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CPC
H05K1/0269

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/0269for visual or optical inspection

Industries

Patents Grantslast 30 patents

Information Patent Grant
Wafer level bump stack for chip scale package
- Patent number 12,177,988
- Issue date Dec 24, 2024
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed board having improved recognition accuracy
- Patent number 12,108,525
- Issue date Oct 1, 2024
- Yazaki Corporation
- Hidehiko Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board, semiconductor device, power converter, and moving ob...
- Patent number 12,075,556
- Issue date Aug 27, 2024
- Mitsubishi Electric Corporation
- Yuta Fukushima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic circuit board, heat-dissipating member, and aluminum-diamon...
- Patent number 11,983,586
- Issue date May 14, 2024
- DENKA COMPANY LIMITED
- Daisuke Goto
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit board and display device
- Patent number 11,974,392
- Issue date Apr 30, 2024
- Tianma Micro-Electronics Co., Ltd.
- Lu Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Traceability of subsequent layer structure manufacturing of main bo...
- Patent number 11,937,369
- Issue date Mar 19, 2024
- AT&S(China) Co. Ltd.
- Seok Kim Tay
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Machining station and method for controlling or identifying plateli...
- Patent number 11,877,387
- Issue date Jan 16, 2024
- SCHMOLL MASCHINEN GMBH
- Markus Winterschladen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package device and manufacturing method thereof
- Patent number 11,812,549
- Issue date Nov 7, 2023
- Innolux Corporation
- Yeong-E Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal sublayer sensing in multi-layer workpiece hole drilling
- Patent number 11,792,940
- Issue date Oct 17, 2023
- DRILLIANT LTD
- Guy Soffer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stencil printer with component loading verification system and method
- Patent number 11,778,750
- Issue date Oct 3, 2023
- Illinois Tool Works Inc.
- Patsy A. Mattero
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Electronic apparatus and inspection method
- Patent number 11,751,326
- Issue date Sep 5, 2023
- Sharp Kabushiki Kaisha
- Mitsuaki Morimoto
- G01 - MEASURING TESTING
Information Patent Grant
Display device
- Patent number 11,696,405
- Issue date Jul 4, 2023
- Samsung Display Co., Ltd.
- Tae Hyun Ryu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
LED lighting systems and methods
- Patent number 11,690,172
- Issue date Jun 27, 2023
- Metrospec Technology, LLC
- Henry V. Holec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inspection method of printed wiring board
- Patent number 11,683,891
- Issue date Jun 20, 2023
- Ibiden Co., Ltd.
- Yasuhiro Kawai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Marking device for marking circuit boards tested by means of a test...
- Patent number 11,622,450
- Issue date Apr 4, 2023
- Ingun Prüfmittelbau GmbH
- Bernd Boscher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film
- Patent number 11,591,499
- Issue date Feb 28, 2023
- Dexerials Corporation
- Daisuke Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package device
- Patent number 11,582,865
- Issue date Feb 14, 2023
- Innolux Corporation
- Yeong-E Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing apparatus for display device and method of using the...
- Patent number 11,570,907
- Issue date Jan 31, 2023
- Samsung Display Co., Ltd.
- Jun Hee Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed multi-directional three dimensional printer
- Patent number 11,503,717
- Issue date Nov 15, 2022
- Brown University
- Ian Gonsher
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Display device and method for manufacturing display device
- Patent number 11,487,170
- Issue date Nov 1, 2022
- Japan Display Inc.
- Yasushi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded circuit board and method of manufacturing same
- Patent number 11,452,211
- Issue date Sep 20, 2022
- SHENNAN CIRCUITS CO., LTD.
- Lixiang Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuits marked with connections to vehicle circuits
- Patent number 11,437,742
- Issue date Sep 6, 2022
- Aptiv Technologies Limited
- David R. Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mark recognition devices, mark recognition methods and pseudo press...
- Patent number 11,439,050
- Issue date Sep 6, 2022
- Kunshan Go-Visionox Opto-Electronics Co., Ltd.
- Yateng Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Organic light emitting diode display device and method of manufactu...
- Patent number 11,437,358
- Issue date Sep 6, 2022
- WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Dong Zhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board transport
- Patent number 11,363,748
- Issue date Jun 14, 2022
- Universal Instruments Corporation
- Peter Joseph Dionne
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitor with visual indicator
- Patent number 11,340,287
- Issue date May 24, 2022
- Intel Corporation
- Ramaswamy Parthasarathy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method, system and apparatus for detecting polarity of component, a...
- Patent number 11,330,705
- Issue date May 10, 2022
- VAYO (SHANGHAI) TECHNOLOGY CO., LTD.
- Shengjie Qian
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Nanowires-based transparent conductors
- Patent number 11,328,834
- Issue date May 10, 2022
- Cambrios Film Solutions Corporation
- Jonathan S. Alden
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Flexible circuit board interconnection and methods
- Patent number 11,304,308
- Issue date Apr 12, 2022
- Metrospec Technology, LLC
