formation by nitridation

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CPC
H01L21/02247

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/02247formation by nitridation

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Cyclic low temperature film growth processes
- Patent number 12,176,204
- Issue date Dec 24, 2024
- Tokyo Electron Limited
- Jianping Zhao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing semiconductor device including isolation st...
- Patent number 12,154,821
- Issue date Nov 26, 2024
- NANYA TECHNOLOGY CORPORATION
- Ying-Cheng Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for etching metal films using plasma processing
- Patent number 12,057,322
- Issue date Aug 6, 2024
- Tokyo Electron Limited
- Nicholas Joy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing semiconductor...
- Patent number 12,046,478
- Issue date Jul 23, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Luguang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated top via interconnects
- Patent number 12,040,230
- Issue date Jul 16, 2024
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method of low temperature thin film deposition and in-si...
- Patent number 12,018,374
- Issue date Jun 25, 2024
- DSGI Technologies, Inc.
- Jeffrey Edward Kowalski
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Treatments to enhance material structures
- Patent number 11,961,734
- Issue date Apr 16, 2024
- Applied Materials, Inc.
- Srinivas Gandikota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Treatments to enhance material structures
- Patent number 11,955,332
- Issue date Apr 9, 2024
- Applied Materials, Inc.
- Srinivas Gandikota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming stacked layers and devices formed thereof
- Patent number 11,942,363
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating fin structure for fin field effect transistor
- Patent number 11,862,727
- Issue date Jan 2, 2024
- United Microelectronics Corp.
- Hao Che Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming oxide layer on a doped substrate using nitridatio...
- Patent number 11,862,461
- Issue date Jan 2, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Tzung-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus, method of manufacturing semiconduct...
- Patent number 11,837,440
- Issue date Dec 5, 2023
- Kokusai Electric Corporation
- Takeshi Yasui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for seamless gap filling of dielectric material
- Patent number 11,830,728
- Issue date Nov 28, 2023
- Applied Materials, Inc.
- Chengyu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor devices
- Patent number 11,800,701
- Issue date Oct 24, 2023
- Samsung Electronics Co., Ltd.
- Ho Kyun An
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,777,030
- Issue date Oct 3, 2023
- Rohm Co., Ltd.
- Shuhei Mitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned inner spacer on gate-all-around structure and methods...
- Patent number 11,749,742
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsungyu Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin field-effect transistor device and method
- Patent number 11,735,430
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yin Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-k dielectric damage prevention
- Patent number 11,699,618
- Issue date Jul 11, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Yi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing of foreign oxide or foreign nitride on semiconductor
- Patent number 11,646,193
- Issue date May 9, 2023
- TURUN YLIOPISTO
- Mikhail Kuzmin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming memory device
- Patent number 11,637,017
- Issue date Apr 25, 2023
- Powerchip Semiconductor Manufacturing Corporation
- Wen Chung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing of foreign oxide or foreign nitride on semiconductor
- Patent number 11,615,952
- Issue date Mar 28, 2023
- TURUN YLIOPISTO
- Mikhail Kuzmin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,610,992
- Issue date Mar 21, 2023
- Rohm Co., Ltd.
- Shuhei Mitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cyclic low temperature film growth processes
- Patent number 11,605,536
- Issue date Mar 14, 2023
- Tokyo Electron Limited
- Jianping Zhao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
FinFET devices and methods of forming
- Patent number 11,594,618
- Issue date Feb 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin structure for fin field effect transistor and method for fabric...
- Patent number 11,581,438
- Issue date Feb 14, 2023
- United Microelectronics Corp.
- Hao Che Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for selective nitridation process
- Patent number 11,581,408
- Issue date Feb 14, 2023
- Applied Materials, Inc.
- Matthew Scott Rogers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an etch stop layer and an inter-layer diele...
- Patent number 11,522,062
- Issue date Dec 6, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shahaji B. More
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor devices
- Patent number 11,430,794
- Issue date Aug 30, 2022
- Samsung Electronics Co., Ltd.
- Ho Kyun An
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and method of forming the same
- Patent number 11,424,340
- Issue date Aug 23, 2022
- Powerchip Semiconductor Manufacturing Corporation
- Wen Chung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Treatments to enhance material structures
- Patent number 11,417,517
- Issue date Aug 16, 2022
- Applied Materials, Inc.
