formation by a deposition process

Industry

CPC
H01L21/0226

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/0226formation by a deposition process

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
SiC semiconductor substrate, and, production method therefor and pr...
- Patent number 12,237,377
- Issue date Feb 25, 2025
- Kwansei Gakuin Educational Foundation
- Tadaaki Kaneko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus and method for manufacturing...
- Patent number 12,224,199
- Issue date Feb 11, 2025
- Mitsubishi Electric Corporation
- Takafumi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SOI substrate and related methods
- Patent number 12,211,784
- Issue date Jan 28, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Mark Griswold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition system and method
- Patent number 12,198,927
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Hsi Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and formation method thereof
- Patent number 12,191,145
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Che Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Actively clamped carrier assembly for processing tools
- Patent number 12,191,186
- Issue date Jan 7, 2025
- Applied Materials, Inc.
- Benjamin B. Riordon
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Multi process air gap formation
- Patent number 12,183,627
- Issue date Dec 31, 2024
- Applied Materials, Inc.
- John Hautala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,183,832
- Issue date Dec 31, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Kengo Akimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and chamber for backside physical vapor deposition
- Patent number 12,176,205
- Issue date Dec 24, 2024
- Applied Materials, Inc.
- Chunming Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an interconnect structure having an air gap and s...
- Patent number 12,159,838
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heating platform, thermal treatment and manufacturing method
- Patent number 12,142,497
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiao-Hua Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronic device
- Patent number 12,142,522
- Issue date Nov 12, 2024
- Mitsui Chemicals Tohcello, Inc.
- Toru Miura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and chamber for backside physical vapor deposition
- Patent number 12,142,478
- Issue date Nov 12, 2024
- Applied Materials, Inc.
- Chunming Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing electronic structures
- Patent number 12,136,632
- Issue date Nov 5, 2024
- Pragmatic Printing Ltd
- Richard Price
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 12,136,663
- Issue date Nov 5, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method forming the same
- Patent number 12,131,973
- Issue date Oct 29, 2024
- Vanguard International Semiconductor Corporation
- Hsiu-Mei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of metal vias on metal lines
- Patent number 12,113,020
- Issue date Oct 8, 2024
- Applied Materials, Inc.
- Ryan Scott Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film stack simplification for high aspect ratio patterning and vert...
- Patent number 12,080,592
- Issue date Sep 3, 2024
- Lam Research Corporation
- Hui-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-situ film growth rate monitoring apparatus, systems, and methods...
- Patent number 12,077,880
- Issue date Sep 3, 2024
- Applied Materials, Inc.
- Zhepeng Cong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device having an extra low-k dielectric layer and met...
- Patent number 12,062,613
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Cheng Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level sequencing flow cell fabrication
- Patent number 12,057,309
- Issue date Aug 6, 2024
- MGI Tech Co., Ltd.
- Shifeng Li
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Method for forming components without adding tabs during etching
- Patent number 12,044,965
- Issue date Jul 23, 2024
- Hutchinson Technology Incorporated
- Clark T. Olsen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Capacitor, semiconductor device, and manufacturing method of semico...
- Patent number 12,041,765
- Issue date Jul 16, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Yuichi Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and ion beam irradiati...
- Patent number 12,040,155
- Issue date Jul 16, 2024
- Kioxia Corporation
- Junichi Hashimoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming carbon rich silicon-containing films
- Patent number 12,037,681
- Issue date Jul 16, 2024
- Entegris, Inc.
- Sungsil Cho
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Chip package, method of forming a chip package and method of formin...
- Patent number 12,033,972
- Issue date Jul 9, 2024
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming material within openings extending into a semico...
- Patent number 12,020,979
- Issue date Jun 25, 2024
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Microelectronic devices with nitrogen-rich insulative structures
- Patent number 12,004,346
- Issue date Jun 4, 2024
- Micron Technology, Inc.
- Swapnil Lengade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cryogenic atomic layer etch with noble gases
- Patent number 11,996,294
- Issue date May 28, 2024
- Applied Materials, Inc.
- Alvaro Garcia De Gorordo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Optoelectronic device including a superlattice
- Patent number 11,990,338
- Issue date May 21, 2024
- SILANNA UV TECHNOLOGIES PTE LTD
- Petar Atanackovic
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
GALLIUM NITRIDE-BASED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTU...
- Publication number 20250079257
- Publication date Mar 6, 2025
- Japan Display Inc.