- Henry V. Holec
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LED lighting systems and method
- Patent number 11,266,014
- Issue date Mar 1, 2022
- Metrospec Technology, LLC
- Henry V. Holec
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD, CHIP ON FILM, DISPLAY APPARATUS AND BONDING METHOD
- Publication number 20240298403
- Publication date Sep 5, 2024
- HEFEI BOE DISPLAY TECHNOLOGY CO., LTD.
- Yunyun LIANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER MASK FAULT FIBER OPTICS SENSOR
- Publication number 20240284590
- Publication date Aug 22, 2024
- Micron Technology, Inc.
- Chan H. Yoo
- G01 - MEASURING TESTING
Information Patent Application
CIRCUIT BOARD AND ELECTRONIC DEVICE THEREOF
- Publication number 20240206050
- Publication date Jun 20, 2024
- WUHAN TIANMA MICROELECTRONICS CO., LTD.
- Xuejing XIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE
- Publication number 20240179846
- Publication date May 30, 2024
- SAMSUNG DISPLAY CO., LTD.
- MYONG-SOO OH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRETCHABLE DEVICE
- Publication number 20240147610
- Publication date May 2, 2024
- Japan Display Inc.
- Takumi SANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING CIRCUIT BOARD
- Publication number 20240114615
- Publication date Apr 4, 2024
- Nitto Denko Corporation
- Hayato TAKAKURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER CONVERTER, INTER-COMPONENT CONNECTION SYSTEM, AND INTER-COMPO...
- Publication number 20240088588
- Publication date Mar 14, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- MOTOHIKO FUJIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PCB DESIGN PROCESSES
- Publication number 20240057248
- Publication date Feb 15, 2024
- Darryl Zawada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE
- Publication number 20240032188
- Publication date Jan 25, 2024
- Samsung Electronics Co.,Ltd.
- Sun Jun KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE DEVICE
- Publication number 20240023235
- Publication date Jan 18, 2024
- InnoLux Corporation
- Yeong-E CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE
- Publication number 20230328889
- Publication date Oct 12, 2023
- SAMSUNG DISPLAY CO., LTD.
- Tae Hyun RYU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20230292432
- Publication date Sep 14, 2023
- Murata Manufacturing Co., Ltd.
- Ikuo DEGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20230276577
- Publication date Aug 31, 2023
- IBIDEN CO., LTD.
- Yasushi USAMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAYER-TO-LAYER REGISTRATION MEASUREMENT MARK
- Publication number 20230262882
- Publication date Aug 17, 2023
- International Business Machines Corporation
- Hiroyuki Mori
- G01 - MEASURING TESTING
Information Patent Application
MODULE
- Publication number 20230189429
- Publication date Jun 15, 2023
- Murata Manufacturing Co., Ltd.
- Tadashi NOMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE HAVING THE SAME
- Publication number 20230180381
- Publication date Jun 8, 2023
- Samsung Electronics Co., Ltd.
- Kanggyune Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND DISPLAY DEVICE
- Publication number 20230171880
- Publication date Jun 1, 2023
- Tianma Micro-Electronics Co., Ltd.
- Lu LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230164912
- Publication date May 25, 2023
- InnoLux Corporation
- Yeong-E CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT LOADING VERIFICATION SYSTEM AND METHOD
- Publication number 20230073170
- Publication date Mar 9, 2023
- Illinois Tool Works Inc.
- Patsy A. Mattero
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC CIRCUIT BOARD, HEAT-DISSIPATING MEMBER, AND ALUMINUM-DIAMON...
- Publication number 20230042932
- Publication date Feb 9, 2023
- DENKA COMPANY LIMITED
- Daisuke GOTO
- B32 - LAYERED PRODUCTS
Information Patent Application
LED LIGHTING SYSTEMS AND METHODS
- Publication number 20220394847
- Publication date Dec 8, 2022
- METROSPEC TECHNOLOGY, LLC
- Henry V. Holec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR VISUALLY IDENTIFYING EQUIPMENT IN A DATA CE...
- Publication number 20220330419
- Publication date Oct 13, 2022
- Dell Products L.P.
- Kannan KARUPPIAH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF VERIFYING FAULT OF INSPECTION UNIT, INSPECTION APPARATUS...
- Publication number 20220330420
- Publication date Oct 13, 2022
- KOH YOUNG TECHNOLOGY INC.
- Kwan Seong KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FLEXIBLE PRINTED BOARD AND METHOD OF PRODUCING A FLEXIBLE PRINTED B...
- Publication number 20220272829
- Publication date Aug 25, 2022
- YAZAKI CORPORATION
- Hidehiko Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220240378
- Publication date Jul 28, 2022
- FUJI CORPORATION
- Tasuku TAKEUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FIDUCIAL MARK ALLOCATION METHOD, FIDUCIAL MARK ALLOCATION DEVICE, M...
- Publication number 20220210910
- Publication date Jun 30, 2022
- FUJI CORPORATION
- Daigo KONDO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE
- Publication number 20220197069
- Publication date Jun 23, 2022
- SAMSUNG DISPLAY CO., LTD.
- Myong Soo OH
- G02 - OPTICS
Information Patent Application
PACKAGE DEVICE AND A MANUFACTURING METHOD THEREOF
- Publication number 20220167495
- Publication date May 26, 2022
- InnoLux Corporation
- Yeong-E CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSPECTION METHOD OF PRINTED WIRING BOARD
- Publication number 20220124912
- Publication date Apr 21, 2022
- IBIDEN CO., LTD.
- Yasuhiro KAWAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ORGANIC LIGHT EMITTING DIODE DISPLAY DEVICE AND METHOD OF MANUFACTU...
- Publication number 20220115365
- Publication date Apr 14, 2022
- Dong Zhan
- H01 - BASIC ELECTRIC ELEMENTS