- Srinivas Gandikota
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH-PRESSURE WAFER PROCESSING METHOD USING DUAL HIGH-PRESSURE WAFE...
- Publication number 20250014928
- Publication date Jan 9, 2025
- HPSP Co., Ltd.
- Sung Kil CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PATTERNING ELEMENTAL METALS
- Publication number 20240429065
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Jane P. Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DENSIFIED SEAM-FREE SILICON-CONTAINING MATERIAL GAP FILL PROCESSES
- Publication number 20240420950
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Xiang Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING NITRIDE SEMICONDUCTOR SUBSTRATE
- Publication number 20240371628
- Publication date Nov 7, 2024
- Shin-Etsu Handotai Co., Ltd.
- Kazunori HAGIMOTO
- C30 - CRYSTAL GROWTH
Information Patent Application
FILM FORMATION METHOD AND PLASMA PROCESSING METHOD
- Publication number 20240355616
- Publication date Oct 24, 2024
- Hitachi High-Tech Corporation
- Kiyohiko SATOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL AND SELECTIVE SIN DEPOSITION
- Publication number 20240290612
- Publication date Aug 29, 2024
- Applied Materials, Inc.
- Zeqing SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TREATMENTS TO ENHANCE MATERIAL STRUCTURES
- Publication number 20240266163
- Publication date Aug 8, 2024
- Applied Materials, Inc.
- Srinivas GANDIKOTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Forming Stacked Layers and Devices Formed Thereof
- Publication number 20240243011
- Publication date Jul 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20240194476
- Publication date Jun 13, 2024
- Kokusai Electric Corporation
- Yasutoshi TSUBOTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIN GAP FILL VIA NUCLEATION INHIBITION
- Publication number 20240145235
- Publication date May 2, 2024
- Applied Materials, Inc.
- Zeqing SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE OXIDATION OF A SUBSTRATE
- Publication number 20240112903
- Publication date Apr 4, 2024
- Applied Materials, Inc.
- Hansel Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STABILIZING DIELECTRIC STRESS IN A GALVANIC ISOLATION DEVICE
- Publication number 20240113095
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Yoshihiro Takei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20240105423
- Publication date Mar 28, 2024
- Kokusai Electric Corporation
- Takeshi Yasui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230395713
- Publication date Dec 7, 2023
- Rohm Co., Ltd.
- Shuhei MITANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED INNER SPACER ON GATE-ALL-AROUND STRUCTURE AND METHODS...
- Publication number 20230387253
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Tsungyu Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20230360904
- Publication date Nov 9, 2023
- Kokusai Electric Corporation
- Tomiyuki SHIMIZU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MAINTENANCE METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, N...
- Publication number 20230317438
- Publication date Oct 5, 2023
- Kokusai Electric Corporation
- Teruo YOSHINO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20230307308
- Publication date Sep 28, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Qing LUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20230207315
- Publication date Jun 29, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- TZUNG-HAN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIGATE DEVICE STRUCTURE WITH ENGINEERED CLADDING AND METHOD MAKI...
- Publication number 20230178418
- Publication date Jun 8, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Wen SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NH RADICAL THERMAL NITRIDATION TO FORM METAL SILICON NITRIDE FILMS
- Publication number 20230178365
- Publication date Jun 8, 2023
- Applied Materials, Inc.
- Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCALED LINER LAYER FOR ISOLATION STRUCTURE
- Publication number 20230178419
- Publication date Jun 8, 2023
- Applied Materials, Inc.
- Benjamin COLOMBEAU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cyclic Low Temperature Film Growth Processes
- Publication number 20230154745
- Publication date May 18, 2023
- Tokyo Electron Limited
- Jianping Zhao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR...
- Publication number 20230154748
- Publication date May 18, 2023
- Shin-Etsu Handotai Co., Ltd.
- Miho NIITANI
- C30 - CRYSTAL GROWTH
Information Patent Application
METHOD FOR FABRICATING FIN STRUCTURE FOR FIN FIELD EFFECT TRANSISTOR
- Publication number 20230135072
- Publication date May 4, 2023
- United Microelectronics Corp.
- Hao Che Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING WITH TUNABLE NITRIDATION
- Publication number 20230127138
- Publication date Apr 27, 2023
- Applied Materials, Inc.
- Wei LIU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR SEAMLESS GAP FILLING OF DIELECTRIC MATERIAL
- Publication number 20230113965
- Publication date Apr 13, 2023
- Chengyu LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20230093981
- Publication date Mar 30, 2023
- Kokusai Electric Corporation
- Katsuyoshi HARADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE...
- Publication number 20230010649
- Publication date Jan 12, 2023
- TOKYO ELECTRON LIMITED
- Tatsuya YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR...
- Publication number 20230010594
- Publication date Jan 12, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Luguang WANG
- H01 - BASIC ELECTRIC ELEMENTS