- Masanobu IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING AN INTERCONNECT STRUCTURE HAVING AN AIR GAP AND S...
- Publication number 20250070027
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR SEPARATING SEMICONDUCTOR DEVICES USING SINGULATION GROO...
- Publication number 20250029878
- Publication date Jan 23, 2025
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250022766
- Publication date Jan 16, 2025
- Vanguard International Semiconductor Corporation
- Hsiu-Mei YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER DEPOSITION SEAM REDUCTION
- Publication number 20250014893
- Publication date Jan 9, 2025
- LAM RESEARCH CORPORATION
- Douglas Walter Agnew
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR PROCESSING EQUIPMENT PART AND METHOD FOR MAKING THE SAME
- Publication number 20240420951
- Publication date Dec 19, 2024
- FENG CHIA UNIVERSITY
- Chang-Ho YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU FILM GROWTH RATE MONITORING APPARATUS, SYSTEMS, AND METHODS...
- Publication number 20240410078
- Publication date Dec 12, 2024
- Applied Materials, Inc.
- Zhepeng CONG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROOPTICAL DEVICE AND METHOD FOR PRODUCING AN ELECTROOPTICAL DE...
- Publication number 20240411158
- Publication date Dec 12, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Florian DUPONT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM STACK SIMPLIFICATION FOR HIGH ASPECT RATIO PATTERNING AND VERT...
- Publication number 20240387258
- Publication date Nov 21, 2024
- LAM RESEARCH CORPORATION
- Hui-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATING PLATFORM, THERMAL TREATMENT AND MANUFACTURING METHOD
- Publication number 20240387203
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao-Hua Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING INTEGRATED INTEGRATED CIRCUIT MEDICAL DEVICES
- Publication number 20240382158
- Publication date Nov 21, 2024
- Vactronix Scientific, Inc.
- Scott P. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ohmic Contact for Semiconductor Structures
- Publication number 20240379360
- Publication date Nov 14, 2024
- Shiva RAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING AN EXTRA LOW-K DIELECTRIC LAYER AND MET...
- Publication number 20240371769
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Cheng SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Material Within Openings Extending into a Semico...
- Publication number 20240297068
- Publication date Sep 5, 2024
- Micron Technology, Inc.
- Gurtej S. Sandhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DLC FILM DEPOSITION APPARATUS, SEMICONDUCTOR MANUFACTURING SYSTEM I...
- Publication number 20240287668
- Publication date Aug 29, 2024
- Samsung Electronics Co., Ltd.
- Se Jun PARK
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS AND MATERIAL DEPOSITION SYSTEMS FOR FORMING SEMICONDUCTOR L...
- Publication number 20240282574
- Publication date Aug 22, 2024
- Silanna UV Technologies Pte Ltd
- Petar Atanackovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ELONGATED PATTERN
- Publication number 20240274471
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Chin CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF GLASS DEPOSITION FOR SEMICONDUCTOR DEVICE FABRICATION
- Publication number 20240258099
- Publication date Aug 1, 2024
- Littelfuse Semiconductor (Wuxi) Co., Ltd
- Xingchong Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL NITRIDE FERROELECTRONICS
- Publication number 20240242963
- Publication date Jul 18, 2024
- The Regents of the University of Michigan
- Zetian Mi
- C30 - CRYSTAL GROWTH
Information Patent Application
CRYSTALLINE STRONTIUM TITANATE (STO) AND METHOD FOR DEPOSITION OF T...
- Publication number 20240242964
- Publication date Jul 18, 2024
- SUPERQ TECHNOLOGIES INDIA PRIVATE LIMITED
- SUBHASH KANNAPPA MANOHARAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SINGLE CRYSTAL SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING...
- Publication number 20240234135
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Junhee CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND RELATED FABRICATION METHOD
- Publication number 20240234370
- Publication date Jul 11, 2024
- Wolfspeed, Inc.
- Shadi Sabri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING HIGH VOLTAGE TRANSISTOR AND STRUCTURE RESULTING T...
- Publication number 20240234566
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- LING MEI LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING SEMICONDUCTOR DEVICES USING MODIFIED PHOTOMASK...
- Publication number 20240222118
- Publication date Jul 4, 2024
- TOKYO ELECTRON LIMITED
- Peng WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES WITH NITROGEN-RICH INSUL...
- Publication number 20240215246
- Publication date Jun 27, 2024
- Micron Technology, Inc.
- Swapnil A. Lengade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240204104
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wan-Yi Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI SUBSTRATE AND RELATED METHODS
- Publication number 20240203864
- Publication date Jun 20, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Mark GRISWOLD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Conductive Material Deposition
- Publication number 20240178003
- Publication date May 30, 2024
- TOKYO ELECTRON LIMITED
- Hirokazu Aizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION
- Publication number 20240162172
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CLEANING USING PLASMA-FREE PRECURSORS
- Publication number 20240145230
- Publication date May 2, 2024
- Applied Materials, Inc.
- Abhishek Mandal
- H01 - BASIC ELECTRIC ELEMENTS

formation by a deposition process

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

SiC semiconductor substrate, and, production method therefor and pr...

