Formation and after-treatment of conductors

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CPC
H01L2221/1068

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00

Current Industry

H01L2221/1068Formation and after-treatment of conductors

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure havbing an enhanced E-fuse and a method mak...
- Patent number 12,243,816
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- An-Jiao Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,009,388
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Zheng-Long Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package assembly
- Patent number 11,876,065
- Issue date Jan 16, 2024
- Texas Instruments Incorporated
- Katleen Fajardo Timbol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming a colored conductive ribbon for integration in a...
- Patent number 11,876,139
- Issue date Jan 16, 2024
- SOLARCA LLC
- Lisong Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring formation method, method for manufacturing semiconductor dev...
- Patent number 11,869,866
- Issue date Jan 9, 2024
- Kioxia Corporation
- Ryoichi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,489,039
- Issue date Nov 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Zheng-Long Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
E-fuse enhancement by underlayer layout design
- Patent number 11,410,926
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- An-Jiao Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming a colored conductive ribbon for integration in a...
- Patent number 11,088,292
- Issue date Aug 10, 2021
- The Solaria Corporation
- Lisong Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective recess
- Patent number 10,658,313
- Issue date May 19, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method of fabricating lighting apparatus using organi...
- Patent number 10,505,011
- Issue date Dec 10, 2019
- LG Display Co., Ltd.
- Namkook Kim
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Package process method including disposing a die within a recess of...
- Patent number 10,224,254
- Issue date Mar 5, 2019
- Powertech Technology Inc.
- Ming-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vapor deposition unit, vapor deposition device, and vapor depositio...
- Patent number 10,100,397
- Issue date Oct 16, 2018
- SHARP KABUSHIKI KAISHA
- Yuhki Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240355821
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- YUNG-CHIN HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240290824
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Zheng-Long CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGE ASSEMBLY
- Publication number 20240153903
- Publication date May 9, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Katleen Fajardo Timbol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING A COLORED CONDUCTIVE RIBBON FOR INTEGRATION IN A...
- Publication number 20230411541
- Publication date Dec 21, 2023
- The Solaria Corporation
- Lisong Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGE ASSEMBLY
- Publication number 20230104156
- Publication date Apr 6, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Katleen Fajardo Timbol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230056697
- Publication date Feb 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Zheng-Long CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
E-Fuse Enhancement By Underlayer Layout Design
- Publication number 20220375859
- Publication date Nov 24, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- An-Jiao Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING A COLORED CONDUCTIVE RIBBON FOR INTEGRATION IN A...
- Publication number 20210336070
- Publication date Oct 28, 2021
- The Solaria Corporation
- Lisong Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE RECESS
- Publication number 20190181107
- Publication date Jun 13, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Javier A. DELACRUZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE PROCESS METHOD INCLUDING DISPOSING A DIE WITHIN A RECESS OF...
- Publication number 20180315674
- Publication date Nov 1, 2018
- Powertech Technology Inc.
- Ming-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD OF FABRICATING LIGHTING APPARATUS USING ORGANI...
- Publication number 20180151687
- Publication date May 31, 2018
- LG Display Co., Ltd.
- Namkook KIM
- H01 - BASIC ELECTRIC ELEMENTS

Formation and after-treatment of conductors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor structure havbing an enhanced E-fuse and a method mak...

Semiconductor device and manufacturing method thereof

Flip chip package assembly

Methods of forming a colored conductive ribbon for integration in a...

Wiring formation method, method for manufacturing semiconductor dev...

Semiconductor device and manufacturing method thereof

E-fuse enhancement by underlayer layout design

Methods of forming a colored conductive ribbon for integration in a...

Selective recess

Apparatus and method of fabricating lighting apparatus using organi...

Package process method including disposing a die within a recess of...

Vapor deposition unit, vapor deposition device, and vapor depositio...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

FLIP CHIP PACKAGE ASSEMBLY

METHODS OF FORMING A COLORED CONDUCTIVE RIBBON FOR INTEGRATION IN A...

FLIP CHIP PACKAGE ASSEMBLY

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

E-Fuse Enhancement By Underlayer Layout Design

METHODS OF FORMING A COLORED CONDUCTIVE RIBBON FOR INTEGRATION IN A...

SELECTIVE RECESS

PACKAGE PROCESS METHOD INCLUDING DISPOSING A DIE WITHIN A RECESS OF...

APPARATUS AND METHOD OF FABRICATING LIGHTING APPARATUS USING ORGANI...