formation by nitridation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Cyclic low temperature film growth processes

Method of manufacturing semiconductor device including isolation st...

Methods for etching metal films using plasma processing

Semiconductor structure and method for manufacturing semiconductor...

Encapsulated top via interconnects

System and method of low temperature thin film deposition and in-si...

Treatments to enhance material structures

Treatments to enhance material structures

Methods for forming stacked layers and devices formed thereof

Method for fabricating fin structure for fin field effect transistor

Method of forming oxide layer on a doped substrate using nitridatio...

Substrate processing apparatus, method of manufacturing semiconduct...

Methods for seamless gap filling of dielectric material

Method for fabricating semiconductor devices

Semiconductor device

Self-aligned inner spacer on gate-all-around structure and methods...

Fin field-effect transistor device and method

Low-k dielectric damage prevention

Manufacturing of foreign oxide or foreign nitride on semiconductor

Method of forming memory device

Manufacturing of foreign oxide or foreign nitride on semiconductor

Semiconductor device

Cyclic low temperature film growth processes

FinFET devices and methods of forming

Fin structure for fin field effect transistor and method for fabric...

Method and apparatus for selective nitridation process

Method of manufacturing an etch stop layer and an inter-layer diele...

Method for fabricating semiconductor devices

Memory device and method of forming the same

Treatments to enhance material structures

Patents Applicationslast 30 patents

HIGH-PRESSURE WAFER PROCESSING METHOD USING DUAL HIGH-PRESSURE WAFE...

METHOD OF PATTERNING ELEMENTAL METALS

DENSIFIED SEAM-FREE SILICON-CONTAINING MATERIAL GAP FILL PROCESSES

METHOD FOR MANUFACTURING NITRIDE SEMICONDUCTOR SUBSTRATE

FILM FORMATION METHOD AND PLASMA PROCESSING METHOD

CONFORMAL AND SELECTIVE SIN DEPOSITION

TREATMENTS TO ENHANCE MATERIAL STRUCTURES

Methods for Forming Stacked Layers and Devices Formed Thereof

METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...

SIN GAP FILL VIA NUCLEATION INHIBITION

SELECTIVE OXIDATION OF A SUBSTRATE

STABILIZING DIELECTRIC STRESS IN A GALVANIC ISOLATION DEVICE

SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCT...

SEMICONDUCTOR DEVICE

SELF-ALIGNED INNER SPACER ON GATE-ALL-AROUND STRUCTURE AND METHODS...

METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...

MAINTENANCE METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, N...

SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE

MULTIGATE DEVICE STRUCTURE WITH ENGINEERED CLADDING AND METHOD MAKI...

NH RADICAL THERMAL NITRIDATION TO FORM METAL SILICON NITRIDE FILMS

SCALED LINER LAYER FOR ISOLATION STRUCTURE

Cyclic Low Temperature Film Growth Processes

METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR...

METHOD FOR FABRICATING FIN STRUCTURE FOR FIN FIELD EFFECT TRANSISTOR

PLASMA PROCESSING WITH TUNABLE NITRIDATION

METHODS FOR SEAMLESS GAP FILLING OF DIELECTRIC MATERIAL

METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE...

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR...