECTION SUBSTRATE

CONNECTION SUBSTRATE

CIRCUIT BOARD AND PRODUCTION METHOD THEREFOR

WIRING BOARD AND MANUFACTURING METHOD OF WIRING BOARD

MULTILAYER CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING SAME