for visual or optical inspection

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wafer level bump stack for chip scale package

Flexible printed board having improved recognition accuracy

Circuit board, semiconductor device, power converter, and moving ob...

Ceramic circuit board, heat-dissipating member, and aluminum-diamon...

Circuit board and display device

Traceability of subsequent layer structure manufacturing of main bo...

Machining station and method for controlling or identifying plateli...

Package device and manufacturing method thereof

Metal sublayer sensing in multi-layer workpiece hole drilling

Stencil printer with component loading verification system and method

Electronic apparatus and inspection method

Display device

LED lighting systems and methods

Inspection method of printed wiring board

Marking device for marking circuit boards tested by means of a test...

Anisotropic conductive film

Package device

Manufacturing apparatus for display device and method of using the...

High speed multi-directional three dimensional printer

Display device and method for manufacturing display device

Embedded circuit board and method of manufacturing same

Flexible printed circuits marked with connections to vehicle circuits

Mark recognition devices, mark recognition methods and pseudo press...

Organic light emitting diode display device and method of manufactu...

Printed circuit board transport

Capacitor with visual indicator

Method, system and apparatus for detecting polarity of component, a...

Nanowires-based transparent conductors

Flexible circuit board interconnection and methods

LED lighting systems and method

Patents Applicationslast 30 patents

CIRCUIT BOARD, CHIP ON FILM, DISPLAY APPARATUS AND BONDING METHOD

SOLDER MASK FAULT FIBER OPTICS SENSOR

CIRCUIT BOARD AND ELECTRONIC DEVICE THEREOF

DISPLAY DEVICE

STRETCHABLE DEVICE

METHOD FOR MANUFACTURING WIRING CIRCUIT BOARD

POWER CONVERTER, INTER-COMPONENT CONNECTION SYSTEM, AND INTER-COMPO...

PCB DESIGN PROCESSES

SUBSTRATE

PACKAGE DEVICE

DISPLAY DEVICE

ELECTRONIC COMPONENT

METHOD FOR MANUFACTURING WIRING SUBSTRATE

LAYER-TO-LAYER REGISTRATION MEASUREMENT MARK

MODULE

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE HAVING THE SAME

CIRCUIT BOARD AND DISPLAY DEVICE

PACKAGE DEVICE AND MANUFACTURING METHOD THEREOF

COMPONENT LOADING VERIFICATION SYSTEM AND METHOD

CERAMIC CIRCUIT BOARD, HEAT-DISSIPATING MEMBER, AND ALUMINUM-DIAMON...

LED LIGHTING SYSTEMS AND METHODS

SYSTEMS AND METHODS FOR VISUALLY IDENTIFYING EQUIPMENT IN A DATA CE...

METHOD OF VERIFYING FAULT OF INSPECTION UNIT, INSPECTION APPARATUS...

FLEXIBLE PRINTED BOARD AND METHOD OF PRODUCING A FLEXIBLE PRINTED B...

MULTILAYER CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

FIDUCIAL MARK ALLOCATION METHOD, FIDUCIAL MARK ALLOCATION DEVICE, M...

DISPLAY DEVICE

PACKAGE DEVICE AND A MANUFACTURING METHOD THEREOF

INSPECTION METHOD OF PRINTED WIRING BOARD

ORGANIC LIGHT EMITTING DIODE DISPLAY DEVICE AND METHOD OF MANUFACTU...