Semiconductor manufacturing apparatus and method for manufacturing...

SOI substrate and related methods

Deposition system and method

Semiconductor device and formation method thereof

Actively clamped carrier assembly for processing tools

Multi process air gap formation

Semiconductor device and manufacturing method thereof

Method and chamber for backside physical vapor deposition

Method of forming an interconnect structure having an air gap and s...

Heating platform, thermal treatment and manufacturing method

Method for manufacturing electronic device

Method and chamber for backside physical vapor deposition

Methods of manufacturing electronic structures

Semiconductor device and manufacturing method of semiconductor device

Semiconductor device and method forming the same

Formation of metal vias on metal lines

Film stack simplification for high aspect ratio patterning and vert...

In-situ film growth rate monitoring apparatus, systems, and methods...

Semiconductor device having an extra low-k dielectric layer and met...

Wafer level sequencing flow cell fabrication

Method for forming components without adding tabs during etching

Capacitor, semiconductor device, and manufacturing method of semico...

Method of manufacturing semiconductor device and ion beam irradiati...

Method for forming carbon rich silicon-containing films

Chip package, method of forming a chip package and method of formin...

Methods of forming material within openings extending into a semico...

Microelectronic devices with nitrogen-rich insulative structures

Cryogenic atomic layer etch with noble gases

Optoelectronic device including a superlattice

Patents Applicationslast 30 patents

GALLIUM NITRIDE-BASED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTU...

METHOD OF FORMING AN INTERCONNECT STRUCTURE HAVING AN AIR GAP AND S...

METHODS FOR SEPARATING SEMICONDUCTOR DEVICES USING SINGULATION GROO...

SEMICONDUCTOR DEVICE

ATOMIC LAYER DEPOSITION SEAM REDUCTION

SEMICONDUCTOR PROCESSING EQUIPMENT PART AND METHOD FOR MAKING THE SAME

IN-SITU FILM GROWTH RATE MONITORING APPARATUS, SYSTEMS, AND METHODS...

ELECTROOPTICAL DEVICE AND METHOD FOR PRODUCING AN ELECTROOPTICAL DE...

FILM STACK SIMPLIFICATION FOR HIGH ASPECT RATIO PATTERNING AND VERT...

HEATING PLATFORM, THERMAL TREATMENT AND MANUFACTURING METHOD

METHOD OF MAKING INTEGRATED INTEGRATED CIRCUIT MEDICAL DEVICES

Ohmic Contact for Semiconductor Structures

SEMICONDUCTOR DEVICE HAVING AN EXTRA LOW-K DIELECTRIC LAYER AND MET...

Methods of Forming Material Within Openings Extending into a Semico...

DLC FILM DEPOSITION APPARATUS, SEMICONDUCTOR MANUFACTURING SYSTEM I...

METHODS AND MATERIAL DEPOSITION SYSTEMS FOR FORMING SEMICONDUCTOR L...

SEMICONDUCTOR DEVICE WITH ELONGATED PATTERN

METHOD OF GLASS DEPOSITION FOR SEMICONDUCTOR DEVICE FABRICATION

EPITAXIAL NITRIDE FERROELECTRONICS

CRYSTALLINE STRONTIUM TITANATE (STO) AND METHOD FOR DEPOSITION OF T...

SINGLE CRYSTAL SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING...

SEMICONDUCTOR DEVICE AND RELATED FABRICATION METHOD

METHOD OF FORMING HIGH VOLTAGE TRANSISTOR AND STRUCTURE RESULTING T...

METHODS FOR FORMING SEMICONDUCTOR DEVICES USING MODIFIED PHOTOMASK...

METHODS OF FORMING MICROELECTRONIC DEVICES WITH NITROGEN-RICH INSUL...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

SOI SUBSTRATE AND RELATED METHODS

Method of Conductive Material Deposition

SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION

SEMICONDUCTOR CLEANING USING PLASMA-FREE PRECURSORS